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AMD XCV100-4FG256I

Part No.:
XCV100-4FG256I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXCV100-4FG256I.pdf
Description:
IC FPGA 176 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,617

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Product details

Overview

XCV100-4FG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, and 180 user I/O pins in a 256-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (LUTs as 16-bit RAM/shift register/dual-port RAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV100-4FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its industrial temperature range (–40°C to +100°C), 200 MHz system performance ceiling, 4k-bit configurable dual-ported block RAM per unit, and SelectIO™ support for LVTTL, SSTL2, HSTL, and GTL standards.

Technical Context

The XCV100-4FG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling efficient place-and-route for complex synchronous designs. Its CLB contains two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and dual flip-flops with independent clock enable, set/reset, and polarity control.

Each IOB supports IEEE 1149.1 boundary scan, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and selectable weak-keeper or pull-up/pull-down resistors. I/O banking enforces VCCO and VREF voltage grouping across eight banks, restricting mixed-standard usage within a bank unless compatible per Table 2 (e.g., SSTL2 and LVCMOS2 share 2.5 V VCCO).

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 108,904 - defines logic capacity for ASIC replacement in mid-complexity digital systems
Logic Cells 2,700 - each includes 4 LUTs + flip-flops + carry logic, enabling arithmetic and state-machine implementation
User I/O Pins 180 - available in FG256 package; supports multi-standard interfaces without external level shifters
Block RAM 40,960 bits - organized as ten 4k-bit dual-ported synchronous RAM blocks for FIFOs or buffer memory
Max System Frequency 200 MHz - achievable in register-to-register paths with DLL compensation and proper timing closure
Speed Grade -4 - specifies worst-case propagation delay (e.g., 5.4 ns for 16:1 MUX, 5.0 ns for pipelined 8×8 multiplier)
Operating Temperature –40°C to +100°C - qualified for industrial environments including motor control and base station equipment

Pinout & Package

Package: 256-ball Fine-pitch Ball Grid Array (FG256), 1.0 mm ball pitch, body size 17 mm × 17 mm, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Four dedicated low-skew inputs feeding DLLs; required for synchronous domain management
PROGRAM_B Active-Low Configuration Initiate Resets configuration memory and forces reinitialization from external PROM or host controller
DONE Configuration Completion Indicator Open-drain output asserted high when bitstream loading and startup sequence complete
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface IEEE 1149.1-compliant test access port for programming, debugging, and in-system verification
VCCINT Core Supply Voltage 2.5 V ± 3% supply for CLBs and internal logic; decoupling critical for signal integrity above 100 MHz
VCCO_0–VCCO_7 I/O Bank Output Supply Eight independent VCCO pins (one per bank); each sets output voltage level (e.g., 3.3 V, 2.5 V, or 1.5 V)
VREF_0–VREF_7 I/O Bank Reference Voltage Eight VREF inputs (one per bank); required for SSTL/HSTL/GTL input threshold setting

Key Features

Feature Design Value
Delay-Locked Loops (DLLs) Four dedicated DLLs provide zero-hold-time clock deskew and phase alignment across large die areas
LUT-as-RAM Mode Each 4-input LUT configures as 16×1-bit synchronous RAM, 16×2-bit, 32×1-bit, or 16×1-bit dual-port RAM
SelectIO™ Interface Supports 16 standards including LVTTL, SSTL2, HSTL Class I/III/IV, GTL+, and PCI 3.3 V/5 V
Carry Chain Arithmetic Dedicated 2-bit-per-CLB carry chain enables high-speed adders, counters, and accumulators without LUT resource cost
Configurable I/O Registers Each IOB contains three edge-triggered DFFs with independent CE, SR/BY, and polarity control for timing-critical interfaces

Applications

PCI Bridge Controller Industrial Motion Control

Use Scenario: FPGA acts as a bridge between legacy PCI peripherals and modern microcontroller subsystems in factory automation PLCs.

IC Role / Device Role / Timing Role: Configurable protocol translator with 66-MHz PCI compliance, DLL-synchronized timing, and on-die 4k-bit dual-port RAM for descriptor buffering.

Use Value: Eliminates need for discrete PCI interface ASICs while supporting hot-swap capability per Compact PCI spec.

Use Scenario: Real-time closed-loop servo positioning using encoder feedback, PWM generation, and safety monitoring in CNC drives.

IC Role / Device Role / Timing Role: Deterministic logic fabric executing position loop at 20 kHz with sub-100 ns jitter via dedicated carry chains and global clock nets.

Use Value: Enables single-chip integration of motion profiling, current sensing interface, and safe torque off (STO) logic per IEC 61800-5-2.

