AMD XCV100-5BG256I
- Part No.:
- XCV100-5BG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCV100-5BG256I.pdf
- Description:
- IC FPGA 180 I/O 256BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV100-5BG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, 180 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control. It targets high-speed digital systems requiring PCI-compliant interfaces, embedded reconfigurable logic, and hierarchical memory integration in industrial temperature environments.
For engineers reviewing the XCV100-5BG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, block RAM configuration options, and industrial-grade thermal operation limits - all specific to the BG256 package and -5 speed grade.
Technical Context
The XCV100-5BG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four global low-skew clock distribution networks. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, and configurable storage elements supporting synchronous/asynchronous set/reset.
I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed signaling standards only when sharing identical VCCO voltage (e.g., LVTTL and PCI at 3.3 V). The device integrates dual-ported 4k-bit block RAMs (10 blocks totaling 40,960 bits) and supports SelectIO™ standards including LVTTL, LVCMOS2, HSTL Class IV, and SSTL2.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 108,904 - defines total combinational logic capacity for gate-equivalent synthesis mapping |
| Logic Cells | 2,700 - provides count of basic configurable units (each with LUT + flip-flop + carry logic) |
| User I/O Pins | 180 - maximum number of programmable bidirectional interface pins in BG256 package |
| Block RAM Bits | 40,960 - total distributed synchronous dual-port memory capacity across 10 × 4k-bit blocks |
| Speed Grade | -5 - specifies worst-case internal timing performance with 5.0 ns register-to-register delay |
| Operating Temperature | –40°C to +100°C - industrial range validated for sustained operation without derating |
| Supply Voltage | 2.5 V core / 3.3 V or 2.5 V I/O - dual-voltage domain enabling mixed-signaling interface design |
Pinout & Package
Package: 256-ball Fine-Pitch Ball Grid Array (FBGA), RoHS-compliant, 1.27 mm pitch, body size 27 mm × 27 mm. Thermal pad on underside for enhanced heat dissipation in industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Dedicated Global Clock Input | Four primary low-skew clock inputs routed directly to DLLs and global clock networks |
| PROGRAM_B | Configuration Reset Control | Active-low asynchronous reset that clears configuration memory and forces high-impedance I/O state |
| INIT_B | Configuration Status Output | Open-drain output indicating successful configuration completion or error condition |
| CCLK | Configuration Clock Input | Drives serial configuration data loading; frequency up to 20 MHz in master mode |
| DIN / DOUT | Serial Configuration Data | Single-pin bidirectional serial interface for JTAG or slave serial programming modes |
| VCCINT | Core Power Supply | 2.5 V ± 3% regulated supply for CLB, RAM, and routing logic; requires local decoupling |
| VCCO_0–VCCO_7 | I/O Bank Power Supply | Eight independent VCCO pins - one per I/O bank - enabling mixed-voltage signaling per bank |
| VREF_0–VREF_7 | I/O Threshold Reference | Eight VREF inputs - one per bank - required for HSTL/SSTL input standards; must be externally sourced |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DLLs | Four delay-locked loops enable zero-hold-time I/O timing, jitter reduction, and phase alignment across clock domains |
| Configurable LUT RAM | Each 4-input LUT can operate as 16×1-bit synchronous RAM, 16×2-bit RAM, or 16-bit shift register for pipeline staging |
| Carry Chain Arithmetic | Dual per-slice carry chains support high-speed adders, counters, and accumulators with sub-ns propagation per bit |
| IEEE 1149.1 Boundary Scan | Fully compliant JTAG TAP controller enables board-level interconnect testing and in-system programming |
| Die Temperature Sensor | Integrated diode allows real-time junction temperature monitoring via external ADC for thermal management |
Applications
| PCI Bridge Controller | Industrial Motion Control Logic |
|---|---|
|
Use Scenario: Implementing a custom PCI-to-parallel bus bridge in automated test equipment with deterministic latency requirements. IC Role / Device Role / Timing Role: Configurable protocol translator handling 66 MHz PCI transactions while synchronizing to local 25 MHz motion encoder clocks via DLL phase alignment. Use Value: Enables single-chip replacement of ASIC-based bridges with field-upgradable logic, reducing BOM count and supporting hot-swap compliance per Compact PCI spec. |
Use Scenario: Real-time interpolation engine for multi-axis CNC controllers requiring synchronized PWM generation and position feedback processing. IC Role / Device Role / Timing Role: High-speed arithmetic datapath using dedicated carry chains and block RAM for trajectory calculation, with I/O banks configured for 2.5 V encoder signals and 3.3 V actuator drivers. Use Value: Delivers sub-microsecond loop timing stability across temperature extremes, eliminating need for external timing ICs or discrete logic glue. |
| Medical Imaging Data Pipeline | Avionics Sensor Interface Hub |
|
Use Scenario: Aggregating and preprocessing raw pixel streams from multiple CMOS image sensors in portable ultrasound devices. IC Role / Device Role / Timing Role: Parallel data capture engine using LUT-based shift registers for burst-mode acquisition, feeding configurable FIR filters implemented in CLBs. Use Value: Achieves 180 MB/s sustained throughput using 180 I/O pins in HSTL Class IV mode, with on-chip dual-port RAM buffering eliminating external FIFOs. |
