AMD XCV100-4CS144I

Overview

XCV100-4CS144I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 94 user I/O pins in a 144-ball chip-scale package. It integrates four delay-locked loops (DLLs), supports 16 SelectIO™ standards including LVTTL and HSTL Class IV, and delivers up to 200 MHz system performance for high-speed digital signal processing and PCI-66 compliant interface design.

For engineers reviewing the XCV100-4CS144I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, block RAM configuration options, DLL jitter specifications, and industrial-temperature (-40°C to +100°C) operation context critical for legacy system maintenance and obsolescence mitigation.

Technical Context

The XCV100-4CS144I implements a hierarchical routing architecture with general-purpose routing matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers, and dedicated carry chains enabling high-speed arithmetic.

I/O functionality is organized into eight independent banks, each requiring shared VCCO and single VREF voltage; the CS144 package supports four distinct VCCO domains due to internal bank-pair interconnection. All IOBs include IEEE 1149.1 boundary-scan logic, programmable slew rate, and 5 V-tolerant inputs for LVTTL/PCI standards.

Key Specifications

Pinout & Package

The XCV100-4CS144I uses a 144-ball fine-pitch chip-scale package (CS144) with 0.5 mm pitch, measuring 10 mm × 10 mm. I/O is organized into eight banks (Bank 0–7), with VCCO and VREF pins assigned per bank; Bank pairs on shared edges are internally connected, allowing four independent VCCO domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100-4CS144I, the -5 speed grade offers improved timing margin without layout change, while the XCV150-4CS144I provides 51% more logic cells within the same 144-ball footprint-enabling feature upgrades without redesigning power delivery or thermal management.

Availability

XCV100-4CS144I is available at Aetrix Electronics and suitable for industrial control systems, telecom line cards, and high-speed data acquisition platforms requiring stable component supply amid ongoing obsolescence management.

Supply support for XCV100-4CS144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family to deliver high-performance, reconfigurable logic for demanding digital systems.

The Virtex family was designed for applications requiring high-speed signal processing, protocol bridging, and flexible hardware acceleration-targeting telecom infrastructure, test equipment, and industrial automation where performance and adaptability are critical.

FAQ

What is the maximum operating frequency of the XCV100-4CS144I?

The XCV100-4CS144I achieves up to 200 MHz system clock performance under worst-case timing conditions, including I/O paths. This figure is validated across representative circuits such as register-to-register transfers and pipelined multipliers, and assumes proper PCB layout, power integrity, and DLL usage for clock deskew. Actual frequency depends on design complexity and placement-routing quality.

Does the XCV100-4CS144I support hot-swap operation?

Yes, the XCV100-4CS144I supports hot-swappable operation for Compact PCI applications. Its I/O structure, power sequencing behavior, and configuration architecture meet Compact PCI hot-swap requirements, enabling insertion and removal while the backplane remains powered. This capability is documented in DS003-1 and applies specifically to the XCV100-4CS144I industrial-grade variant.

How many block RAMs does the XCV100-4CS144I contain?

The XCV100-4CS144I contains ten 4k-bit block SelectRAMs, totaling 40,960 bits of dedicated synchronous dual-ported memory. Each block supports independent read/write widths (e.g., 16×256 or 8×512) and connects directly to CLBs and adjacent block RAMs via dedicated routing, enabling efficient FIFO, buffer, and lookup table implementations without consuming logic resources.

What I/O standards are supported by the XCV100-4CS144I?

The XCV100-4CS144I supports 16 SelectIO™ standards including LVTTL (5 V tolerant), LVCMOS2, PCI 3.3 V, HSTL Class I/III/IV, SSTL2/SSTL3, GTL/GTL+, and CTT. I/O banks enforce VCCO and VREF compatibility rules-e.g., HSTL Class IV requires 1.5 V VCCO and 0.9 V VREF per bank-and mixing incompatible standards within one bank is prohibited.

Is the XCV100-4CS144I still in production?

No, the XCV100-4CS144I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is listed under "Product Obsolete/Under Obsolescence" with no active manufacturing. Aetrix Electronics provides traceable, tested inventory for legacy system sustainment, with full documentation and lifecycle coordination support for continued deployment in installed base applications.