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AMD XCV1000E-7HQ240I

Part No.:
XCV1000E-7HQ240I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP Exposed Pad
Datasheet:
AetrixXCV1000E-7HQ240I.pdf
Description:
IC FPGA 158 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,762

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Product details

Overview

XCV1000E-7HQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 1,569,178 system gates and 27,648 logic cells in a 64 × 96 CLB array. It delivers up to 240 MHz synchronous system performance, supports 622 Mb/s LVDS differential I/O, and integrates 393,216 bits of true dual-port block RAM - used in high-speed communication interface design and digital signal processing acceleration.

For engineers reviewing the XCV1000E-7HQ240I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, SelectRAM+ memory configuration, and industrial-grade (-40°C to +100°C) thermal validation for embedded telecom and test equipment deployment.

Technical Context

The XCV1000E-7HQ240I implements a regular FPGA architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), eight fully digital Delay-Locked Loops (DLLs), and dedicated block RAM columns aligned every 12 CLB columns. Its CLBs contain four logic cells each, with 4-input LUTs supporting 16×1-bit synchronous RAM or 16×2-bit dual-port RAM per slice.

I/O functionality is organized into eight banks, each requiring shared VCCO and (where applicable) single VREF voltage; supported standards include LVTTL, LVCMOS2, SSTL3, HSTL, PCI33_3/66_3, LVDS, BLVDS, and LVPECL. Input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO-not VCCINT-enabling mixed-voltage I/O operation within bank constraints.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 1,569,178 - defines total logic capacity for ASIC replacement or complex RTL integration
Logic Cells 27,648 - enables large-scale datapath, control, and state-machine implementation
Block RAM Bits 393,216 - supports true dual-port access at up to 200 MHz for FIFOs, buffers, or lookup tables
Differential I/O Pairs 281 - enables >100 Gb/s aggregate bandwidth using LVDS/BLVDS/LVPECL signaling
Max System Clock 240 MHz - achievable with source-synchronous interfaces and DLL-managed clock domains
Internal Performance 130 MHz (4-LUT levels) - measured register-to-register delay for critical path timing closure
Speed Grade -7 - specifies worst-case timing parameters including TREG = 4.3 ns for pipelined multiplier
Temperature Range Industrial (-40°C to +100°C) - validated for operation in base station, industrial control, and avionics environments

Pinout & Package

The XCV1000E-7HQ240I uses a 240-pin High Heat Dissipation (HQ) plastic quad flat pack (PQFP) package with 0.5 mm pitch and 34.6 mm × 34.6 mm body size. Pin assignments follow Xilinx DS022-4 Module 4 pinout tables, with dedicated global clock inputs (GCLK0–GCLK3), VCCINT/VCCO/VREF supply pins per bank, and IEEE 1149.1 boundary-scan support.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Inputs Four dedicated low-skew clock inputs routed to all DLLs; required for zero-delay clock conversion
VCCINT Core Logic Supply 1.8 V ± 3% supply for CLBs, RAM, and routing; decoupling required per DS022-3 recommendations
VCCO_0–VCCO_7 I/O Bank Power Bank-specific 1.5–3.3 V supplies enabling mixed-standard I/O; each bank must use identical VCCO
VREF_0–VREF_7 Input Threshold Reference Bank-specific reference voltage for SSTL/HSTL/GTL standards; internally tied across all VREF pins in same bank
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface for in-system programming and verification
PROGRAM_B Configuration Reset Active-low asynchronous reset that clears configuration memory and initiates reconfiguration

Key Features

Feature Design Value
SelectI/O+™ Technology Supports 20 I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI) with per-bank VCCO/VREF control - enables heterogeneous interface integration on single device
SelectRAM+™ Memory True dual-port 4096-bit block RAMs with independent read/write widths - eliminates external SRAM for buffering in packet-processing pipelines
Eight Digital DLLs Provide 50% duty cycle correction, clock multiply/divide, and zero-delay LVPECL/LVDS-to-I/O conversion - essential for DDR clocking and jitter-sensitive serial links
Carry Chain Arithmetic Dedicated 2-bit-per-CLB carry logic with XOR/AND gates - accelerates adders, counters, and multipliers without LUT resource consumption
Configurable LUTs Each 4-input LUT operates as logic function generator, 16×1-bit RAM, or 16-bit shift register - enables flexible datapath and high-speed capture in DSP applications

Applications

Telecom Line Card Interface High-Speed Test Equipment Controller

Use Scenario: Aggregating multiple T1/E1/J1 streams into OC-3/STM-1 framing with real-time CRC and HDLC processing.

IC Role / Device Role / Timing Role: FPGA fabric implements protocol engines, clock domain crossing, and SerDes interface logic; DLLs lock to recovered line clocks.

Use Value: 281 differential I/O pairs enable parallel LVDS bus interfacing to multiple PHYs; 393 kbit block RAM stores frame buffers and lookup tables.

Use Scenario: Generating and analyzing multi-channel digital stimulus patterns for ATE systems operating at >200 MHz.

IC Role / Device Role / Timing Role: Configurable logic generates precise timing waveforms; distributed RAM stores pattern sequences; DLLs synchronize output edges.

Use Value: 240 MHz system clock and 130 MHz internal performance meet setup/hold requirements for 500 Mbps vector rates.

Industrial Motion Control Hub Radar Signal Preprocessor

Use Scenario: Coordinating 16-axis servo drives via SSI, BiSS, and EnDat 2.2 interfaces with deterministic jitter < 50 ps.

IC Role / Device Role / Timing Role: FPGA implements encoder interpolation, PWM generation, and EtherCAT slave stack; DLLs manage master clock distribution.

Use Value: Eight DLLs provide independent phase alignment for each axis clock; LVDS I/O ensures noise-immune feedback acquisition.

Use Scenario: Real-time FFT, CFAR detection, and pulse compression on digitized IF data from phased-array radar receivers.

IC Role / Device Role / Timing Role: CLBs implement pipeline FFT stages; block RAM serves as coefficient storage and ping-pong data buffers; LUTs act as shift registers for sample capture.

Use Value: 27,648 logic cells accommodate 1024-point pipelined FFT plus control logic; 393 kbit RAM enables dual-buffered 512-sample windows.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV1000E-8HQ240I Faster speed grade (-8) with 4.1 ns register-to-register delay vs. 4.3 ns for -7 grade; identical pinout and architecture Better suited for designs requiring margin above 240 MHz system clock or tighter hold-time compliance Select when timing closure fails on -7 grade or when future-proofing against process variation
XCV1000E-7FG456C Same speed grade and logic resources but in 456-pin Fine-Pitch BGA; supports 312 user I/O vs. 158 in HQ240 Enables higher I/O count for multi-protocol interface consolidation; requires PCB redesign due to different package Choose for new designs needing >200 I/O or improved thermal dissipation; not drop-in compatible

Compared with XCV1000E-7HQ240I, the -8 speed grade offers tighter timing margins without architectural change, while the FG456 variant trades package compatibility for expanded I/O and thermal headroom - both require full revalidation but share bitstream compatibility within the Virtex-E family.

Availability

XCV1000E-7HQ240I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, high-speed test instrumentation, and radar signal processing requiring stable component supply across extended lifecycle programs.

Supply support for XCV1000E-7HQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding system-level applications.

The Virtex-E product line was engineered for high-speed, high-density digital system integration - targeting communications infrastructure, military/aerospace, and industrial automation where performance, I/O flexibility, and reliability are critical.

FAQ

What is the maximum differential I/O capability of the XCV1000E-7HQ240I?

The XCV1000E-7HQ240I supports up to 281 differential I/O pairs, enabling >100 Gb/s aggregate bandwidth using LVDS, BLVDS, or LVPECL signaling. This capability is validated per DS022-1 Table 1 and confirmed in DS022-4 pinout documentation for the HQ240 package. Each pair operates at up to 622 Mb/s with proper termination and layout.

Does the XCV1000E-7HQ240I support true dual-port block RAM operation?

Yes, the XCV1000E-7HQ240I contains 96 block RAMs totaling 393,216 bits, each configured as true dual-port 4096-bit memory with independent read/write addresses, enables, and clocks. This is specified in DS022-2 Module 2 Section "Block SelectRAM" and verified in Table 4 of the same document.

How many Delay-Locked Loops (DLLs) does the XCV1000E-7HQ240I integrate?

The XCV1000E-7HQ240I integrates eight fully digital Delay-Locked Loops (DLLs), doubling the count found in earlier Virtex devices. These DLLs support clock multiply/divide, 50% duty cycle correction for DDR, and zero-delay conversion of high-speed LVPECL/LVDS clocks - detailed in DS022-1 Features section and DS022-2 Architectural Description.

What I/O standards are supported by the XCV1000E-7HQ240I's SelectI/O+™ technology?

The XCV1000E-7HQ240I supports 20 I/O standards via SelectI/O+™, including LVTTL, LVCMOS2, LVCMOS18, SSTL3/I-II, HSTL/I-III-IV, PCI33_3/66_3, GTL, GTL+, CTT, AGP-2X, BLVDS, LVDS, and LVPECL. Compatibility per bank is constrained by shared VCCO and VREF voltages, as defined in DS022-2 Table 1 and I/O Banking section.

Is the XCV1000E-7HQ240I pin-compatible with other Virtex-E devices in the HQ240 package?

Yes, the XCV1000E-7HQ240I shares identical pinout with other Virtex-E devices offered in the HQ240 package (e.g., XCV600E-7HQ240I), as confirmed in DS022-1 Table 3 and DS022-4 pinout tables. However, I/O bank assignments and VCCO/VREF pin allocations scale with device size - unused pins in smaller variants are marked "No Connect" in the XCV1000E-7HQ240I datasheet.

XCV1000E-7HQ240I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
240-BFQFP Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
6144
Number of Logic Elements/Cells:
27648
Total RAM Bits:
393216
Number of I/O:
158
Number of Gates:
1569178
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV1000E-7HQ240I FAQ

1.How can I place an order for XCV1000E-7HQ240I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV1000E-7HQ240I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV1000E-7HQ240I reliable?

The price and inventory of XCV1000E-7HQ240I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-7HQ240I is usually 5 days.

3.What payment methods are accepted for XCV1000E-7HQ240I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-7HQ240I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV1000E-7HQ240I?

XCV1000E-7HQ240I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV1000E-7HQ240I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV1000E-7HQ240I?

For technical support, including XCV1000E-7HQ240I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-7HQ240I requirements.

6.How does Aetrix verify that XCV1000E-7HQ240I is sourced from the original manufacturer or authorized distributors?

All XCV1000E-7HQ240I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-7HQ240I meets industry standards.

7.What is the process for return or replacement of XCV1000E-7HQ240I?

All XCV1000E-7HQ240I units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-7HQ240I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV1000E-7HQ240I part is unused and in its original packaging.

Return procedure for XCV1000E-7HQ240I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV1000E-7HQ240I Tags

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