Use Scenario: Consolidating ARINC 429, discrete discretes, and analog sensor inputs into a unified avionics health monitor subsystem. IC Role / Device Role / Timing Role: Mixed-signal interface hub with isolated I/O banks: 3.3 V LVTTL for discretes, 2.5 V SSTL2 for high-speed serial links, and dedicated VREF-controlled inputs for precision analog monitoring. Use Value: Reduces PCB layer count by integrating level-shifting, signal conditioning, and protocol conversion - validated for DO-254 Level A design assurance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV100-6BG256I | Faster -6 speed grade (4.4 ns register-to-register delay vs. 5.0 ns); identical pinout and logic resources | Better suited for designs requiring >160 MHz system clock rates or tighter setup/hold margins | Select when timing closure fails on XCV100-5BG256I without logic optimization; same PCB layout |
| XCV150-5BG352I | Larger device (164,674 gates, 3,888 logic cells, 260 I/O) in 352-ball BGA; shares Virtex architecture and toolchain | Required for designs exceeding XCV100 resource limits - e.g., multi-channel DSP or expanded peripheral integration | Choose for future-proofing or migration path; requires PCB redesign due to different package and pin count |
Compared with XCV100-5BG256I, the -6 variant offers higher timing margin without layout change, while the XCV150-5BG352I provides scalable logic density at the cost of mechanical redesign - both maintain identical configuration flow, I/O banking rules, and DLL usage model.
Availability
XCV100-5BG256I is available at Aetrix Electronics and suitable for industrial automation controllers, medical imaging subsystems, and avionics sensor hubs requiring stable component supply across extended lifecycle programs.
Supply support for XCV100-5BG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family - including XCV100-5BG256I - was engineered for high-performance reconfigurable computing in infrastructure, aerospace, and industrial systems where flexibility, speed, and reliability are critical.
FAQ
What is the maximum operating frequency supported by XCV100-5BG256I?
XCV100-5BG256I supports synchronous system clock rates up to 200 MHz including I/O paths. Its -5 speed grade guarantees worst-case register-to-register timing of 5.0 ns, and it meets full 66 MHz PCI compliance. Actual achievable frequency depends on design complexity, placement, and routing - but benchmarked circuits such as pipelined multipliers and address decoders consistently achieve >100 MHz in real implementations.
Does XCV100-5BG256I support hot-swap operation in Compact PCI systems?
Yes, XCV100-5BG256I is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture supports live insertion and removal through robust power sequencing, I/O clamping, and IEEE 1149.1 boundary scan diagnostics. The device maintains high-impedance I/O states during configuration and supports controlled power-up sequences compatible with PICMG 2.1 specifications.
Can XCV100-5BG256I interface directly with ZBTRAM devices?
Yes, XCV100-5BG256I includes native SelectIO™ interface support optimized for direct connection to ZBTRAM devices. Its I/O timing parameters, slew rate controls, and programmable drive strength align with ZBT SRAM electrical requirements. The device's 180-user-I/O count and flexible bank voltage assignment allow full-width data bus implementation with separate address/control groups.
What memory resources are available on XCV100-5BG256I?
XCV100-5BG256I provides two types of memory: distributed LUT-based RAM (16×1-bit, 16×2-bit, or 16-bit shift register per LUT) and block-based dual-ported RAM. It contains 10 × 4k-bit block RAMs totaling 40,960 bits, each configurable as 1×4096, 2×2048, 4×1024, 8×512, or 16×256 with independent port widths. All block RAMs support true dual-port synchronous access with separate clocks and controls.
Is XCV100-5BG256I still in active production?
No, XCV100-5BG256I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains legacy inventory and supports long-term supply for existing production programs through traceable, tested stock and lifecycle management services.
XCV100-5BG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 180
- Number of Gates:
- 108904
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCV100-5BG256I FAQ
1.How can I place an order for XCV100-5BG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV100-5BG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV100-5BG256I reliable?
The price and inventory of XCV100-5BG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100-5BG256I is usually 5 days.
3.What payment methods are accepted for XCV100-5BG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100-5BG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV100-5BG256I?
XCV100-5BG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV100-5BG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV100-5BG256I?
For technical support, including XCV100-5BG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100-5BG256I requirements.
6.How does Aetrix verify that XCV100-5BG256I is sourced from the original manufacturer or authorized distributors?
All XCV100-5BG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100-5BG256I meets industry standards.
7.What is the process for return or replacement of XCV100-5BG256I?
All XCV100-5BG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCV100-5BG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV100-5BG256I part is unused and in its original packaging.
Return procedure for XCV100-5BG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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