AMD XCV1000E-7BG560C

Overview

XCV1000E-7BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 1,569,178 system gates, 27,648 logic cells, and 404 user I/O pins in a 560-ball BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.

For engineers reviewing the XCV1000E-7BG560C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-voltage reconfigurable logic platform for telecom line cards, video processing pipelines, and embedded control systems requiring deterministic timing, differential I/O, and on-chip memory hierarchy.

Technical Context

The XCV1000E-7BG560C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four 4-input LUTs with dedicated carry chains, dual flip-flops per slice, and F5/F6 multiplexers enabling 5–6 input logic functions.

Its IOBs support 20 I/O standards-including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and LVPECL-with banked VCCO/VREF management, programmable slew rate, drive strength (up to 48 mA sink), and IEEE 1149.1 boundary scan. Eight DLLs provide clock multiply/divide, zero-delay conversion of LVPECL/LVDS clocks, and 50% duty cycle synthesis for DDR applications.

Key Specifications

Pinout & Package

Package: 560-ball Ball Grid Array (BG560), 1.27 mm pitch, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV1000E-7BG560C, the -8 variant delivers tighter timing margins for clock-critical paths, while the XCV1600E-7BG560C offers 26% more logic cells and 50% more block RAM-both retain identical pinout, I/O banking, and DLL architecture for drop-in compatibility in migration scenarios.

Availability

XCV1000E-7BG560C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video systems, industrial motion controllers, and PCI-based data acquisition requiring stable component supply across long-lifecycle programs.

Supply support for XCV1000E-7BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined platforms for high-performance computing and embedded systems.

The Virtex-E family was designed for high-speed, high-density reconfigurable logic in communications, imaging, and industrial automation-emphasizing low-voltage operation (1.8 V core), advanced I/O flexibility, and integrated memory/clock management.

FAQ

What is the maximum LVDS data rate supported by XCV1000E-7BG560C?

XCV1000E-7BG560C supports LVDS signaling at up to 622 Mb/s, verified per DS022-1 specifications. This rate applies to source-synchronous interfaces using differential I/O pairs (IO_LxxN/IO_LxxP) with proper PCB layout-matched trace lengths, controlled impedance, and 100 Ω termination. The device's DLLs ensure precise clock recovery and alignment for reliable high-speed capture.

Does XCV1000E-7BG560C support PCI 66 MHz operation?

Yes, XCV1000E-7BG560C is fully compliant with 3.3 V PCI specification at both 33 MHz and 66 MHz. Its I/O buffers meet PCI electrical requirements including drive strength, slew rate, and input thresholds. The device uses dedicated PCI-compatible I/O standards (PCI33_3 and PCI66_3) and supports all required timing parameters-including setup/hold and TCO-as documented in DS022-3.

How many block RAMs does XCV1000E-7BG560C contain, and what is their configuration flexibility?

XCV1000E-7BG560C contains 96 block RAMs totaling 393,216 bits. Each block is a true dual-port 4096-bit RAM with independent read/write addresses, clocks, and enables. Width-depth configurations include 1K×4, 512×8, 256×16, 128×32, and 64×64, supporting byte-enable and parity generation. These blocks are distributed across 12 columns and integrate dedicated routing for efficient interconnection with CLBs.

Is XCV1000E-7BG560C pin-compatible with other Virtex-E devices in BG560 package?

XCV1000E-7BG560C shares the same BG560 footprint and pin assignment with XCV400E-7BG560C, XCV600E-7BG560C, and XCV1600E-7BG560C per DS022-4 pinout tables. All share identical GCLK, JTAG, VCCINT, and VCCO/VREF pin locations. However, unused pins differ-XCV1000E has 404 user I/Os, while XCV400E supports only 316-so full functional compatibility requires matching I/O count and bank usage.

What configuration modes are supported by XCV1000E-7BG560C?

XCV1000E-7BG560C supports four configuration modes: Master Serial (via external PROM), Slave Serial (SPI-like), SelectMAP (parallel 8-/16-bit bus), and JTAG (boundary scan). Configuration bitstream loads into internal SRAM on power-up; no external configuration controller is required for Master Serial mode. All modes support readback and reconfiguration during operation.