Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XCV100-6FG256C

Part No.:
XCV100-6FG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXCV100-6FG256C.pdf
Description:
IC FPGA 176 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,452

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XCV100-6FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, 176 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control. It supports 66-MHz PCI compliance, hot-swappable operation in Compact PCI systems, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, SSTL2, and HSTL.

For engineers reviewing the XCV100-6FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, 4k-bit synchronous dual-ported block RAM per memory block, fine-pitch BGA (FG256) package with 176 user I/O, -6 speed grade timing, and commercial temperature range (0°C to +85°C).

Technical Context

The XCV100-6FG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and a programmable routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and flip-flops/latches with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 16 interface standards via SelectIO™ technology, with banked VCCO and VREF domains enabling mixed-voltage I/O operation. Four DLLs feed four low-skew global clock nets and 24 local clock nets, while distributed LUTs serve as 16-bit RAM/shift registers and block RAMs provide configurable dual-ported 4k-bit memory.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 108,904 - defines logic capacity for complex digital functions like protocol engines or DSP pipelines
Logic Cells 2,700 - provides discrete, placeable-and-routable units each containing LUT, carry, and storage
User I/O Pins 176 - enables high-pin-count peripheral interfacing (e.g., memory buses, parallel ADC/DAC)
Block RAM Bits 40,960 - delivers 10 × 4k-bit synchronous dual-ported RAM blocks for FIFOs or data buffering
Max System Clock 200 MHz - supports high-speed synchronous design including PCI-66 and DDR-SDRAM control
Speed Grade -6 - guarantees worst-case timing performance meeting 200 MHz register-to-register paths
Operating Voltage 2.5 V core / 3.3 V or 2.5 V I/O - enables low-power logic with legacy-compatible signaling

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256) with 256 balls, 1.27 mm pitch, and 176 user I/O pins arranged across eight I/O banks. Thermal and mechanical characteristics align with JEDEC MO-205 standard.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew inputs feeding four DLL-controlled clock distribution networks
IO_LxxN/IO_LxxP Configurable I/O Bank Pin Supports differential or single-ended standards (LVTTL, SSTL2, HSTL) per bank voltage domain
VCCO_0–VCCO_7 I/O Power Supply Eight independent VCCO rails-each powers one I/O bank and sets output voltage level
VREF_0–VREF_7 Input Reference Voltage Bank-specific reference for SSTL/HSTL inputs; must be externally supplied and stable
M0–M2, INIT, PROGRAM Configuration Control Define master/slave serial or SelectMAP mode; PROGRAM initiates reconfiguration
CCLK, DIN, DOUT, DONE JTAG/Serial Configuration Enable boundary-scan testing and bitstream loading via JTAG or serial PROM interface

Key Features

Feature Design Value
Dedicated DLLs Four on-chip delay-locked loops eliminate clock skew and enable phase-aligned multi-domain timing
SelectIO™ Interface 16 supported standards-including PCI-66, SSTL2, and HSTL Class IV-allow direct connection to memory and bus devices
LUT-as-RAM Each 4-input LUT configures as 16×1-bit synchronous RAM or 16-bit shift register for pipeline capture or small buffers
Block SelectRAM 10 × 4k-bit dual-ported RAM blocks with independent address/data widths per port for true asynchronous read/write
Carry Chain Logic Dedicated fast-carry path per CLB slice enables efficient arithmetic (adders, counters) without LUT resource penalty

Applications

PCI-66 Interface Controller High-Speed Data Acquisition

Use Scenario: Implementing a 66 MHz PCI bus master in industrial test equipment requiring real-time DMA transfers.

IC Role / Device Role / Timing Role: Configurable PCI interface core with timing-compliant setup/hold, DLL-synchronized clock domain crossing, and 32-bit address/data multiplexing.

Use Value: Eliminates need for external PCI bridge ASIC; leverages 176 I/O and -6 speed grade to meet PCI-66 timing without external logic.

Use Scenario: Capturing 100+ MSPS parallel ADC samples into on-chip memory before streaming to host via USB or Ethernet.

