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AMD XCV100-5FG256C
- Part No.:
- XCV100-5FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XCV100-5FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,025
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Product details
Overview
XCV100-5FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, and 180 user I/O pins in a 256-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (LUTs as 16-bit RAM/shift register/dual-port RAM, plus 40,960-bit block RAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.
For engineers reviewing the XCV100-5FG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility, and obsolescence-aware supply guidance specific to the -5 speed grade and FG256 package.
Technical Context
The XCV100-5FG256C implements a hierarchical routing architecture with general-purpose routing matrix (GRM), local VersaBlock interconnect, and dedicated VersaRing I/O ring for pin-locking. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19-input logic, and dual synchronous/asynchronous set/reset per flip-flop.
It supports eight I/O banks with independent VCCO and VREF assignment per bank; compatible output standards include LVTTL, PCI, SSTL3, HSTL Class I/III/IV, and GTL/GTL+, with 5 V tolerance on LVTTL, LVCMOS2, and PCI 5 V inputs. Configuration occurs via master serial, slave serial, SelectMAP™, or JTAG modes using SRAM-based bitstream loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 108,904 - defines logic capacity for complex state machines and datapaths |
| Logic Cells | 2,700 - provides configurable LUT+flip-flop units for RTL synthesis targeting |
| User I/O Pins | 180 - usable for multi-standard interface design with banked voltage domains |
| Block RAM Bits | 40,960 - enables dual-ported 4k-bit memory blocks with independent port widths |
| Speed Grade | -5 - guarantees 10 ns clock-to-out (Tco) and 5.0 ns register-to-register delay under worst-case conditions |
| Operating Voltage | 2.5 V core / 3.3 V or 2.5 V I/O - requires separate VCCINT and VCCO supplies per bank |
| PCI Compliance | 66 MHz - meets PCI Local Bus Specification Rev 2.2 electrical and timing requirements |
Pinout & Package
Package: Fine-pitch Ball Grid Array (FG256) with 256 solder balls, 1.0 mm pitch, body size 17 mm × 17 mm, JEDEC MO-205AC compliant. Thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Dedicated global clock input | Low-skew primary clock nets routed directly to DLLs and CLB clock trees |
| PROGRAM_B | Active-low configuration reset | Forces reconfiguration by clearing internal SRAM; asynchronous to all clocks |
| INIT_B | Configuration status indicator | Open-drain output signaling successful bitstream load or initialization failure |
| CCLK | Configuration clock input | Drives master serial mode; frequency ≤ 25 MHz; controls PROM read timing |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port for programming and debug |
| VCCINT | Core power supply | 2.5 V ± 3% supply for CLBs, DLLs, and internal routing; decoupling required per Xilinx guidelines |
| VCCO_0–VCCO_7 | I/O bank power supply | Independent 3.3 V or 2.5 V outputs per bank; determines supported I/O standards |
| VREF_0–VREF_7 | I/O threshold reference | Required for SSTL/HSTL/GTL inputs; one per bank; must be externally supplied |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero hold-time I/O timing, phase alignment across clock domains, and jitter reduction for synchronous interfaces |
| Configurable LUT RAM | Each 4-input LUT serves as 16×1-bit synchronous RAM, 16×2-bit, 32×1-bit, or 16×1-bit dual-port RAM without consuming block RAM |
| Dedicated carry chain | Two-bit-per-CLB carry height supports high-speed arithmetic (e.g., 32-bit adders) with predictable propagation delay |
| IEEE 1149.1 boundary scan | Full JTAG TAP controller with instruction/data registers enables board-level testability and in-system programming |
| Hot-swap support | Meets CompactPCI hot-swap electrical requirements for live insertion/removal in backplane systems |
Applications
| PCI Bridge Controller | High-Speed Data Acquisition |
|---|---|
Use Scenario: Implementing a custom PCI-to-local bus bridge in industrial measurement equipment requiring deterministic latency and burst transfers. IC Role / Device Role / Timing Role: FPGA acts as PCI target/master with 66-MHz compliant transceiver, managing address decoding, DMA arbitration, and data buffering using block RAM. Use Value: Eliminates ASIC NRE cost while meeting PCI timing closure at -5 speed grade and supporting mixed-voltage I/O for legacy analog front-end interfacing. | Use Scenario: Capturing parallel 12-bit ADC samples at 40 MSPS with real-time histogramming and trigger logic in test instrumentation. IC Role / Device Role / Timing Role: FPGA performs high-speed parallel capture, clock domain crossing (ADC clock → system clock), and on-the-fly statistical processing using distributed LUT RAM and carry chains. Use Value: Leverages 180 I/O pins for wide data buses and 40,960-bit block RAM for histogram storage, achieving sub-cycle timing margins with DLL-controlled sampling clocks. |
| Communications Protocol Converter | Legacy System Emulator |
