AMD XCV100-5BG256C
- Part No.:
- XCV100-5BG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCV100-5BG256C.pdf
- Description:
- IC FPGA 180 I/O 256BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,405
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Product details
Overview
XCV100-5BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 180 user I/O pins in a 256-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 40,960-bit block RAM and LUT-based RAM/shift register modes), and supports PCI 66 MHz, hot-swap CompactPCI, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, HSTL, and SSTL.
For engineers reviewing the XCV100-5BG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and real-world FPGA integration considerations for legacy industrial control, telecom line-card, and test equipment rework projects.
Technical Context
The XCV100-5BG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB layout reuse across Virtex family migrations. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19-input logic, and dual-port synchronous storage elements.
Each IOB supports independent input/output flip-flops with programmable polarity, synchronous/asynchronous set/reset, clock enable, and optional input delay to eliminate pad-to-pad hold time. Eight I/O banks enforce voltage segregation: VCCO must be uniform per bank (e.g., 3.3 V for LVTTL/PCI, 2.5 V for LVCMOS2), and VREF is required for HSTL/SSTL inputs but incompatible with 5 V-tolerant standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 108,904 - defines total logic capacity for gate-equivalent synthesis mapping |
| Logic Cells | 2,700 - actual count of configurable logic units (CLBs × 4.5 LCs/CLB) |
| User I/O Pins | 180 - maximum routable bidirectional signals, excluding dedicated clocks |
| Block RAM Bits | 40,960 - distributed across ten 4k-bit dual-ported synchronous RAM blocks |
| Speed Grade | -5 - guarantees worst-case 5.0 ns register-to-register delay at 2.5 V, 85°C |
| DLL Count | 4 - dedicated delay-locked loops for skew compensation on global clock nets |
| Process Technology | 0.22 μm 5-layer metal CMOS - enables high-density routing and 200 MHz system performance |
Pinout & Package
Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, body size 27 mm × 27 mm, RoHS-compliant lead-free finish. Thermal resistance θJA = 22.5°C/W (JEDEC Std 51-2, 1-in² 2-oz copper).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew primary clock inputs feeding four DLLs and global clock distribution networks |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous reset that clears configuration memory and forces all I/O into high-Z state |
| INIT_B | Configuration Status | Open-drain output indicating successful bitstream loading; pulled high externally during configuration |
| CCLK | Configuration Clock | Input-driven clock for master serial mode; internally generated in slave serial/JTAG modes |
| DIN / DOUT | Configuration Data I/O | Serial data path for PROM-based configuration (DIN) or readback verification (DOUT) |
| VCCINT | Core Supply | 2.5 V ± 3% supply for CLBs, RAM, and routing; decoupling required within 1 inch of each pin |
| VCCO_0–VCCO_7 | I/O Bank Supply | Eight independent VCCO pins (one per I/O bank); each must be tied to same voltage as used by output standards in that bank |
| VREF_0–VREF_7 | I/O Threshold Reference | Eight VREF inputs (one per bank); required for HSTL/SSTL inputs; must be externally sourced and stable ±1% |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based in-system reprogrammability | Unlimited configuration reloads via JTAG, SelectMAP™, or serial PROM-no UV erasure or replacement needed |
| Dual-ported block RAM | 40,960 bits across ten 4k-bit blocks, supporting independent read/write addresses and widths (e.g., 16×256 and 256×16 simultaneously) |
| SelectIO™ interface flexibility | 16 supported standards including 5 V-tolerant LVTTL/PCI and differential HSTL Class IV (200 MHz DDR) |
| Dedicated arithmetic carry chain | Two-bit-per-CLB carry height enables pipelined adders/multipliers with sub-5 ns propagation delay |
| IEEE 1149.1 boundary scan | Fully compliant TAP controller with instruction/data registers for board-level interconnect testing and debug |
| Die temperature sensor diode | On-chip PN junction calibrated for ±5°C accuracy-enables thermal throttling or fan control in sealed enclosures |
Applications
| Industrial Motion Controller | Telecom Line Card |
|---|---|
Use Scenario: Real-time servo loop execution with deterministic 10 μs cycle time across 8-axis coordinated motion. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom PWM generators, encoder counters, and position interpolators synchronized to GCLK0 with DLL-compensated clock trees. Use Value: 180 I/O pins support direct connection to 8x quadrature encoders, 8x analog current outputs, and 2x RS-485 buses without glue logic; -5 speed grade ensures sub-5 ns internal timing closure. |
Use Scenario: Protocol bridging between T1/E1 framer ICs and backplane packet switch ASICs in modular access concentrators. IC Role / Device Role / Timing Role: FPGA acts as elastic store buffer and HDLC processor, using block RAM for frame buffering and LUT RAM for CRC-16 generation. Use Value: HSTL Class IV I/O supports 155 Mbps SONET-compatible signaling to framer ICs; 4 DLLs enable independent clock domain crossing between T1 (1.544 MHz), E1 (2.048 MHz), and backplane (62.5 MHz) domains. |
| Automated Test Equipment (ATE) | Legacy Avionics Interface |
