AMD XCV1000E-8FG680C

Overview

XCV1000E-8FG680C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 1,569,178 system gates, 27,648 logic cells, and 660 user I/O pins in a 680-ball Fine-Pitch Ball Grid Array (FG680) package. It features eight digital Delay-Locked Loops (DLLs), up to 393,216 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V I/O for high-speed communication subsystems in telecom line cards.

For engineers reviewing the XCV1000E-8FG680C datasheet, pinout, applications, or equivalent options, this FPGA delivers verified 130 MHz internal performance (four LUT levels), 622 Mb/s differential I/O, 240 MHz synchronous system clock capability, and full IEEE 1149.1 boundary-scan support - critical for high-reliability embedded reconfigurable logic design.

Technical Context

The XCV1000E-8FG680C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL - with banked VCCO and VREF constraints. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and up to 4× frequency multiplication, enabling precise timing control across multi-standard I/O banks.

Key Specifications

Pinout & Package

The XCV1000E-8FG680C is housed in a 680-ball Fine-Pitch Ball Grid Array (FG680) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal reliability in industrial and telecom applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV1000E-7FG680C, the XCV1000E-8FG680C delivers 8.3% higher internal timing margin and tighter hold-time control; compared with XCV1600E-8FG680C, it offers identical speed and package with 21% lower logic density and 32% less block RAM - optimizing cost and power for mid-scale reconfigurable systems.

Availability

XCV1000E-8FG680C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, test & measurement, and avionics applications requiring stable component supply and long-term lifecycle support.

Supply support for XCV1000E-8FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was engineered for high-performance, high-density reconfigurable logic in bandwidth-intensive applications - emphasizing I/O flexibility, clock management, and memory hierarchy for telecom, military, and scientific computing.

FAQ

What is the maximum differential I/O speed supported by the XCV1000E-8FG680C?

The XCV1000E-8FG680C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Table 2 and Module 2 functional description. This speed applies to source-synchronous data transmission architectures and is validated under worst-case timing conditions for the -8 speed grade. The device achieves this using its dedicated differential I/O circuitry and DLL-synchronized clock paths, making XCV1000E-8FG680C suitable for OC-12/STM-4 interfaces and high-speed test pattern generation.

Does the XCV1000E-8FG680C support IEEE 1149.1 boundary-scan?

Yes, the XCV1000E-8FG680C includes full IEEE 1149.1-compliant boundary-scan logic integrated into its IOBs, as documented in DS022-1 page 2 and DS022-2 page 2. TDO, TDI, TCK, and TMS pins are dedicated for JTAG access, enabling in-system programming, debug visibility, and production test coverage. This capability is inherent to the Virtex-E architecture and does not require external circuitry - a key requirement for XCV1000E-8FG680C deployment in safety-critical or high-assurance systems.

How many block RAM bits are available in the XCV1000E-8FG680C?

The XCV1000E-8FG680C contains 393,216 bits of synchronous block RAM, organized as 96 blocks of 4096 bits each, per DS022-2 Table 4 and Module 1 Table 1. Each block supports true dual-port operation with independent read/write addresses and controls, enabling efficient FIFOs, ping-pong buffers, and on-chip lookup tables. This memory resource is distinct from distributed RAM and is directly accessible by CLBs via dedicated routing - a defining feature of XCV1000E-8FG680C's memory hierarchy.

Is the XCV1000E-8FG680C pin-compatible with other Virtex-E devices in the FG680 package?

Yes, the XCV1000E-8FG680C shares the same FG680 mechanical footprint and pin assignment with other Virtex-E devices offered in that package, including XCV600E-8FG680C and XCV1600E-8FG680C, as confirmed in DS022-1 Table 3 and Module 4 pinout documentation. However, I/O bank voltage assignments, VREF pin usage, and dedicated function pin allocations (e.g., GCLK locations) vary by device size - requiring careful review of the specific pinout table for XCV1000E-8FG680C before PCB reuse.

What is the core supply voltage (VCCINT) for the XCV1000E-8FG680C?

The XCV1000E-8FG680C requires a 1.8 V nominal core supply voltage (VCCINT), as specified in DS022-1 page 2 and DS022-2 page 5. This 1.8 V rail powers all CLBs, block RAM, and internal routing resources. It is distinct from VCCO (I/O bank supplies, 1.5–3.3 V) and must be tightly regulated to ±3% with low-noise decoupling to ensure timing stability - a critical design constraint for reliable XCV1000E-8FG680C operation in high-speed systems.