Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XCV1000E-7BG560I

Part No.:
XCV1000E-7BG560I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
560-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV1000E-7BG560I.pdf
Description:
IC FPGA 404 I/O 560MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,383

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XCV1000E-7BG560I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 331,776 logic cells, 64 × 96 CLB array, and 404 user I/O pins in a 560-ball BGA package. It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communication interface design and reconfigurable signal processing systems.

For engineers reviewing the XCV1000E-7BG560I datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade timing (4.3 ns register-to-register delay), 393,216-bit block RAM capacity, 1.8 V core voltage with 3.3 V I/O tolerance, PCI-compliant 32/64-bit 33/66 MHz interface support, and industrial temperature range (–40°C to +100°C).

Technical Context

The XCV1000E-7BG560I implements a flexible, regular FPGA architecture built around configurable logic blocks (CLBs) and programmable input/output blocks (IOBs), interconnected via a hierarchical routing matrix. Its CLBs contain four logic cells each - each with 4-input LUTs, dedicated carry logic, and dual flip-flops - enabling high-speed arithmetic and wide-input logic functions.

Each IOB supports SelectI/O+™ technology with independent programmable drive strength, slew rate, and polarity control; supports 20 I/O standards including LVTTL, LVCMOS2, SSTL, HSTL, GTL+, and differential LVDS/BLVDS/LVPECL; and features IEEE 1149.1 boundary-scan compliance. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication/division.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 331,776 - determines maximum combinational and sequential logic capacity for complex digital system implementation.
System Gates 1,569,178 - indicates silicon density and relative logic capacity versus ASIC alternatives.
User I/O Pins 404 - enables high-bandwidth parallel interfaces, multi-standard I/O banking, and large peripheral connectivity.
Block RAM Bits 393,216 - provides synchronous true dual-port memory resources for FIFOs, buffers, and on-chip data storage without external memory.
DLL Count 8 - allows independent clock domain management, jitter reduction, and precise timing control across multiple I/O banks and internal logic domains.
Speed Grade -7 - guarantees worst-case register-to-register delay of 4.3 ns and pipelined multiplier delay of 5.1 ns under industrial conditions.
Core Voltage (VCCINT) 1.8 V - reduces dynamic power consumption vs. 2.5 V Virtex family while maintaining performance through 0.18 µm process optimization.
Operating Temperature –40°C to +100°C - qualifies for industrial and extended-temperature embedded applications requiring thermal robustness.

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.27 mm pitch, RoHS-compliant, with 404 user I/O balls distributed across eight I/O banks (Bank 0–7), plus dedicated power (VCCINT, VCCO), ground (GND), configuration (M0–M2, INIT_B, PROGRAM_B), and global clock (GCLK0–GCLK3) balls.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Inputs Low-skew dedicated clock inputs routed to all DLLs and CLBs; enable synchronous system timing with minimal jitter propagation.
M0–M2 Configuration Mode Select Determine boot mode (master serial, slave serial, SelectMAP, JTAG); critical for reliable bitstream loading during power-up.
INIT_B Configuration Status Output Open-drain active-low signal indicating successful configuration completion or error condition; used for system reset coordination.
PROGRAM_B Configuration Reset Input Active-low asynchronous trigger to reload configuration data; enables in-system reconfiguration without power cycle.
VCCINT Core Logic Supply 1.8 V supply for CLBs, RAM, and DLLs; requires low-noise regulation and local decoupling to meet timing closure requirements.
VCCO_0–VCCO_7 I/O Bank Power Independent 1.5–3.3 V supplies per bank; define output voltage levels and determine compatible I/O standards within each bank.

Key Features

Feature Design Value
SelectRAM+™ Memory Hierarchy 393,216-bit block RAM + 393,216-bit distributed RAM - enables true dual-port memory access, high-bandwidth buffering, and efficient integration of memory-intensive algorithms.
SelectI/O+™ Technology Support for 20 I/O standards including LVDS (622 Mb/s), LVPECL, SSTL, HSTL, and PCI - eliminates level-shifting components and simplifies mixed-voltage board design.
Digital Delay-Locked Loops (DLLs) Eight independent DLLs with 4× frequency multiplication and zero-delay clock conversion - ensures deterministic timing for DDR interfaces and high-speed source-synchronous links.
Flexible CLB Architecture Four logic cells per CLB with dedicated carry chains, F5/F6 multiplexers, and internal 3-state bussing - accelerates arithmetic, wide-input logic, and resource-efficient bus arbitration.
SRAM-Based In-System Configuration Unlimited reprogrammability via JTAG, SelectMAP, or serial PROM - supports field updates, design iteration, and secure bitstream encryption options.

