AMD XCV100-4FG256C

Overview

XCV100-4FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 176 user I/O pins in a 256-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 4 primary global clock nets plus 24 local clock nets, and configurable LUT-based memory (16-bit RAM/Shift Register/dual-port modes). It targets high-speed digital systems requiring PCI-66 MHz compliance and hot-swap capability in CompactPCI.

For engineers reviewing the XCV100-4FG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard support matrix, and migration guidance from legacy Virtex devices.

Technical Context

The XCV100-4FG256C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaBlock-local interconnect, and VersaRing peripheral routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual flip-flops per LUT with independent clock enable, synchronous/asynchronous set/reset.

I/O functionality is organized into eight banks, each supporting mixed voltage standards under shared VCCO (e.g., 3.3 V for LVTTL/PCI/SSTL3) and optional VREF (e.g., 0.75 V for HSTL Class I). Each IOB includes input/output flip-flops, programmable delays, weak-keeper circuits, and IEEE 1149.1 boundary-scan logic - all operating at up to 200 MHz system performance with 5.0 ns register-to-register delay.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256) with 256 balls, 1.0 mm pitch, and 17 mm × 17 mm body size. Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - full pin function mapping available in official pinout tables. I/O banks are distributed across four edges (Bank 0–7), with dedicated VCCO, VREF, GCLK, and configuration pins (e.g., INIT, PROGRAM, CCLK, DONE).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic applications.

Compared with XCV100-4FG256C, the -5 variant offers improved timing margin without layout change, while the XCV150-4FG256C provides headroom for logic expansion but requires PCB redesign due to altered pinout and bank allocation - making the -4 grade optimal for cost-sensitive, volume-deployed systems at its performance envelope.

Availability

XCV100-4FG256C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging subsystems, communications backplane interfaces, and test equipment pattern generation requiring stable component supply amid obsolescence transitions.

Supply support for XCV100-4FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex family - including XCV100-4FG256C - was engineered for high-speed, high-density applications demanding ASIC-like performance with field reprogrammability, targeting communications infrastructure, industrial automation, and advanced test systems.

FAQ

Is XCV100-4FG256C still in production?

No - XCV100-4FG256C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Xilinx issued obsolescence notice XCN10016. Aetrix Electronics maintains limited legacy inventory with full traceability and offers engineering support for migration paths to Spartan-7 or Kintex-7 equivalents where feasible.

What configuration modes does XCV100-4FG256C support?

XCV100-4FG256C supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial (bitstream loaded via DIN), SelectMAP™ (8- or 16-bit parallel interface), and JTAG (boundary-scan programming). Mode selection is controlled by M0–M2 pins at power-up; all modes use SRAM-based volatile configuration.

Can XCV100-4FG256C interface directly with DDR SDRAM?

Yes - XCV100-4FG256C supports SSTL2 Class I/II (2.5 V) and SSTL3 Class I/II (3.3 V) I/O standards required for DDR SDRAM interfaces. Its DLLs enable precise clock-to-out timing control, and its 176 I/O pins allow full address/control bus plus bidirectional data lines - though external PHY or termination may be needed for >133 MHz operation.

Does XCV100-4FG256C include on-chip analog functionality?

No - XCV100-4FG256C contains no ADCs, DACs, or analog sensors. It does integrate a die-temperature sensor diode (as noted in DS003-1), but this requires external biasing and measurement circuitry; it is not a calibrated or digitized temperature output.

What is the maximum operating junction temperature for XCV100-4FG256C?

The 'C' suffix in XCV100-4FG256C denotes Commercial temperature range: junction temperature (T_J) from 0°C to +85°C. This rating applies under specified V_CCINT = 2.5 V ± 3%, V_CCO = 3.3 V/2.5 V/1.5 V ± 5%, and appropriate thermal dissipation per DS003-3 DC characteristics.