Use Scenario: Translating between RS-422 serial protocol and modern SPI-based sensor networks in avionics subsystems. IC Role / Device Role / Timing Role: FPGA implements UART with custom framing, SPI master controller, and glue logic with precise timing control via DLL-synchronized I/O. Use Value: Uses SelectIO™ to simultaneously support 3.3 V LVTTL (SPI) and 5 V-tolerant RS-422 receivers within same I/O bank constraints, reducing external level-shifting components. | Use Scenario: Replacing obsolete gate arrays in military radar signal processors where PCB layout cannot be modified. IC Role / Device Role / Timing Role: FPGA replicates original netlist functionality with pin-locked I/O mapping using VersaRing routing to preserve existing trace routing. Use Value: Enables drop-in replacement of mask-programmed logic with full reprogrammability, leveraging 2,700 logic cells and 180 I/O to match legacy footprint and timing behavior. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV100-6FG256C | Faster -6 speed grade (8.5 ns register-to-register delay vs. 10 ns); identical logic density, I/O count, and package | Suitable for designs requiring tighter timing closure at 200 MHz system clock or higher I/O toggle rates | Select when timing margin is insufficient with -5 grade; no PCB change needed |
| XCV150-5FG256C | Higher density (164,674 system gates, 3,888 logic cells); same FG256 package and -5 speed grade | Required for larger state machines or wider datapaths exceeding XCV100 capacity, with identical thermal and board footprint | Choose when logic utilization exceeds 90% in XCV100 implementation; pin-compatible upgrade path |
Compared with XCV100-5FG256C, the -6 variant improves maximum operating frequency without altering resource count or layout, while the XCV150-5 offers scalable logic capacity within the same mechanical and thermal envelope-both enable incremental design evolution without board redesign.
Availability
XCV100-5FG256C is available at Aetrix Electronics and suitable for industrial control systems, test equipment, and legacy avionics upgrades requiring stable component supply amid long product lifecycles.
Supply support for XCV100-5FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for high-performance digital system design.
The Virtex family was designed for high-speed, high-density applications including communications infrastructure, military/aerospace systems, and high-end test equipment-emphasizing timing predictability, I/O flexibility, and silicon efficiency through hierarchical routing and dedicated resources.
FAQ
What is the maximum operating frequency supported by XCV100-5FG256C?
XCV100-5FG256C supports synchronous system clock rates up to 200 MHz, including I/O paths. The -5 speed grade guarantees worst-case register-to-register delay of 10 ns and clock-to-out (Tco) of 10 ns, validated under commercial temperature range (0°C to +85°C) and 2.5 V core supply. Actual achievable frequency depends on design complexity and place-and-route optimization.
Does XCV100-5FG256C support hot-swap operation in CompactPCI systems?
Yes, XCV100-5FG256C is explicitly designed for hot-swappable CompactPCI applications. Its I/O structure meets the electrical requirements for live insertion and removal, including controlled slew rates, drive strength limits, and robust ESD protection. This capability is documented in DS003-1 and confirmed for the FG256 package variant.
How many block RAMs does XCV100-5FG256C contain, and what configurations are supported?
XCV100-5FG256C contains 10 block SelectRAMs totaling 40,960 bits. Each block is a fully synchronous dual-ported 4096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096). Supported aspect ratios include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible bus-width conversion and FIFO implementation.
Can XCV100-5FG256C interface directly with 5 V logic devices?
XCV100-5FG256C supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, allowing direct connection to 5 V outputs without level shifters. However, its outputs are not 5 V tolerant and must be driven at 3.3 V or 2.5 V levels. Input protection uses Zener-like clamping to ground, limiting input voltage to ~6.5 V.
Is XCV100-5FG256C still in active production, and what is its obsolescence status?
XCV100-5FG256C is marked as obsolete/under obsolescence per Xilinx DS003-1 (v4.0, March 2013). No new production is planned, and last-time-buy windows have closed. Aetrix Electronics maintains limited legacy inventory with full traceability and provides lifecycle coordination support for ongoing production programs requiring this device.
XCV100-5FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 176
- Number of Gates:
- 108904
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XCV100-5FG256C FAQ
1.How can I place an order for XCV100-5FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV100-5FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV100-5FG256C reliable?
The price and inventory of XCV100-5FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100-5FG256C is usually 5 days.
3.What payment methods are accepted for XCV100-5FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100-5FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV100-5FG256C?
XCV100-5FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV100-5FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV100-5FG256C?
For technical support, including XCV100-5FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100-5FG256C requirements.
6.How does Aetrix verify that XCV100-5FG256C is sourced from the original manufacturer or authorized distributors?
All XCV100-5FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100-5FG256C meets industry standards.
7.What is the process for return or replacement of XCV100-5FG256C?
All XCV100-5FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100-5FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV100-5FG256C part is unused and in its original packaging.
Return procedure for XCV100-5FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV100-5FG256C Tags
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