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AMD XCV1000E-7FG680C
- Part No.:
- XCV1000E-7FG680C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 680-LBGA Exposed Pad
- Datasheet:
-
XCV1000E-7FG680C.pdf
- Description:
- IC FPGA 512 I/O 680FTEBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,920
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Product details
Overview
XCV1000E-7FG680C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1,569,178 system gates, 27,648 logic cells, and 660 user I/O pins in a 680-ball Fine-Pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems in telecom line cards.
For engineers reviewing the XCV1000E-7FG680C datasheet, pinout, applications, or equivalent options, key selection criteria include internal 130 MHz performance (four LUT levels), 1.8 V core voltage with 3.3 V I/O tolerance, DLL-based clock multiplication/division, true dual-port block RAM configuration, and support for source-synchronous data transmission architectures.
Technical Context
The XCV1000E-7FG680C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-organized across eight I/O banks with bank-specific VCCO and VREF requirements. All I/Os are 3 V tolerant; 5 V tolerance requires external 100 Ω resistors, and PCI 5 V is not supported.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1,569,178 - defines total logic capacity for complex digital systems including protocol engines and packet processors. |
| Logic Cells | 27,648 - provides granular, routable logic resources for high-density HDL synthesis and place-and-route efficiency. |
| User I/O Pins | 660 - enables wide parallel bus interfaces, multi-channel SerDes framing, and high-pin-count memory controllers. |
| Block RAM Bits | 393,216 - supports true dual-port synchronous RAM configurations for FIFOs, frame buffers, and ping-pong data buffering. |
| DLL Count | 8 - allows independent clock domain management, zero-delay clock conversion, and DDR timing alignment across multiple I/O banks. |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power consumption versus 2.5 V Virtex devices while maintaining 130 MHz internal performance. |
| I/O Standards | LVTTL, LVCMOS2, SSTL3, HSTL, LVDS (622 Mb/s), LVPECL - enables direct interfacing with DDR SDRAM, ZBT SRAM, and optical transport PHYs. |
| Speed Grade | -7 - guarantees worst-case timing performance including 4.3 ns register-to-register delay and 3.5 ns parity tree propagation. |
Pinout & Package
Package: 680-ball Fine-Pitch Ball Grid Array (FG680), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0 °C to +85 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Inputs | Dedicated low-skew clock inputs routed to all DLLs; each connects to one of eight independent DLLs for domain-specific clock management. |
| VCCINT | Core Power Supply | 1.8 V supply for CLBs, block RAM, and DLL circuitry; requires local decoupling to maintain signal integrity under switching loads. |
| VCCO_0–VCCO_7 | I/O Bank Power Supplies | Bank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O; each bank must use identical VCCO for compatible output standards. |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltage for SSTL, HSTL, and GTL input buffers; internally tied within bank, requiring single external source per bank. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for in-system configuration, debugging, and production testing. |
| PROGRAM_B / INIT_B / DONE | Configuration Control | Asynchronous FPGA reset (PROGRAM_B), configuration status (INIT_B), and completion indicator (DONE) for master serial or SelectMAP modes. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards across eight banks with programmable drive strength, slew rate, and weak-keeper circuits for bus hold stability. |
| SelectRAM+™ Memory Hierarchy | Combines 393,216-bit synchronous block RAM (true dual-port, configurable depth/width) with distributed RAM in CLBs for hierarchical memory mapping. |
| SelectLink™ DDR Interface | Proprietary high-speed link supporting Double Data Rate transfers between Virtex-E devices; enabled via web-based HDL generation tools. |
| Digital Delay-Locked Loops (DLLs) | Eight fully digital DLLs provide clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay LVPECL/LVDS clock conversion to any I/O standard. |
| Arithmetic-Optimized CLB | Dedicated carry chains (2-bit height per slice), XOR/AND gates, and cascade paths enable efficient implementation of adders, multipliers, and wide logic functions. |
| Die Temperature Sensor | On-die diode enables real-time thermal monitoring for thermal throttling or fan control in high-power telecom and computing applications. |
Applications
| Telecom Line Card Processing | High-Speed Protocol Engine |
|---|---|
Use Scenario: Aggregating and processing OC-48/STM-16 SONET/SDH frames with ATM and IP encapsulation. IC Role / Device Role / Timing Role: Configurable packet classifier, header parser, and CRC engine with deterministic latency via DLL-synchronized I/O and internal pipelining. Use Value: 660 I/Os support parallel 32-bit PCI-X 66 MHz host interface and 16-bit DDR SDRAM controller; 393 kbit block RAM buffers full STS-1 payloads. |
Use Scenario: Implementing IEEE 1588 Precision Time Protocol (PTP) slave clocks with sub-100 ns timestamp resolution. IC Role / Device Role / Timing Role: High-resolution timestamp capture unit synchronized to LVDS 156.25 MHz reference clock via DLL zero-delay conversion. Use Value: Eight DLLs allow simultaneous locking to multiple frequency domains; LVDS I/O supports 622 Mb/s PTP event message serialization. |
| Industrial Motion Control Hub | Medical Imaging Data Pipeline |
Use Scenario: Coordinating multi-axis servo drives using EtherCAT or SERCOS III real-time Ethernet protocols. IC Role / Device Role / Timing Role: Deterministic MAC layer processor with hardware-accelerated frame filtering, cyclic redundancy check, and distributed clock synchronization. Use Value: 1.8 V core reduces thermal load in sealed enclosures; 3 V-tolerant I/O interfaces directly with 3.3 V encoder feedback and analog front-end ADCs. |
