AMD XCV1000E-6FG900I

Overview

XCV1000E-6FG900I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1,569,178 system gates, 27,648 logic cells, and 660 user I/O pins in a 900-ball Fine-Pitch Ball Grid Array (FG900) package. It features eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV1000E-6FG900I datasheet, pinout, applications, or equivalent options, this device is selected for high-density, high-performance reconfigurable logic in telecom line cards, protocol accelerators, and real-time signal processing where deterministic clock management and multi-standard I/O are critical.

Technical Context

The XCV1000E-6FG900I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and LVPECL-with banked VCCO and VREF constraints. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control across multiple voltage domains.

Key Specifications

Pinout & Package

Package: 900-ball Fine-Pitch Ball Grid Array (FG900), 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV1000E-7FG900I, the XCV1000E-6FG900I trades 10% speed margin for lower power and cost; compared with XCV1000E-6FG680C, it adds 148 I/O pins and industrial temperature rating-making it optimal for deployed telecom and industrial systems requiring robustness and scalability.

Availability

XCV1000E-6FG900I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and high-end video processing requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature operation.

Supply support for XCV1000E-6FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software tools for hardware acceleration and system-level design.

The Virtex-E family was designed for high-performance, high-density reconfigurable computing in wireline communications, military/aerospace, and industrial control-emphasizing speed, I/O flexibility, and deterministic timing over cost-optimized logic density.

FAQ

What is the maximum operating frequency of the XCV1000E-6FG900I?

The XCV1000E-6FG900I achieves synchronous system clock rates up to 240 MHz with worst-case timing closure, supported by its -6 speed grade (4.3 ns register-to-register delay). Internal logic can operate above 311 MHz in optimized designs, and LVDS I/O supports data rates up to 622 Mb/s using source-synchronous architectures. These values are verified in DS022-3 (DC and Switching Characteristics, Module 3).

Does the XCV1000E-6FG900I support JTAG configuration?

Yes, the XCV1000E-6FG900I supports IEEE 1149.1 boundary-scan testing and configuration via JTAG mode using TCK, TMS, TDI, and TDO pins. This enables in-system programming, debug visibility, and manufacturing test without requiring external configuration PROMs. JTAG is one of four supported configuration modes, alongside Master Serial, Slave Serial, and SelectMAP™.

How many block RAMs does the XCV1000E-6FG900I contain?

The XCV1000E-6FG900I contains 96 block SelectRAM modules, totaling 393,216 bits of synchronous, true dual-port memory. Each block is 4096 bits and configurable as independent read/write ports with programmable data widths-supporting applications such as FIFOs, frame buffers, and lookup tables without consuming CLB resources.

Is the XCV1000E-6FG900I pin-compatible with other Virtex-E devices in FG900 packaging?

Yes, the XCV1000E-6FG900I shares the same FG900 package footprint and pinout with other Virtex-E devices offered in that package, including XCV600E-6FG900I and XCV1600E-6FG900I. However, I/O bank assignments, VCCO/VREF pin allocations, and usable I/O counts differ across densities-requiring board-level validation when migrating between densities.

What I/O standards are supported by the XCV1000E-6FG900I?

The XCV1000E-6FG900I supports 20 I/O standards via SelectI/O+ technology, including LVTTL, LVCMOS18/25, SSTL3/I-II, HSTL I/III/IV, LVDS, BLVDS, LVPECL, GTL/GTL+, PCI33_3/PCI66_3, and CTT. Standards are grouped by I/O bank, with VCCO and VREF constraints dictating compatible combinations within each bank per DS022-2 Table 1 and Table 2.