AMD XCV100-4CS144C

Overview

XCV100-4CS144C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 94 user I/O pins in a 144-ball chip-scale package. It features four delay-locked loops (DLLs), hierarchical memory (LUTs as 16-bit RAM/shift register/dual-port RAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV100-4CS144C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, SelectIO™ standard support, DLL jitter specs, and CLB-level timing parameters directly traceable to DS003-1 (v4.0) and DS003-4.

Technical Context

The XCV100-4CS144C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual BUFTs per CLB for internal 3-state bus driving.

Each IOB supports independent input/output flip-flops with programmable synchronous/asynchronous set/reset, clock enable, and polarity control. I/O banks enforce strict VCCO/VREF voltage partitioning: CS144 package has four VCCO domains (bank pairs sharing sides), eight independent VREF banks, and no internal VCCO bonding - allowing mixed 3.3 V (LVTTL, PCI) and 2.5 V (LVCMOS2, SSTL2) standards within compatible bank groupings.

Key Specifications

Pinout & Package

Package: 144-ball Chip-Scale Package (CS144), 0.5 mm pitch, body size 10.0 × 10.0 mm, RoHS-compliant, thermal pad optional. Pin mapping follows DS003-4 Module 4; I/O banks are assigned per side (Bank 0–1 top, Bank 2–3 right, Bank 4–5 bottom, Bank 6–7 left), with VCCO and VREF pins distributed per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV100-4CS144C, the -5 variant delivers marginal timing margin at higher static power, while the XCV150-4CS144C scales logic and memory capacity without changing board layout - making both viable for design evolution, though neither is pin-compatible with newer Virtex-II or Spartan families.

Availability

XCV100-4CS144C is available at Aetrix Electronics and suitable for PCI bridge controllers, high-speed data acquisition systems, communications protocol stacks, and legacy interface emulators requiring stable component supply amid long-life industrial and aerospace programs.

Supply support for XCV100-4CS144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA architectures enable customizable digital system design across aerospace, communications, and industrial markets.

The Virtex family - including XCV100-4CS144C - was engineered for high-performance, high-density logic replacement in systems demanding 200 MHz operation, multi-standard I/O, and deterministic clock management, targeting ASIC prototyping and production acceleration.

FAQ

What does the '-4' speed grade mean for XCV100-4CS144C?

The '-4' speed grade indicates guaranteed worst-case timing performance per DS003-3: maximum clock-to-output delay (T_CKO) of 4.5 ns for global clock nets, 5.0 ns for register-to-register paths, and 4.4 ns for address decoders. This grade balances timing margin, power consumption, and cost for commercial-temperature applications where 160–180 MHz system clocks are typical. XCV100-4CS144C meets these specs across 0°C to +85°C with 2.5 V core supply.

Is XCV100-4CS144C still in production or obsolete?

XCV100-4CS144C is marked obsolete per DS003-1 (v4.0) revision history dated March 2013 and Xilinx Notice XCN10016. No new manufacturing lots are produced; Aetrix Electronics supplies remaining factory-new inventory with full traceability and extended lifecycle support documentation. Engineering samples and legacy program fulfillment remain available under controlled allocation.

Can XCV100-4CS144C interface directly with 3.3 V PCI slots?

Yes - XCV100-4CS144C supports 3.3 V PCI signaling per Table 1 in DS003-2: its IOBs implement PCI 3.3 V standard with 3.3 V VCCO, 24 mA drive strength, and hot-swap compliance. External 52 Ω series termination and 100 Ω parallel termination are required per PCI specification; no level shifters needed. The device passes PCI SIG compliance testing when configured per Xilinx Application Note XAPP121.

How many block RAMs does XCV100-4CS144C include, and what configurations are supported?

XCV100-4CS144C contains 10 block SelectRAMs totaling 40,960 bits (10 × 4,096-bit dual-ported RAMs). Each block supports independent port widths (1–16 bits) and depths (256–4096), with aspect ratios defined in DS003-2 Table 4. Configurations include 256×16, 512×8, 1024×4, 2048×2, and 4096×1 - enabling flexible FIFO depth/width trade-offs and synchronous dual-port lookup tables without consuming CLB resources.

What development tools support XCV100-4CS144C design and programming?

XCV100-4CS144C is fully supported by Xilinx Foundation Series and Alliance Series software (v3.1–v5.2), including schematic entry, VHDL/Verilog synthesis, place-and-route, timing analysis, and bitstream generation. Programming modes include JTAG (via IMPACT), slave serial, SelectMAP™, and master serial PROM. Legacy toolchains remain functional; no migration to ISE or Vivado is required or supported for this device.