Use Scenario: Real-time preprocessing of 12-bit, 80 MSPS ultrasound echo data before transfer to GPU-based reconstruction engine. IC Role / Device Role / Timing Role: High-throughput FIR filter bank and beamformer with parallel processing pipelines and on-chip buffering. Use Value: True dual-port block RAM enables simultaneous acquisition (port A) and processing (port B); LUT-based shift registers capture burst-mode ADC streams at 622 Mb/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000E-8FG680C | Higher speed grade (-8) with 0.3 ns faster register-to-register delay (4.0 ns vs. 4.3 ns) and improved DLL jitter specs. | Better suited for designs requiring >200 MHz system clock rates or tighter setup/hold margins in source-synchronous interfaces. | Select XCV1000E-8FG680C only if timing closure fails with -7 grade; identical pinout, package, and configuration interface. |
| XCV1000E-7BG560C | Same speed grade and logic resources but in 560-ball BGA (1.27 mm pitch), reducing I/O count to 404 and increasing board area. | Preferred for cost-sensitive industrial control where lower I/O density and relaxed routing constraints justify larger footprint. | Choose XCV1000E-7BG560C when PCB layout simplification or legacy BGA tooling outweighs need for 660 I/Os. |
Compared with XCV1000E-7FG680C, the -8 variant delivers marginally higher timing performance without changing power or thermal behavior, while the BG560 variant trades I/O count and density for mechanical compatibility with older assembly processes - both retain identical configuration bitstreams and functional capability.
Availability
XCV1000E-7FG680C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and high-speed protocol development requiring stable component supply over extended production lifecycles.
Supply support for XCV1000E-7FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneer in programmable logic technology and was acquired by AMD in 2022. The company developed foundational FPGA architectures, design tools, and IP ecosystems for high-performance digital systems.
The Virtex-E family was designed for high-speed, high-density system-on-chip integration in wired communications, test equipment, and compute acceleration - emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.
FAQ
What is the maximum differential I/O pair count supported by XCV1000E-7FG680C?
XCV1000E-7FG680C supports up to 344 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This enables high-bandwidth differential interfaces such as LVDS camera links, JESD204B-like serializers, or multi-lane source-synchronous buses. The 680-ball FG package allocates sufficient ball count to route these pairs with controlled impedance and minimal crosstalk.
Does XCV1000E-7FG680C support 5 V tolerant I/Os?
XCV1000E-7FG680C does not natively support 5 V tolerant I/Os. Its I/O pins are rated for 3.3 V operation and tolerate up to 3.96 V absolute maximum. For 5 V interface compatibility, an external 100 Ω series resistor is required per I/O pin, as specified in the Virtex-E data sheet. PCI 5 V signaling is explicitly unsupported.
Can XCV1000E-7FG680C be configured via JTAG in-system?
Yes, XCV1000E-7FG680C supports IEEE 1149.1 JTAG boundary-scan configuration in slave serial mode. The TCK, TMS, TDI, and TDO pins enable full in-system programming, debugging, and verification without requiring external configuration PROMs - critical for field-upgradable telecom and medical systems.
What is the block RAM organization in XCV1000E-7FG680C?
XCV1000E-7FG680C contains 96 block RAMs, each 4096 bits, totaling 393,216 bits. Each block supports true dual-port operation with independent read/write addresses, enabling simultaneous access for applications like video frame buffering or pipeline staging. Depth/width configurations range from 16×256 to 512×8 bits per port.
Is XCV1000E-7FG680C pin-compatible with earlier Virtex family devices?
XCV1000E-7FG680C is not bitstream- or pin-compatible with original Virtex devices. While some packages share ball counts (e.g., FG680), banking rules, VCCO/VREF pin assignments, and DLL routing differ significantly. Migration requires full re-compilation and PCB layout revision - no drop-in replacement exists between Virtex and Virtex-E families.
XCV1000E-7FG680C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 680-LBGA Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 27648
- Total RAM Bits:
- 393216
- Number of I/O:
- 512
- Number of Gates:
- 1569178
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 680-FTEBGA (40x40)
XCV1000E-7FG680C FAQ
1.How can I place an order for XCV1000E-7FG680C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1000E-7FG680C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1000E-7FG680C reliable?
The price and inventory of XCV1000E-7FG680C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-7FG680C is usually 5 days.
3.What payment methods are accepted for XCV1000E-7FG680C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-7FG680C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1000E-7FG680C?
XCV1000E-7FG680C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1000E-7FG680C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1000E-7FG680C?
For technical support, including XCV1000E-7FG680C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-7FG680C requirements.
6.How does Aetrix verify that XCV1000E-7FG680C is sourced from the original manufacturer or authorized distributors?
All XCV1000E-7FG680C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-7FG680C meets industry standards.
7.What is the process for return or replacement of XCV1000E-7FG680C?
All XCV1000E-7FG680C units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-7FG680C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1000E-7FG680C part is unused and in its original packaging.
Return procedure for XCV1000E-7FG680C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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