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AMD XCV1000E-6HQ240C
- Part No.:
- XCV1000E-6HQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP Exposed Pad
- Datasheet:
-
XCV1000E-6HQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,595
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Product details
Overview
XCV1000E-6HQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 1.57 million system gates, 27,648 logic cells, and 660 user I/O pins in a 240-pin High Heat Dissipation (HQ) BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communications and signal processing applications.
For engineers reviewing the XCV1000E-6HQ240C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-performance reconfigurable logic solution for telecom infrastructure, test equipment, and embedded vision systems requiring deterministic timing, differential I/O, and on-chip memory hierarchy.
Technical Context
The XCV1000E-6HQ240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice - enabling high-speed arithmetic and pipelined logic.
Its IOBs support 20 interface standards including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL, with banked VCCO/VREF domains and programmable drive strength (up to 24 mA source / 48 mA sink). Eight DLLs provide zero-delay clock distribution, 50% duty-cycle correction for DDR, and frequency multiplication up to 4×.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1.57 million - defines total logic capacity for complex digital systems like protocol stacks or video pipelines. |
| Logic Cells | 27,648 - provides granular, routable logic resources for synthesizing RTL with predictable timing closure. |
| User I/O Pins | 660 - enables high-bandwidth parallel interfaces (e.g., DDR SDRAM, ZBT SRAM, or multi-lane data acquisition). |
| Block RAM Bits | 393,216 - delivers true dual-port synchronous memory for FIFOs, frame buffers, or coefficient storage without external RAM. |
| DLL Count | 8 - allows independent clock domain management for multiple high-speed interfaces (e.g., LVDS SerDes + PCI + DDR). |
| Max I/O Speed | 622 Mb/s (LVDS) - supports source-synchronous data capture at OC-12/STM-4 rates or high-resolution ADC/DAC interfacing. |
| Internal Performance | 130 MHz (4-LUT levels) - ensures sub-8 ns register-to-register paths for real-time control loops or packet forwarding engines. |
| VCCINT Supply | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, critical for thermally constrained telecom line cards and embedded modules. |
Pinout & Package
Package: 240-pin High Heat Dissipation (HQ) Ball Grid Array (BGA), 1.27 mm pitch, RoHS-compliant, thermal pad exposed on bottom for enhanced heat dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Inputs | Dedicated low-skew inputs for DLL reference clocks; support LVPECL/LVDS up to 300+ MHz. |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; requires tight regulation (±3%) and local decoupling. |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O (e.g., 3.3 V PCI + 1.8 V LVCMOS on same device). |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/GTL input receivers; must be stable ±1% for timing margin. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for in-system programming and production verification. |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence. |
| INIT_B | Configuration Status | Open-drain output indicating configuration status; pulled high externally when configuration completes successfully. |
| CCLK | Configuration Clock | Input clock for master serial configuration mode; frequency ≤ 50 MHz determines bitstream load time. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI) with programmable drive/slew - eliminates level-shifter ICs in mixed-signaling systems. |
| SelectRAM+™ Memory Hierarchy | 393,216-bit block RAM + 393,216-bit distributed RAM - enables on-chip buffering for video frame stores or packet buffers without external memory latency. |
| SelectLink™ DDR Interface | Double Data Rate link between FPGA fabric and external memory controllers - doubles effective bandwidth for DDR SDRAM/ZBT SRAM interfaces. |
| Digital Delay-Locked Loops (DLLs) | Eight fully digital DLLs with 4× multiplication and duty-cycle correction - replaces external clock synthesizers for DDR clocking and jitter cleanup. |
| Die Temperature Sensor | On-die diode sensor with analog output - enables real-time thermal monitoring for fan control or throttling in telecom baseband units. |
| SRAM-Based In-System Reconfigurability | Unlimited reprogramming via JTAG, SelectMAP, or slave serial - supports field-upgradable protocols and adaptive signal processing algorithms. |
Applications
| Telecom Line Card Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time packet classification, header parsing, and QoS enforcement in 10 GbE or SONET/SDH line cards. IC Role / Device Role / Timing Role: Configurable datapath engine implementing custom state machines and parallel match logic with deterministic <8 ns register-to-register timing. Use Value: 660 I/O and LVDS support enable direct connection to multiple SerDes PHYs and backplane buses, reducing interposer complexity and board area. |
Use Scenario: Multi-channel digital pattern generation and acquisition in ATE systems requiring synchronized 200+ MHz sampling. IC Role / Device Role / Timing Role: Timing controller and waveform sequencer with precise clock domain crossing between LVDS stimulus and capture channels. Use Value: Eight DLLs allow independent phase alignment of up to eight high-speed clocks (e.g., 311 MHz sampling + 155 MHz reference), eliminating external clock trees. |
| Embedded Vision Preprocessing | Radar Signal Processing |