Baseband Signal Processor High-Speed Data Acquisition

Use Scenario: Wireless infrastructure transceiver processing IQ data streams from ADC/DAC at 60+ MSPS in LTE femtocell units.

IC Role / Device Role / Timing Role: Synchronous datapath engine implementing channel filtering, gain control, and packet framing using distributed LUT RAM and block RAM buffers.

Use Value: Achieves 180 MHz I/O timing with HSTL Class IV for DDR2 memory interfacing and low-jitter clock recovery via DLL.

Use Scenario: Multi-channel oscilloscope front-end capturing analog signals at 100+ MS/s with real-time triggering and waveform buffering.

IC Role / Device Role / Timing Role: High-speed parallel capture engine synchronizing 16-bit ADC outputs, timestamping events, and managing burst-mode SRAM writes.

Use Value: Leverages 180 I/O pins and 40,960-bit block RAM to sustain 200 MB/s sustained write bandwidth without external memory bottleneck.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV100-5FG256I Faster speed grade (–5 vs –4); 0.9 ns shorter Tco and Tsu in critical paths Better suited for 166+ MHz system clocks or tighter setup/hold margins Select XCV100-5FG256I only if timing closure fails with –4 grade under worst-case voltage/temperature
XCV150-4FG256I Higher density (164,674 gates, 3,888 logic cells, 260 I/O) in same FG256 package footprint Enables design scalability without PCB redesign; requires updated pin constraints and power delivery Choose XCV150-4FG256I when future feature expansion or additional interface channels are anticipated

Compared with XCV100-4FG256I, the –5 speed grade improves timing margin without changing logic utilization or I/O count, while the XCV150-4FG256I offers headroom for gate growth but increases static power and configuration time.

Availability

XCV100-4FG256I is available at Aetrix Electronics and suitable for industrial motion control, PCI-based instrumentation, and high-speed data acquisition systems requiring stable component supply throughout extended product lifecycles.

Supply support for XCV100-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family - including XCV100-4FG256I - was engineered for high-performance, high-density system-level logic replacement in telecom infrastructure, industrial automation, and military/aerospace applications demanding deterministic timing and multi-standard I/O.

FAQ

What is the maximum operating frequency of the XCV100-4FG256I?

The XCV100-4FG256I achieves up to 200 MHz system clock rates in register-to-register paths when using DLL-compensated global clocks and meeting timing constraints. Worst-case path delays (e.g., 16:1 multiplexer) are specified at 5.4 ns for the –4 speed grade, consistent with DS003-1 v4.0 timing tables.

Does the XCV100-4FG256I support hot-swap operation?

Yes, the XCV100-4FG256I supports hot-swap functionality per Compact PCI specifications. This is enabled by its 2.5 V core supply tolerance, robust I/O clamping structures, and programmable weak-keeper circuits that maintain pin states during insertion/removal sequences.

How many block RAMs does the XCV100-4FG256I contain?

The XCV100-4FG256I contains ten 4,096-bit block SelectRAM units totaling 40,960 bits. Each block is a fully synchronous, dual-ported RAM with independent address/data buses and configurable width/depth ratios (e.g., 16×256 or 8×512).

What I/O standards are supported by the XCV100-4FG256I?

The XCV100-4FG256I supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V/5 V, SSTL3/SSTL2 Classes I & II, HSTL Classes I/III/IV, GTL, GTL+, CTT, AGP, and HSTL. Compatibility depends on per-bank VCCO/VREF assignment as defined in DS003-2.

Is the XCV100-4FG256I still in active production?

No - the XCV100-4FG256I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It remains available through Aetrix Electronics' legacy component program with full traceability, extended lifecycle support, and obsolescence mitigation planning for ongoing production.

XCV100-4FG256I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Total RAM Bits:
40960
Number of I/O:
176
Number of Gates:
108904
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XCV100-4FG256I FAQ

1.How can I place an order for XCV100-4FG256I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV100-4FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV100-4FG256I reliable?

The price and inventory of XCV100-4FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100-4FG256I is usually 5 days.

3.What payment methods are accepted for XCV100-4FG256I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100-4FG256I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV100-4FG256I?

XCV100-4FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV100-4FG256I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV100-4FG256I?

For technical support, including XCV100-4FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100-4FG256I requirements.

6.How does Aetrix verify that XCV100-4FG256I is sourced from the original manufacturer or authorized distributors?

All XCV100-4FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100-4FG256I meets industry standards.

7.What is the process for return or replacement of XCV100-4FG256I?

All XCV100-4FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCV100-4FG256I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV100-4FG256I part is unused and in its original packaging.

Return procedure for XCV100-4FG256I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV100-4FG256I Tags

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