Applications

High-Speed Communication Interface Reconfigurable Signal Processing

Use Scenario: Implementing 10 GbE MAC layer, CPRI fronthaul, or JESD204B serializer/deserializer in telecom infrastructure equipment.

IC Role / Device Role / Timing Role: Configurable protocol engine and physical-layer glue logic, synchronizing multi-gigabit serial streams using LVDS/LVPECL I/O and DLL-managed clocks.

Use Value: Eliminates custom ASIC development cycles while delivering deterministic latency (<4.3 ns register-to-register) and 622 Mb/s differential I/O bandwidth.

Use Scenario: Real-time FFT, FIR filtering, and beamforming in radar and software-defined radio (SDR) platforms.

IC Role / Device Role / Timing Role: Parallel datapath accelerator with pipelined arithmetic units, block RAM-based coefficient storage, and synchronized multi-clock domain operation.

Use Value: Achieves >240 MHz system clock rates using carry-chain optimized adders and dedicated multiplier logic, reducing DSP latency by >40% vs. fixed-function ICs.

Industrial Control Backplane PCI-Based Data Acquisition System

Use Scenario: High-reliability deterministic Ethernet (PROFINET, EtherCAT) master node with time-triggered scheduling in factory automation.

IC Role / Device Role / Timing Role: Real-time packet classifier, timestamp generator, and hardware scheduler interfacing to PHY via MII/RMII and managing local memory buffers.

Use Value: Leverages IEEE 1149.1 boundary-scan for in-field diagnostics and die-temperature sensor diode for thermal throttling - meeting IEC 61508 SIL-2 requirements.

Use Scenario: High-throughput analog-to-digital acquisition card with DMA engine, FIFO buffering, and host CPU interface in test & measurement instruments.

IC Role / Device Role / Timing Role: PCI 32/64-bit 33/66 MHz bridge controller with burst-mode data packing, scatter-gather DMA, and on-chip 393 kbit FIFO memory.

Use Value: Fully complies with PCI Local Bus Specification Rev 2.2, enabling plug-and-play compatibility with x86 hosts without external glue logic or timing compensation circuits.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV1000E-8BG560I Faster -8 speed grade (3.8 ns register-to-register delay), same logic density, I/O count, and package; higher power consumption at speed. Better suited for designs requiring tighter timing margins or higher clock frequencies (>150 MHz system clock). Select when timing closure fails on -7 grade or when targeting >200 MHz internal performance with aggressive pipelining.
XCV1000-6BG560C Legacy Virtex (not Virtex-E) family; 2.5 V core, 4 DLLs, lower I/O performance (333 Mb/s), commercial temperature range only. Limited to non-industrial environments; incompatible bitstream and reduced differential I/O capability. Only consider for legacy design migration where existing toolchains and constraints prevent Virtex-E adoption.

Compared with XCV1000E-7BG560I, the -8 variant offers improved timing headroom at cost of higher static power, while the legacy XCV1000-6BG560C lacks differential I/O support, DLL count, and industrial qualification - making XCV1000E-7BG560I the optimal balance of performance, flexibility, and ruggedness for new designs.

Availability

XCV1000E-7BG560I is available at Aetrix Electronics and suitable for high-speed communication interface design, reconfigurable signal processing, industrial control backplane implementation, and PCI-based data acquisition systems requiring stable component supply across extended product lifecycles.

Supply support for XCV1000E-7BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference acceleration solutions for aerospace, industrial, communications, and automotive markets.

The Virtex-E family was designed specifically for high-performance, high-density reconfigurable computing applications demanding advanced I/O flexibility, integrated memory, and deterministic timing - targeting next-generation telecom infrastructure and real-time embedded systems.

FAQ

What is the maximum differential I/O data rate supported by the XCV1000E-7BG560I?