Use Scenario: Real-time Bayer demosaicing, noise reduction, and edge enhancement for industrial camera modules. IC Role / Device Role / Timing Role: Pixel pipeline accelerator with pipelined LUT-based filters and on-chip frame buffering using distributed and block RAM. Use Value: 393,216-bit block RAM configured as dual-port FIFOs enables seamless streaming between sensor interface (LVDS) and host processor (PCI). |
Use Scenario: Pulse compression and Doppler FFT in airborne radar front-ends requiring low-latency, fixed-point computation. IC Role / Device Role / Timing Role: High-throughput arithmetic unit leveraging dedicated carry chains and multiplier support for 16×16 MAC operations. Use Value: 27,648 logic cells and 130 MHz internal performance sustain >1 GOPS throughput for real-time beamforming kernels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000E-7HQ240C | Higher speed grade (-7 vs. -6): 10–15% faster timing closure; identical pinout, package, and feature set. | Suitable for designs requiring tighter setup/hold margins or higher clock frequencies (>130 MHz internal). | Select when targeting worst-case timing at 133+ MHz or when migrating from -6 to meet increased performance demands. |
| XCV1000E-6FG860C | Different package: 860-pin Fine-Pitch BGA (FG) with 660 I/O but superior thermal and electrical performance; larger footprint and higher cost. | Better suited for high-power, high-I/O-count applications where thermal headroom and signal integrity outweigh PCB area constraints. | Choose for new designs needing maximum I/O bandwidth and thermal headroom; not drop-in compatible due to different package and pin mapping. |
Compared with XCV1000E-6HQ240C, the -7 speed grade offers verified timing margin uplift without layout change, while the FG860 variant trades compactness for enhanced thermal dissipation and routing flexibility - making the HQ240 optimal for space-constrained, thermally managed telecom modules.
Availability
XCV1000E-6HQ240C is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, embedded vision, and radar signal processing applications requiring stable component supply across extended product lifecycles.
Supply support for XCV1000E-6HQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and ACAP solutions for high-performance computing, networking, and adaptive hardware acceleration.
The Virtex-E family was designed for high-speed, high-density reconfigurable logic in mission-critical infrastructure - emphasizing I/O flexibility, on-chip memory, and deterministic timing for telecom, defense, and instrumentation systems.
FAQ
What is the maximum LVDS data rate supported by the XCV1000E-6HQ240C?
The XCV1000E-6HQ240C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate enables OC-12/STM-4 interface compliance and high-speed ADC/DAC interfacing. The device's DLLs and I/O calibration circuitry ensure reliable capture at this rate under worst-case voltage and temperature conditions.
Does the XCV1000E-6HQ240C support PCI 66 MHz operation?
Yes, the XCV1000E-6HQ240C is PCI 3.3 V compliant and supports both 33 MHz and 66 MHz bus operation, as stated in DS022-1 (v2.3) "Features" section. Its I/O buffers meet PCI specification timing and drive requirements, and its 660-user I/O count allows full 64-bit address/data multiplexing with control signals.
How many block RAMs does the XCV1000E-6HQ240C contain?
The XCV1000E-6HQ240C contains 96 block RAMs totaling 393,216 bits, as specified in Table 4 of DS022-2 (v2.8). Each block is a true dual-port 4096-bit RAM with independent read/write addressing - enabling simultaneous access for ping-pong buffering or coefficient lookup in DSP applications.
Is the XCV1000E-6HQ240C pin-compatible with other Virtex-E devices in the HQ240 package?
No - the XCV1000E-6HQ240C has a unique pinout within the HQ240 package. While XCV50E through XCV600E share HQ240, the XCV1000E uses all 660 I/Os mapped across the 240-ball grid, requiring distinct PCB layout. Pin compatibility is only guaranteed within the same device density and speed grade per DS022-4 (Module 4) pinout tables.
What development tools support the XCV1000E-6HQ240C?
The XCV1000E-6HQ240C is supported by Xilinx Foundation Series™ and Alliance Series™ design tools (DS022-1 v2.3, p.1), including schematic entry, VHDL/Verilog synthesis, place-and-route, and bitstream generation. These tools provide timing analysis specific to the -6 speed grade and HQ240 package parasitics.
XCV1000E-6HQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 27648
- Total RAM Bits:
- 393216
- Number of I/O:
- 158
- Number of Gates:
- 1569178
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV1000E-6HQ240C FAQ
1.How can I place an order for XCV1000E-6HQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1000E-6HQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1000E-6HQ240C reliable?
The price and inventory of XCV1000E-6HQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-6HQ240C is usually 5 days.
3.What payment methods are accepted for XCV1000E-6HQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-6HQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1000E-6HQ240C?
XCV1000E-6HQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1000E-6HQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1000E-6HQ240C?
For technical support, including XCV1000E-6HQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-6HQ240C requirements.
6.How does Aetrix verify that XCV1000E-6HQ240C is sourced from the original manufacturer or authorized distributors?
All XCV1000E-6HQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-6HQ240C meets industry standards.
7.What is the process for return or replacement of XCV1000E-6HQ240C?
All XCV1000E-6HQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-6HQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1000E-6HQ240C part is unused and in its original packaging.
Return procedure for XCV1000E-6HQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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