AMD XCV1000E-7FG860C

Overview

XCV1000E-7FG860C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1.57 million system gates, 27,648 logic cells, and 660 user I/O pins in an 860-ball Fine-Pitch Ball Grid Array (FG860) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces - deployed in high-speed communications infrastructure and radar signal processing systems.

For engineers reviewing the XCV1000E-7FG860C datasheet, pinout, applications, or equivalent options, this device delivers verified 133+ MHz internal register-to-register performance, 240 MHz synchronous system clock capability, and deterministic timing for source-synchronous DDR data capture in FPGA-based protocol accelerators and reconfigurable computing platforms.

Technical Context

The XCV1000E-7FG860C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and peripheral VersaRing™ routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice - enabling high-speed arithmetic and wide-input logic synthesis.

Its IO subsystem supports 20 I/O standards across eight voltage-banked groups, with VCCO-supplied input buffers for LVTTL/LVCMOS/PCI and VREF-dependent inputs for SSTL/HSTL. All 660 user I/O pins are individually configurable as input, output, or bidirectional, with programmable drive strength, slew rate, and weak-keeper circuits - validated for 3.3 V PCI compliance and 622 Mb/s LVDS differential signaling.

Key Specifications

Pinout & Package

Package: 860-ball Fine-Pitch Ball Grid Array (FG860), 1.0 mm ball pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV1000E-7FG860C, the –8 speed grade offers marginal timing headroom at identical cost and power, while XCV1600E-7FG860C trades increased static power and thermal load for scalable logic capacity - neither is pin-compatible with Virtex-II or Spartan families.

Availability

XCV1000E-7FG860C is available at Aetrix Electronics and suitable for high-speed communications backplanes, radar digital beamforming, industrial machine vision controllers, and reconfigurable test equipment requiring stable component supply over extended production lifecycles.

Supply support for XCV1000E-7FG860C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design toolchains for high-performance digital systems.

The Virtex-E family was engineered for high-speed, high-density reconfigurable computing in telecommunications and defense applications - delivering 1.8 V core operation, advanced I/O flexibility, and deterministic timing for mission-critical signal processing.

FAQ

What is the maximum supported LVDS data rate for XCV1000E-7FG860C?

XCV1000E-7FG860C supports LVDS signaling at up to 622 Mb/s per differential pair, as confirmed in DS022-1 Table 2 and DS022-2 Section "Differential Signalling Support". This rate is achievable with proper PCB layout (controlled impedance, length matching), termination (100 Ω differential), and DLL-assisted clock recovery. The device does not support LVDS at rates beyond 622 Mb/s - higher speeds require Virtex-II or later families.

Does XCV1000E-7FG860C support true dual-port block RAM?

Yes, XCV1000E-7FG860C includes 96 block RAM modules, each configured as a true dual-port 4096-bit memory with independent read/write addresses, clocks, and enables per port. This capability is documented in DS022-2 Module 2, Table 4 and Figure 6, enabling simultaneous access for applications like ping-pong buffering and real-time data streaming without external arbitration logic.

What I/O standards are supported by XCV1000E-7FG860C?

XCV1000E-7FG860C supports 20 I/O standards including LVTTL, LVCMOS18/25, SSTL3/I/II, HSTL I/III/IV, GTL/GTL+, PCI33_3/PCI66_3, LVDS, BLVDS, and LVPECL - as listed in DS022-2 Table 1. Standards are grouped by I/O bank voltage (VCCO) and reference (VREF) requirements; mixing incompatible standards within a bank violates banking rules and causes functional failure.

How many Delay-Locked Loops (DLLs) does XCV1000E-7FG860C integrate?

XCV1000E-7FG860C integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 Features section and DS022-2 Architectural Description. These DLLs provide zero-delay clock conversion, duty-cycle correction, and frequency multiplication - critical for DDR memory interfaces and high-speed serial link clock recovery. No PLLs are present; all clock management relies on DLL-based delay adjustment.

Is XCV1000E-7FG860C pin-compatible with other Virtex-E devices in FG860 packaging?

XCV1000E-7FG860C shares the FG860 package footprint with XCV600E-7FG860C and XCV1600E-7FG860C, but is not fully pin-compatible across the family. While ball assignments for power, ground, and global clocks align, user I/O pin functions differ significantly due to varying CLB counts and block RAM column placements - confirmed in DS022-4 Pinout Tables. Migration requires PCB redesign and I/O constraint revalidation.