AMD XCV100-5FG256I

Overview

XCV100-5FG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, and 180 user I/O pins in a 256-pin Fine-pitch Ball Grid Array (FG256) package. It features four delay-locked loops (DLLs), hierarchical memory (including 40,960 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 16 SelectIO™ interface standards including PCI 66 MHz compliance and hot-swap capability for CompactPCI.

For engineers reviewing the XCV100-5FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and real-world FPGA integration considerations for industrial control, telecom line cards, and legacy PCI-based embedded systems.

Technical Context

The XCV100-5FG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain two slices each with four logic cells (LCs), dedicated carry chains, F5/F6 multiplexers for 5–6 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed signaling standards only when sharing VCCO voltage (e.g., LVTTL and SSTL3 at 3.3 V), while GTL/GTL+ are compatible across all VCCO levels due to open-drain output structure.

Key Specifications

Pinout & Package

Package: 256-ball Fine-pitch Ball Grid Array (FG256), 1.0 mm ball pitch, RoHS-compliant, thermally enhanced for industrial temperature operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100-5FG256I, the -6 variant improves worst-case timing margin by ~12% without altering resource allocation, while the XCV150-5FG256I adds 51% more logic and 20% more I/O within identical board space - making both viable for incremental upgrades where pin compatibility and thermal profile are critical.

Availability

XCV100-5FG256I is available at Aetrix Electronics and suitable for industrial motion control, legacy telecom line cards, CompactPCI embedded controllers, automated test equipment, and reconfigurable instrumentation requiring stable component supply amid obsolescence management.

Supply support for XCV100-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex family was designed for demanding applications requiring high logic density, multi-standard I/O, and advanced clock management - targeting aerospace, industrial automation, and communications infrastructure where reconfigurability and long-term design stability are essential.

FAQ

What is the maximum operating frequency supported by XCV100-5FG256I?

XCV100-5FG256I is rated for synchronous system clock rates up to 200 MHz, including I/O paths, as guaranteed by its -5 speed grade. This specification covers worst-case conditions across industrial temperature range (–40°C to +100°C) and nominal 2.5 V supply. Actual achievable frequency depends on design complexity, placement, and routing; representative circuits like register-to-register paths achieve 5.0 ns propagation delay per stage.

Does XCV100-5FG256I support hot-swap functionality in CompactPCI systems?

Yes, XCV100-5FG256I explicitly supports hot-swappable operation in CompactPCI applications per its product specification. This capability relies on robust I/O protection circuitry, controlled power sequencing via PROGRAM_B and INIT_B signals, and IEEE 1149.1 boundary-scan testability for pre-insertion verification - all validated for industrial temperature operation.

How many block RAMs does XCV100-5FG256I include, and what configurations are supported?

XCV100-5FG256I contains ten 4k-bit block SelectRAMs totaling 40,960 bits. Each block is a fully synchronous dual-ported RAM with independent address/data/control per port. Supported configurations include depths from 1 to 4096 and widths from 1 to 16 bits (e.g., 256×16, 512×8, 1024×4), enabling flexible FIFO, buffer, and lookup table implementations without consuming CLB resources.

Can XCV100-5FG256I interface directly with 5 V TTL logic?

XCV100-5FG256I supports 5 V tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, allowing safe connection to 5 V signaling without external level shifters. However, output drivers are not 5 V tolerant and require VCCO = 3.3 V for those standards; I/O banks must be configured accordingly, and VREF is not required for 5 V-tolerant inputs.

Is XCV100-5FG256I still in active production, and what obsolescence status applies?

XCV100-5FG256I is marked as obsolete/under obsolescence per Xilinx DS003-1 (v4.0) dated March 2013, with no new production planned. Aetrix Electronics maintains legacy inventory and provides lifecycle coordination support, including last-time-buy planning, cross-reference guidance, and migration path analysis to newer Virtex families or AMD/Xilinx alternatives where technically feasible.