My Inquiry
My Account
AMD XCV1000E-8FG1156C
- Part No.:
- XCV1000E-8FG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA
- Datasheet:
-
XCV1000E-8FG1156C.pdf
- Description:
- IC FPGA 660 I/O 1156FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,047
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCV1000E-8FG1156C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1,569,178 system gates, 27,648 logic cells, and 660 user I/O pins in an 1156-ball Fine-Pitch Ball Grid Array (FG1156) package. It features eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V I/O for high-speed communication subsystems in telecom infrastructure.
For engineers reviewing the XCV1000E-8FG1156C datasheet, pinout, applications, or equivalent options, this device is evaluated for source-synchronous data transmission at 622 Mb/s, 240 MHz system clock operation, DDR memory interface design, and multi-standard I/O bank partitioning requiring precise VCCO/VREF assignment per bank.
Technical Context
The XCV1000E-8FG1156C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.
Its IOBs support 20 I/O standards-including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL-with programmable drive strength, slew rate, weak-keeper, and pull-up/pull-down. Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, all operating under 1.8 V VCCINT supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1,569,178 - defines total logic capacity for complex digital systems including protocol engines and packet processors |
| Logic Cells | 27,648 - provides granular, routable logic resources for high-utilization HDL synthesis targeting ASIC replacement |
| User I/O Pins | 660 - enables dense board-level interconnect for multi-protocol interfaces such as PCI-X, DDR SDRAM, and SerDes parallel lanes |
| Block RAM Bits | 393,216 - delivers true dual-port synchronous memory for FIFOs, frame buffers, and on-chip data buffering without external RAM |
| DLL Count | 8 - supports independent clock domain management for multiple high-speed I/O banks and internal timing-critical paths |
| Max I/O Speed | 622 Mb/s (LVDS) - enables source-synchronous signaling for optical transport and backplane applications |
| VCCINT Supply | 1.8 V - reduces dynamic power vs. 2.5 V Virtex family while maintaining performance via 0.18 μm 6-layer metal process |
Pinout & Package
Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant, thermal-enhanced construction with die-temperature sensor diode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Inputs | Dedicated low-skew clock inputs routed to all DLLs; each connects to one of eight DLLs for independent clock domain control |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, block RAM, and DLLs; requires tight regulation and local decoupling due to high transient current |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O; each VCCO powers all outputs and LVTTL/LVCMOS inputs in its bank |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/GTL+ inputs; must be stable ±1% and shared across all VREF pins in same bank |
| IO_LxxN/IO_LxxP | Differential I/O Pairs | LVDS/BLEVD/BLVDS-capable pairs; N/P pins must be routed as matched-length differential traces with 100 Ω termination |
| TDO/TDI/TCK/TMS | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; supports in-system configuration, debugging, and production testing without external programmers |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital DLLs | Enables zero-delay clock distribution, 4× frequency multiplication, and 50% duty-cycle correction for DDR interfaces without external clock ICs |
| True Dual-Port Block RAM | Allows simultaneous read/write access to same memory block-critical for video line buffers, network packet reordering, and real-time DSP |
| SelectI/O+ Technology | Supports 20 I/O standards in one device; eliminates need for level translators or external bus switches in mixed-voltage systems |
| Source-Synchronous I/O | 622 Mb/s LVDS operation with DLL-aligned strobes enables reliable capture of high-speed parallel data from ADCs, FPGAs, or PHYs |
| Configurable I/O Banking | Eight independent banks allow concurrent use of PCI, DDR SDRAM, and LVDS on same device-each with separate VCCO/VREF constraints |
Applications
| Telecom Line Card Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Implementing packet classification, header parsing, and traffic shaping in OC-48/STM-16 line cards with parallel 8-bit or 16-bit data buses. IC Role / Device Role / Timing Role: FPGA fabric serves as protocol accelerator and glue logic between SERDES, MAC, and memory controllers; DLLs align clocks to incoming data valid windows. Use Value: 660 I/O and 622 Mb/s LVDS support direct connection to multiple framer chips and DDR2 SDRAM, reducing PCB layer count and signal integrity risk. | Use Scenario: Generating and capturing multi-channel digital stimulus patterns at >200 MHz for ATE platforms using parallel vector I/O. IC Role / Device Role / Timing Role: Acts as pattern generator and response analyzer with deterministic timing; DLLs lock to system reference clock and generate phase-aligned sampling clocks. Use Value: Eight DLLs allow independent clock domains per channel group, enabling skew-compensated parallel capture across 64+ pins without external delay calibration. |
| Medical Imaging Data Pipeline | Industrial Motion Control Hub |
Use Scenario: Aggregating raw pixel streams from multiple CMOS/CCD sensors in ultrasound or MRI systems before compression and display processing. IC Role / Device Role / Timing Role: High-bandwidth I/O hub synchronizing sensor data via LVDS or LVPECL; block RAM buffers frames while CPU reads via SelectMAP interface. Use Value: 393,216 bits of true dual-port RAM enables ping-pong buffering of full 1024×768 frames at 60 fps, eliminating external frame buffer memory. | Use Scenario: Coordinating real-time EtherCAT, CANopen, and analog I/O in PLC backplanes with deterministic cycle times below 100 μs. IC Role / Device Role / Timing Role: Central timing and arbitration unit managing distributed clock synchronization (DCP), PDO mapping, and safety logic execution. Use Value: 1.8 V core reduces thermal load in sealed enclosures; I/O banking permits simultaneous 24 V digital inputs, 5 V encoder signals, and 3.3 V fieldbus transceivers on single device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1000E-7FG1156C | Slower speed grade (-7 vs. -8); 133 MHz register-to-register timing vs. 125 MHz worst-case for critical paths | Suitable for cost-sensitive designs where 240 MHz system clock is not required; lower power consumption at same voltage | Select when timing margin allows relaxed setup/hold and thermal budget is constrained |
| XCV1600E-8FG1156C | Higher density (419,904 logic cells vs. 27,648); same package and pinout but larger CLB array (72×108 vs. 64×96) | Required for designs exceeding 1.5 M system gates or needing >589,824 block RAM bits; identical I/O compatibility simplifies migration | Choose for future-proofing or when additional logic resources are needed without PCB redesign |
Compared with XCV1000E-7FG1156C, the XCV1000E-8FG1156C delivers tighter timing closure for 240 MHz system clocks and 622 Mb/s LVDS, while XCV1600E-8FG1156C offers scalable logic capacity within the same FG1156 footprint-enabling incremental design upgrades without layout changes.
Availability
XCV1000E-8FG1156C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCV1000E-8FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration solutions since 1984.
The Virtex-E family was designed for high-performance, high-density logic implementation in wireline communications, military/aerospace, and instrumentation-emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.
FAQ
What is the maximum supported LVDS data rate for XCV1000E-8FG1156C?
The XCV1000E-8FG1156C supports LVDS signaling at up to 622 Mb/s, verified under source-synchronous architectures with DLL-aligned strobes. This rate is achievable using differential I/O pairs (IO_LxxN/IO_LxxP) with proper PCB layout-matched trace lengths, 100 Ω differential termination, and controlled impedance. The specification is confirmed in DS022-1 (v2.3) Table 2 and applies specifically to the -8 speed grade.
Does XCV1000E-8FG1156C support JTAG configuration?
Yes, XCV1000E-8FG1156C fully supports IEEE 1149.1 boundary-scan via dedicated TDI, TDO, TCK, and TMS pins. It enables in-system programming, debug visibility, and production testing without requiring external configuration PROMs. JTAG mode is one of four supported configuration methods-including SelectMAP, slave serial, and master serial-and is documented in DS022-4 (Pinout Tables) and DS022-2 (Functional Description).
How many block RAMs does XCV1000E-8FG1156C contain, and what is their organization?
XCV1000E-8FG1156C contains 96 block SelectRAM units, totaling 393,216 bits of synchronous memory. Each block is a true dual-port 4096-bit RAM with independently configurable data widths per port (1–36 bits), enabling built-in bus-width conversion. Memory columns are placed every 12 CLB columns starting from edges, as defined in DS022-2 Table 3 and Table 4.
Can XCV1000E-8FG1156C operate with mixed I/O standards on the same device?
Yes, XCV1000E-8FG1156C supports mixed I/O standards through its eight independent I/O banks. Each bank accepts compatible standards sharing the same VCCO (e.g., LVTTL + PCI33_3 at 3.3 V) and, where required, a common VREF. Standards like LVDS and LVPECL require no VREF and can coexist with SSTL or HSTL in adjacent banks-provided VCCO and VREF assignments comply with banking rules in DS022-2 Section "I/O Banking".
What is the core supply voltage requirement for XCV1000E-8FG1156C?
XCV1000E-8FG1156C requires a regulated 1.8 V ±3% supply on VCCINT pins for core logic, CLBs, block RAM, and DLLs. This lower voltage-compared to 2.5 V in earlier Virtex devices-reduces dynamic power while maintaining performance via the 0.18 μm process. Decoupling must meet Xilinx's recommended 100 nF + 10 μF per VCCINT pin pair, as specified in DS022-3 (DC Characteristics) and the Virtex-E Hardware User Guide.
XCV1000E-8FG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 1156-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6144
- Number of Logic Elements/Cells:
- 27648
- Total RAM Bits:
- 393216
- Number of I/O:
- 660
- Number of Gates:
- 1569178
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FBGA (35x35)
XCV1000E-8FG1156C FAQ
1.How can I place an order for XCV1000E-8FG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1000E-8FG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1000E-8FG1156C reliable?
The price and inventory of XCV1000E-8FG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1000E-8FG1156C is usually 5 days.
3.What payment methods are accepted for XCV1000E-8FG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1000E-8FG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1000E-8FG1156C?
XCV1000E-8FG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1000E-8FG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1000E-8FG1156C?
For technical support, including XCV1000E-8FG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1000E-8FG1156C requirements.
6.How does Aetrix verify that XCV1000E-8FG1156C is sourced from the original manufacturer or authorized distributors?
All XCV1000E-8FG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1000E-8FG1156C meets industry standards.
7.What is the process for return or replacement of XCV1000E-8FG1156C?
All XCV1000E-8FG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XCV1000E-8FG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1000E-8FG1156C part is unused and in its original packaging.
Return procedure for XCV1000E-8FG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV1000E-8FG1156C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
