AMD XCV100-4BG256C

Overview

XCV100-4BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 180 user I/O pins in a 256-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 40,960 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV100-4BG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex-1 family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV100-4BG256C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaBlock local interconnect, and VersaRing I/O ring-enabling pin-locking and PCB reuse across Virtex variants. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and dual-port synchronous storage elements.

Each IOB supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, SSTL2/3, HSTL Class I/III/IV-with independent VCCO per I/O bank, optional weak-keeper, programmable slew rate, and 24 mA source / 48 mA sink drive. Four DLLs provide clock deskew and phase alignment across global clock nets, with worst-case system performance up to 200 MHz.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C). Pinout defined in DS003-4 (Module 4), with eight I/O banks (Bank 0–7), dedicated global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG boundary-scan (TCK/TMS/TDI/TDO), and VCCO/VREF per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV100-4BG256C, the XCV100-5BG256C delivers measurable timing margin improvement without architectural change, while XCV150-4BG256C offers gate-count headroom within identical footprint-both enable incremental upgrades without altering board layout or I/O signal assignments.

Availability

XCV100-4BG256C is available at Aetrix Electronics and suitable for legacy system maintenance, industrial controller refurbishment, and aerospace obsolescence mitigation requiring stable component supply and long-term traceability.

Supply support for XCV100-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering FPGA and adaptive computing solutions provider, acquired by AMD in 2022. The company developed foundational programmable logic architectures used across communications, defense, and industrial markets.

The Virtex family-including XCV100-4BG256C-was engineered for high-performance, high-density logic replacement in systems demanding 66-MHz PCI compliance, multi-standard I/O interfacing, and deterministic clock management via integrated DLLs.

FAQ

Is XCV100-4BG256C still in production?

No, XCV100-4BG256C is obsolete per Xilinx Notice XCN10016 (2013). Aetrix Electronics supplies remaining factory-new inventory with full traceability and extended lifecycle support documentation, including DS003-1 through DS003-4 (v4.0) and application notes XAPP130 and XAPP099.

What are the key power supply requirements for XCV100-4BG256C?

XCV100-4BG256C requires 2.5 V ± 3% for core (VCCINT), and bank-specific VCCO voltages (1.5 V, 2.5 V, or 3.3 V) depending on I/O standard selection. Each I/O bank needs its own VCCO rail, and VREF must be supplied per bank for standards like HSTL or SSTL. Decoupling follows Xilinx guidelines: 10 µF bulk + 0.1 µF ceramic per VCCINT/VCCO pin group.

Can XCV100-4BG256C be configured via JTAG?

Yes, XCV100-4BG256C supports IEEE 1149.1 JTAG configuration in addition to master serial, slave serial, and SelectMAP™ modes. TCK, TMS, TDI, and TDO pins enable boundary-scan testing, in-system programming, and configuration bitstream loading without external PROM.

Does XCV100-4BG256C support hot-swap operation?

Yes, XCV100-4BG256C is explicitly designed for hot-swappable Compact PCI applications per DS003-1. This requires proper sequencing of VCCINT, VCCO, and configuration signals during insertion/removal, along with appropriate I/O clamping and power ramp control per Xilinx Application Note XAPP099.

How many DLLs does XCV100-4BG256C include, and what are their primary uses?

XCV100-4BG256C integrates four dedicated delay-locked loops (DLLs) for advanced clock control. They compensate for clock distribution skew, align input capture timing with output launch timing, enable zero hold-time I/O interfaces, and support phase-shifted clock domains for source-synchronous interfaces such as DDR memory controllers.