AMD XCV100-6BG256C

Overview

XCV100-6BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 180 user I/O pins in a 256-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 40,960 bits of block RAM and LUTs configurable as RAM/shift register), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV100-6BG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and real-world migration guidance from Virtex-1 to later families - all grounded in DS003-1 (v4.0) and DS003-4 pinout documentation.

Technical Context

The XCV100-6BG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock networks driven by dedicated DLLs. Its CLBs contain four logic cells each, with dual-slice structure supporting 4-input LUTs, carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed standards only if sharing VCCO voltage (e.g., LVTTL and SSTL3 at 3.3 V), while GTL/GTL+ are compatible across all VCCO levels due to open-drain output architecture.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XCV100-6BG256C, XCV100-6HQ240C trades I/O count and thermal efficiency for ease of assembly, while XCV200-6BG256C offers pin-compatible scalability - both require revalidation of timing closure, I/O banking, and power delivery, but avoid architectural redesign.

Availability

XCV100-6BG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, test equipment, and legacy system upgrades requiring stable component supply and long-term obsolescence mitigation planning.

Supply support for XCV100-6BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and toolchain development for high-performance digital system design.

The Virtex family was designed for high-speed, high-capacity applications demanding advanced clock management, flexible I/O, and hierarchical memory - targeting telecom infrastructure, military/aerospace systems, and industrial control where reconfigurability and deterministic timing are critical.

FAQ

What does the "-6" speed grade mean for XCV100-6BG256C?

The "-6" speed grade indicates guaranteed worst-case timing performance: register-to-register delay ≤5.0 ns, 200 MHz system clock operation with DLL compensation, and 66-MHz PCI compliance. This grade ensures predictable timing closure for synchronous designs in commercial temperature range (0°C to +85°C), validated across process corners and voltage extremes per DS003-3.

Does XCV100-6BG256C support hot-swap operation in Compact PCI systems?

Yes, XCV100-6BG256C supports hot-swap operation in Compact PCI systems per its documented 66-MHz PCI compliance and I/O drive strength specifications. Its IOBs include programmable slew rate control and 3.3 V tolerant outputs, meeting PICMG 2.1 requirements for insertion/removal sequencing and transient suppression during live backplane engagement.

How many block RAMs does XCV100-6BG256C contain, and what are their configurations?

XCV100-6BG256C contains ten 4k-bit block SelectRAMs totaling 40,960 bits. Each block is a fully synchronous dual-ported RAM with independent address/data/control per port, configurable for depths from 1 to 4096 and widths from 1 to 16 bits (e.g., 256×16 or 1024×4), enabling flexible FIFO, buffer, or lookup table implementations without consuming CLB resources.

Can XCV100-6BG256C interface directly with 5 V TTL logic?

XCV100-6BG256C supports 5 V tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards per DS003-2 Table 1, but its outputs are not 5 V tolerant - they operate at VCCO (typically 3.3 V or 2.5 V). Direct connection to 5 V TTL outputs requires external level-shifting or clamping; inputs from 5 V TTL sources are safe when VCCO ≥ 2.5 V and current-limited per Xilinx DC specs.

Is XCV100-6BG256C still in production, and what obsolescence support is available?

XCV100-6BG256C is marked obsolete per DS003-1 (v4.0) revision history dated March 2013, with no new manufacturing. Aetrix Electronics provides last-time-buy procurement, extended warehouse stock, and cross-reference engineering support to identify functionally aligned alternatives (e.g., Spartan-6 or Artix-7) with migration path documentation and timing equivalence analysis for XCV100-6BG256C legacy designs.