AMD XCV1000E-7FG1156C

Overview

XCV1000E-7FG1156C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1,569,178 system gates, 27,648 logic cells, and 660 user I/O pins in an 1156-ball Fine-Pitch Ball Grid Array (FG1156) package. It features eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed communication subsystems.

For engineers reviewing the XCV1000E-7FG1156C datasheet, pinout, applications, or equivalent options, this device is selected for high-density reconfigurable logic in telecom line cards, radar signal processors, and industrial real-time control where internal clock rates up to 240 MHz, differential I/O bandwidth >100 Gb/s, and dual-port memory architecture are required.

Technical Context

The XCV1000E-7FG1156C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four 4-input LUTs with dedicated carry logic, arithmetic XOR/AND gates, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVDS (622 Mb/s), LVPECL, SSTL, HSTL, and PCI-via banked VCCO/VREF supplies, with each of eight I/O banks requiring uniform VCCO voltage. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×.

Key Specifications

Pinout & Package

The XCV1000E-7FG1156C is housed in a 1156-ball Fine-Pitch Ball Grid Array (FG1156) package with 1.0 mm ball pitch, thermal-enhanced construction, and IEEE 1149.1 boundary-scan support. Pin assignments follow Xilinx DS022-4 Module 4 pinout tables, with dedicated power (VCCINT = 1.8 V, VCCO = 1.5–3.3 V), ground, configuration, and global clock balls distributed across eight I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV1000E-7FG1156C, the -8 variant offers margin for aggressive timing closure while maintaining identical pinout and power delivery; the XCV1600E-7FG1156C provides scalable logic and memory headroom without changing PCB layout or thermal design.

Availability

XCV1000E-7FG1156C is available at Aetrix Electronics and suitable for telecom infrastructure, defense radar, industrial automation, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XCV1000E-7FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in applications demanding >200 MHz system clocks, multi-standard I/O, and embedded memory - targeting telecom, aerospace, and instrumentation markets.

FAQ

What is the core supply voltage requirement for XCV1000E-7FG1156C?

XCV1000E-7FG1156C requires a regulated 1.8 V ±3% supply on VCCINT pins for internal logic and memory operation. This low-voltage rail reduces dynamic power consumption versus prior 2.5 V FPGA families while enabling higher transistor density and speed. Decoupling capacitors must be placed per Xilinx DS022-3 recommendations to maintain voltage stability under switching loads.

Does XCV1000E-7FG1156C support LVDS I/O at 622 Mb/s?

Yes, XCV1000E-7FG1156C supports LVDS signaling at up to 622 Mb/s per differential pair, as confirmed in DS022-1 Table 2 and DS022-2 Section "Differential Signalling Support". This capability applies to all 344 differential I/O pairs in the FG1156 package, with matched internal termination and programmable drive strength to meet ANSI TIA/EIA-644 requirements.

How many block RAMs does XCV1000E-7FG1156C contain?

XCV1000E-7FG1156C contains 96 block SelectRAM units totaling 393,216 bits of synchronous, true dual-port memory. Each block is 4096 bits organized as configurable depth/width (e.g., 256×16 or 512×8), with independent read/write ports and dedicated routing to CLBs and other RAM blocks per DS022-2 Table 4.

Is XCV1000E-7FG1156C pin-compatible with other Virtex-E devices in FG1156 packaging?

XCV1000E-7FG1156C shares the FG1156 package footprint and ball map with XCV1600E-7FG1156C and XCV2000E-7FG1156C, but is not pin-compatible with smaller Virtex-E devices in FG1156 (e.g., XCV600E-7FG1156C has fewer I/Os). Pin compatibility between XCV1000E-7FG1156C and larger variants is confirmed in DS022-1 Table 3 and DS022-4 pinout documentation.

What configuration modes does XCV1000E-7FG1156C support?

XCV1000E-7FG1156C supports master serial (via on-chip oscillator and external SPROM), slave serial, SelectMAP (8- or 16-bit parallel), and JTAG (IEEE 1149.1) configuration modes. Configuration is SRAM-based and volatile; persistent operation requires external nonvolatile memory or configuration controller, as detailed in DS022-2 Section "Configuration".