AMD XCV100-4TQ144I

Overview

XCV100-4TQ144I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 98 user I/O pins in a 144-pin Thin Quad Flat Pack (TQFP) package. It features four delay-locked loops (DLLs), hierarchical memory (LUTs as 16-bit RAM/shift register, 4k-bit dual-ported block RAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV100-4TQ144I datasheet, pinout, applications, or equivalent options, key selection criteria include industrial temperature range (–40°C to +100°C), -4 speed grade (max 200 MHz system performance), TQ144 package I/O count and routing constraints, and SelectIO™ interface compatibility with LVTTL, LVCMOS2, and PCI 3.3 V standards.

Technical Context

The XCV100-4TQ144I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four global low-skew clock distribution networks. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5-/6-input functions, and BUFTs for internal 3-state bus driving.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. I/O banking enforces shared VCCO per bank (3.3 V, 2.5 V, or 1.5 V), with eight banks defined across the TQ144 perimeter.

Key Specifications

Pinout & Package

Package: 144-pin Thin Quad Flat Pack (TQ144), 20×20 mm body, 0.5 mm pitch, lead-free (Pb-free) compatible, with exposed thermal pad (non-electrical). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - Pinout Tables, where pins are grouped into eight I/O banks (Bank 0–7), each requiring common VCCO and optionally shared VREF.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV100-4TQ144I, the -5 variant improves maximum operating frequency but offers no additional logic or memory; the XCV150-4TQ144I retains identical packaging and I/O while delivering 51% more logic cells - enabling scalable architecture without layout revision.

Availability

XCV100-4TQ144I is available at Aetrix Electronics and suitable for industrial motion control, PCI-compliant instrumentation, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XCV100-4TQ144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and tools for high-performance digital system design.

The Virtex family was designed for high-speed, high-capacity logic implementation in communications infrastructure, industrial automation, and aerospace systems - emphasizing routing efficiency, clock management, and multi-standard I/O flexibility.

FAQ

What is the maximum operating frequency supported by XCV100-4TQ144I?

XCV100-4TQ144I is rated for system performance up to 200 MHz, including I/O paths, as guaranteed by its -4 speed grade. This applies to register-to-register logic, carry-chain arithmetic, and I/O timing under worst-case industrial temperature (-40°C to +100°C) and voltage (2.5 V ±5%) conditions. Actual achievable frequency depends on design placement, routing, and resource utilization - verified via Xilinx ISE timing analysis.

Does XCV100-4TQ144I support hot-swap operation in Compact PCI systems?

Yes, XCV100-4TQ144I supports hot-swappable operation in Compact PCI systems. Its I/O architecture meets Compact PCI hot-swap electrical requirements, including controlled power-up sequencing, high-impedance default states on configuration pins, and robust ESD protection. The device enters high-Z I/O state upon PROGRAM_B assertion and maintains safe voltage thresholds during insertion/removal per PICMG 2.1 specification.

Can XCV100-4TQ144I interface directly with 3.3 V LVTTL and 2.5 V LVCMOS2 devices simultaneously?

Yes, XCV100-4TQ144I can interface with both 3.3 V LVTTL and 2.5 V LVCMOS2 devices simultaneously - but only if they reside in separate I/O banks. Each bank requires a single VCCO voltage; Bank 0 may use 3.3 V for LVTTL, while Bank 1 uses 2.5 V for LVCMOS2. Mixing standards within one bank is prohibited unless they share the same VCCO, as defined in Table 2 of DS003-2.

How many block RAMs does XCV100-4TQ144I contain, and what are their configurations?

XCV100-4TQ144I contains ten 4k-bit block SelectRAMs (40,960 total bits), each configurable as synchronous dual-ported RAM with independent address/data/control per port. Supported port widths include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible FIFO depth/width trade-offs and built-in bus-width conversion without external glue logic.

Is XCV100-4TQ144I still in production, and what is its obsolescence status?

XCV100-4TQ144I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with discontinuation confirmed in XCN10016. Aetrix Electronics maintains legacy inventory and offers long-term supply support, including traceable batch sourcing, configuration bitstream archiving, and migration path advisory for Virtex-II or Spartan-6 replacements where functionally appropriate.