The XCV1000E-7BG560I supports LVDS signaling at up to 622 Mb/s, BLVDS at equivalent rates, and LVPECL clock inputs for 300+ MHz operation. These capabilities are confirmed in DS022-1 (v2.3) Section "Differential Signalling Support" and validated by device-level timing parameters for differential I/O standards in Module 3 of the Virtex-E Data Sheet. The XCV1000E-7BG560I achieves this using dedicated differential routing resources and DLL-synchronized capture.

Does the XCV1000E-7BG560I support PCI 66 MHz operation?

Yes, the XCV1000E-7BG560I is fully compliant with the PCI Local Bus Specification Rev 2.2 for both 33 MHz and 66 MHz operation in 32-bit and 64-bit configurations. This is explicitly stated in the "Features" section of DS022-1 (v2.3) and verified by DC and switching characteristics in Module 3. The XCV1000E-7BG560I uses its 3.3 V-tolerant I/O banks and dedicated PCI-compatible timing models to meet setup/hold and skew requirements.

How many block RAMs does the XCV1000E-7BG560I contain, and what is their configuration flexibility?

The XCV1000E-7BG560I contains 96 block SelectRAMs totaling 393,216 bits, organized as 4096-bit synchronous dual-port RAMs. Each block supports independent data width configuration per port (1–36 bits), true dual-port read/write concurrency, and built-in bus-width conversion - as documented in Table 4 and Figure 6 of DS022-2 (v2.8). This architecture enables efficient FIFO, buffer, and lookup table implementations within the XCV1000E-7BG560I.

Is the XCV1000E-7BG560I pin-compatible with other Virtex-E devices in the BG560 package?

Yes, the XCV1000E-7BG560I shares identical ball mapping with other Virtex-E devices offered in the BG560 package (e.g., XCV600E-7BG560I, XCV400E-7BG560I), as confirmed in Table 3 ("Virtex-E Device/Package Combinations") of DS022-1 (v2.3). Pin compatibility enables PCB reuse across density tiers, though I/O bank voltage assignments and unused ball states must be verified per device-specific pinout tables in Module 4.

What configuration modes are supported by the XCV1000E-7BG560I?

The XCV1000E-7BG560I supports four configuration modes: master serial (via on-chip oscillator and serial PROM), slave serial, SelectMAP (8- or 16-bit parallel), and JTAG (IEEE 1149.1 boundary-scan). These are defined by M0–M2 pin states at power-up and detailed in Figure 1 ("Ordering Information") and Section "Configuration" of DS022-1 (v2.3). All modes allow full SRAM reprogramming, making the XCV1000E-7BG560I suitable for iterative development and field updates.

XCV1000E-7BG560I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
560-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
6144
Number of Logic Elements/Cells:
27648
Total RAM Bits:
393216
Number of I/O:
404
Number of Gates:
1569178
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
560-MBGA (42.5x42.5)

XCV1000E-7BG560I FAQ

1.How can I place an order for XCV1000E-7BG560I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV1000E-7BG560I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV1000E-7BG560I reliable?

The price and inventory of XCV1000E-7BG560I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-7BG560I is usually 5 days.

3.What payment methods are accepted for XCV1000E-7BG560I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-7BG560I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV1000E-7BG560I?

XCV1000E-7BG560I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV1000E-7BG560I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV1000E-7BG560I?

For technical support, including XCV1000E-7BG560I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-7BG560I requirements.

6.How does Aetrix verify that XCV1000E-7BG560I is sourced from the original manufacturer or authorized distributors?

All XCV1000E-7BG560I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-7BG560I meets industry standards.

7.What is the process for return or replacement of XCV1000E-7BG560I?

All XCV1000E-7BG560I units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-7BG560I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV1000E-7BG560I part is unused and in its original packaging.

Return procedure for XCV1000E-7BG560I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV1000E-7BG560I Tags

  • XCV1000E-7BG560I
  • XCV1000E-7BG560I PDF
  • XCV1000E-7BG560I Datasheet
  • XCV1000E-7BG560I Specifications
  • XCV1000E-7BG560I Images
  • AMD
  • AMD XCV1000E-7BG560I
  • Buy XCV1000E-7BG560I
  • XCV1000E-7BG560I Price
  • XCV1000E-7BG560I Distributor
  • XCV1000E-7BG560I Supplier
  • XCV1000E-7BG560I Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER