AMD XCV100-4TQ144C

Overview

XCV100-4TQ144C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, and 98 user I/O pins in a 144-pin Thin Quad Flat Pack (TQFP) package. It features four delay-locked loops (DLLs), hierarchical memory (including 40,960-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV100-4TQ144C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, LVCMOS2, HSTL, SSTL), and migration guidance from legacy Virtex devices.

Technical Context

The XCV100-4TQ144C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–6 input functions, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

I/O functionality is organized into eight banks; each bank requires shared VCCO voltage and supports only compatible standards (e.g., 3.3 V banks support LVTTL, PCI, SSTL3; 1.5 V banks support HSTL Class I/III/IV). The TQ144 package has bonded VCCO pins, mandating single-supply operation across all I/O banks, and includes dedicated boundary-scan (IEEE 1149.1) circuitry and die-temperature sensor diode.

Key Specifications

Pinout & Package

Package: 144-pin Thin Quad Flat Pack (TQ144), 20 × 20 mm body, 0.5 mm pitch, lead-free (Pb-free) compliant. All VCCO pins internally bonded - requires single 2.5 V supply for all I/O banks. Eight I/O banks (Bank 0–7) defined per edge quadrant; no VREF pins in TQ144 package.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV100-4TQ144C, the -5 speed grade offers improved timing margin for high-frequency control loops, while the XCV150-4TQ144C provides headroom for feature expansion within the same mechanical and thermal envelope - both retain full compatibility with Virtex development tools and configuration infrastructure.

Availability

XCV100-4TQ144C is available at Aetrix Electronics and suitable for industrial control systems, legacy avionics upgrades, and high-speed test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XCV100-4TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and EDA tool integration for high-performance digital design.

The Virtex family was designed for high-capacity, high-speed system-level logic replacement - targeting applications demanding >100 MHz operation, embedded memory, and multi-standard I/O interfacing in telecommunications, aerospace, and test instrumentation.

FAQ

What is the maximum operating temperature range for XCV100-4TQ144C?

The XCV100-4TQ144C is rated for commercial temperature operation (0°C to +85°C junction temperature). This is indicated by the "C" suffix in the part number. Industrial-grade variants (e.g., XCV100-4TQ144I) support –40°C to +100°C, but the C-grade version must not exceed +85°C under sustained load to ensure reliable SRAM configuration retention and timing compliance.

Does XCV100-4TQ144C support 5 V-tolerant I/O?

Yes, XCV100-4TQ144C supports 5 V-tolerant inputs for LVTTL and PCI 5 V standards, implemented via internal Zener-like clamping to ground. However, outputs are not 5 V-driven - they operate at VCCO = 2.5 V, and 5 V tolerance applies only to input pins. Mixing 5 V-tolerant and non-tolerant standards (e.g., HSTL) within the same I/O bank is prohibited due to VREF requirements.

Can XCV100-4TQ144C be configured via JTAG only, without external PROM?

Yes, XCV100-4TQ144C supports JTAG configuration mode, enabling full in-system programming and debugging without external configuration PROM. In this mode, configuration bitstream is loaded via TCK/TMS/TDI/TDO pins using IEEE 1149.1 boundary-scan instructions. JTAG also supports readback, verification, and partial reconfiguration - making it ideal for development and field updates.

How many DLLs does XCV100-4TQ144C include, and what are their primary uses?

XCV100-4TQ144C integrates four dedicated delay-locked loops (DLLs), each assigned to one of the four global clock inputs (GCLK0–GCLK3). These DLLs provide zero-delay clock buffering, duty-cycle correction, and phase alignment across clock domains - essential for synchronizing PCI interfaces, DDR memory controllers, or multi-channel ADC sampling. Each DLL drives one primary global clock net with low skew (<150 ps).

Is XCV100-4TQ144C still in production, and what is its obsolescence status?

XCV100-4TQ144C is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and is no longer manufactured. However, Aetrix Electronics maintains traceable, tested inventory sourced from authorized channels and supports lifecycle management including last-time-buy planning, cross-reference validation, and migration path assessment to Spartan-6 or Artix-7 families where functionally appropriate.