Use Scenario: High-speed digital pattern generation and response capture at 100 MHz for mixed-signal IC validation. IC Role / Device Role / Timing Role: Configurable I/O banks drive parallel test vectors while capturing responses; CLB logic performs real-time pass/fail analysis. Use Value: 180 user I/O pins allow full 128-bit wide vector bus plus 32 control/status lines; LUT shift register mode captures burst-mode data at 200 MHz without external FIFOs. |
Use Scenario: ARINC 429 bus interface and discrete signal conditioning for retrofit cockpit display upgrades. IC Role / Device Role / Timing Role: FPGA implements ARINC 429 transmitter/receiver logic, discrete input debouncing, and relay driver timing control. Use Value: 5 V-tolerant LVTTL I/O directly interfaces legacy 5 V avionics sensors and actuators; die temperature sensor monitors enclosure thermal derating in unventilated flight decks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV100-6BG256C | Same architecture and pinout; -6 speed grade guarantees 4.4 ns register-to-register delay (vs. 5.0 ns for -5) | Suitable for designs requiring tighter timing margins at 200 MHz system clock | Select only if timing closure fails with -5 grade; requires identical PCB layout and power delivery |
| XCV150-5BG256C | Higher density (164,674 gates, 3,888 logic cells); same BG256 package and I/O count but larger CLB array (24×36) | Enables migration path for designs needing more logic or block RAM (49,152 bits vs. 40,960) | Valid drop-in replacement only if design fits within XCV100 resource limits; otherwise requires CLB placement and routing re-optimization |
Compared with XCV100-5BG256C, the -6 variant offers higher timing margin without layout change, while the XCV150-5 provides scalable logic capacity in identical packaging-both retain full I/O banking compatibility and DLL functionality for seamless integration into existing Virtex-1 platforms.
Availability
XCV100-5BG256C is available at Aetrix Electronics and suitable for industrial motion control, telecom line-card rework, and automated test equipment requiring stable component supply amid long-lifecycle product support.
Supply support for XCV100-5BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company founded in 1984, specializing in programmable logic devices and adaptive computing solutions now part of AMD.
The Virtex family was engineered for high-performance, high-capacity reconfigurable logic in mission-critical infrastructure-targeting telecom switching, military systems, and industrial automation where deterministic timing and I/O flexibility are essential.
FAQ
What is the maximum operating frequency of the XCV100-5BG256C?
The XCV100-5BG256C achieves synchronous system clock rates up to 200 MHz, including I/O paths. This is guaranteed under worst-case conditions (2.5 V, 85°C) for the -5 speed grade, with representative circuits like pipelined multipliers achieving 5.1 ns propagation delay. Actual performance depends on design placement and routing.
Does the XCV100-5BG256C support hot-swap operation?
Yes, the XCV100-5BG256C supports hot-swapping for CompactPCI applications. Its I/O structure, power sequencing tolerance, and robust configuration logic allow safe insertion/removal while the backplane remains powered-verified per PICMG 2.1 specification requirements.
Can the XCV100-5BG256C interface directly with 5 V logic devices?
Yes, selected I/O standards on the XCV100-5BG256C-including LVTTL, PCI 5 V, and LVCMOS2-are 5 V tolerant. These inputs accept 5 V signals without damage, provided VCCO is set to 3.3 V or 2.5 V respectively and no output drivers are actively driving 5 V levels.
How many clock domains can be managed simultaneously on the XCV100-5BG256C?
The XCV100-5BG256C supports up to four independent clock domains via its four dedicated DLLs, each feeding a primary global clock net. Additional domains may be implemented using secondary local clock nets (24 total) or free-running oscillators routed through general-purpose interconnect.
Is the XCV100-5BG256C still in production?
No, the XCV100-5BG256C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). However, Aetrix Electronics maintains verified legacy inventory with full traceability, conforming to XCN10016 obsolescence management guidelines for continued support of installed base systems.
XCV100-5BG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 180
- Number of Gates:
- 108904
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCV100-5BG256C FAQ
1.How can I place an order for XCV100-5BG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV100-5BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV100-5BG256C reliable?
The price and inventory of XCV100-5BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100-5BG256C is usually 5 days.
3.What payment methods are accepted for XCV100-5BG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100-5BG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV100-5BG256C?
XCV100-5BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV100-5BG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV100-5BG256C?
For technical support, including XCV100-5BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100-5BG256C requirements.
6.How does Aetrix verify that XCV100-5BG256C is sourced from the original manufacturer or authorized distributors?
All XCV100-5BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100-5BG256C meets industry standards.
7.What is the process for return or replacement of XCV100-5BG256C?
All XCV100-5BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100-5BG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV100-5BG256C part is unused and in its original packaging.
Return procedure for XCV100-5BG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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