AMD XCV100-4BG256I

Overview

XCV100-4BG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 180 user I/O pins in a 256-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 40,960 bits of block RAM and LUTs configurable as 16-bit RAM/shift register), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV100-4BG256I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL jitter specs, CLB-level timing parameters, and industrial-temperature (-40°C to +100°C) operation confirmation per DS003-1 v4.0.

Technical Context

The XCV100-4BG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain two slices each with four logic cells (LCs), carry chains, F5/F6 multiplexers for 5–19-input functions, and dual-port block RAMs organized in two full-height columns.

Each IOB supports SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV, and SSTL2/3 - with banked VCCO (2.5 V / 3.3 V) and VREF (1.25 V / 1.5 V) constraints. Configuration occurs via master serial, slave serial, SelectMAP™, or JTAG modes using SRAM-based bitstream loading.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, 17 mm × 17 mm body size, RoHS-compliant per DS003-1 Module 4 pinout tables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV100-4BG256I, the -5 variant offers margin for timing-critical paths without layout changes, while the XCV150-4BG256I provides scalable logic and I/O headroom within the same footprint - both retain identical industrial temperature rating and configuration methodology.

Availability

XCV100-4BG256I is available at Aetrix Electronics and suitable for industrial motion control, high-speed data acquisition, and communications protocol converter applications requiring stable component supply across extended lifecycle planning.

Supply support for XCV100-4BG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, with global design and support infrastructure.

The Virtex family - including XCV100-4BG256I - was engineered for high-performance, high-density logic replacement in industrial, aerospace, and communications systems where reconfigurability, I/O flexibility, and deterministic timing are critical.

FAQ

What is the maximum system clock frequency supported by XCV100-4BG256I?

XCV100-4BG256I supports synchronous system clock rates up to 200 MHz, including I/O timing, as confirmed in DS003-1 Section "Higher Performance". This applies under worst-case industrial temperature (-40°C to +100°C) and voltage conditions with speed grade -4 timing models. Real-world achievable frequency depends on design placement and routing, but representative circuits (e.g., register-to-register paths) achieve 5.0 ns propagation delay.

Does XCV100-4BG256I support hot-swap operation in Compact PCI systems?

Yes, XCV100-4BG256I is explicitly designed for hot-swappable Compact PCI applications per DS003-1 Feature list. Its I/O structure, power sequencing behavior, and robust ESD protection (including 5 V-tolerant LVTTL inputs) meet Compact PCI mechanical and electrical hot-swap requirements. Configuration integrity during insertion/removal is maintained via JTAG or SelectMAP™ fallback modes.

How many block RAMs does XCV100-4BG256I contain, and what are their port configurations?

XCV100-4BG256I contains ten 4,096-bit block SelectRAMs totaling 40,960 bits, as specified in DS003-2 Table 3. Each block is a fully synchronous dual-ported RAM with independent address, data, and control buses per port. Port widths are configurable (1–16 bits) with corresponding depth adjustment (4096–256 words), enabling built-in bus-width conversion without external logic.

What I/O standards are supported by XCV100-4BG256I, and how are they banked?

XCV100-4BG256I supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV, and SSTL2/3, as listed in DS003-2 Table 1. These are grouped into eight I/O banks (two per side), each requiring a common VCCO voltage and - where applicable - a shared VREF. For example, SSTL2 I/O must be isolated in banks using 2.5 V VCCO and 1.25 V VREF, while HSTL Class IV requires 1.5 V VCCO and 0.9 V VREF.

Is XCV100-4BG256I still in active production, and what is its obsolescence status?

No, XCV100-4BG256I is obsolete. DS003-1 v4.0 (March 2013) explicitly states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Xilinx discontinued the Virtex family in favor of Spartan and Virtex-II successors. Aetrix Electronics supplies remaining factory-new inventory with full traceability and extended lifecycle support documentation.