IC Role / Device Role / Timing Role: High-speed parallel I/O frontend with LUT-based shift registers for sample alignment and block RAM for ping-pong buffering.

Use Value: Achieves deterministic 200 MHz sampling clock domain using DLL-controlled global nets and avoids external FIFO ICs.

Protocol Translation Bridge Legacy System Emulator

Use Scenario: Translating between RS-422 serial control and parallel 8-bit microcontroller bus in avionics maintenance tools.

IC Role / Device Role / Timing Role: Dual-clock domain bridge with asynchronous FIFOs built from block RAM, synchronized by DLL-managed clocks.

Use Value: Enables seamless voltage-level and timing-domain translation between disparate subsystems using only internal resources.

Use Scenario: Replacing obsolete gate array logic in military radar signal processors where PCB redesign is prohibited.

IC Role / Device Role / Timing Role: Pin-compatible functional replacement for mask-ROM PLD with identical FG256 footprint and I/O mapping.

Use Value: Restores field-deployed systems using same board layout; leverages SRAM configuration for rapid firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV100-5FG256C Slower -5 speed grade; 15–20% longer propagation delays in critical paths Suitable for non-PCI-66 designs or lower-frequency control logic Select when 200 MHz system clock is not required and cost optimization is prioritized
XCV150-6FG256C Higher density (164,674 gates, 3,888 logic cells), same FG256 package and pinout Enables larger state machines or additional protocol cores without PCB change Choose for design scalability where future feature expansion is anticipated

Compared with XCV100-6FG256C, the -5 variant trades speed for cost in static logic, while the XCV150-6FG256C offers headroom for logic growth within identical mechanical and thermal constraints-neither is pin-compatible with XCV100-6FG256C unless explicitly validated for migration.

Availability

XCV100-6FG256C is available at Aetrix Electronics and suitable for industrial control systems, legacy avionics upgrades, and test equipment requiring stable component supply amid obsolescence management programs.

Supply support for XCV100-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family-including XCV100-6FG256C-was engineered for high-performance, high-density digital system integration in communications infrastructure, aerospace, and industrial automation where reconfigurability and timing precision are critical.

FAQ

What is the maximum operating frequency supported by the XCV100-6FG256C?

The XCV100-6FG256C supports synchronous system clock rates up to 200 MHz, verified under worst-case timing conditions with the -6 speed grade. This includes register-to-register paths and I/O timing compliant with 66-MHz PCI specifications. Actual achievable frequency depends on design placement, routing, and resource utilization-but the -6 grade guarantees timing closure at 200 MHz for typical logic depth and fanout.

Does the XCV100-6FG256C support hot-swap functionality?

Yes, the XCV100-6FG256C supports hot-swappable operation in Compact PCI systems. Its I/O structure, power sequencing tolerance, and configuration architecture allow safe insertion/removal while the backplane remains powered. This capability is enabled by robust ESD protection, controlled I/O drive strength, and IEEE 1149.1 boundary-scan test access-all integral to the XCV100-6FG256C silicon design.

How many block RAMs does the XCV100-6FG256C contain, and what are their configurations?

The XCV100-6FG256C contains 10 block SelectRAMs totaling 40,960 bits. Each block is a fully synchronous, dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096). Address and data buses are parameterized per port, enabling true asynchronous read/write operations and built-in bus-width conversion-critical for FIFOs, frame buffers, and protocol translation.

Is the XCV100-6FG256C still in active production?

No, the XCV100-6FG256C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains legacy inventory and supports obsolescence mitigation through traceable sourcing, lifetime buy programs, and cross-reference engineering for functional replacements.

What configuration modes are supported by the XCV100-6FG256C?

The XCV100-6FG256C supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial (receives bitstream via dedicated pins), SelectMAP (8-bit parallel interface), and JTAG (IEEE 1149.1 boundary-scan). Mode selection is controlled by M0–M2 pins at power-up, and all modes support full readback and verification of configuration memory-ensuring reliability in mission-critical deployments of XCV100-6FG256C.

XCV100-6FG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Total RAM Bits:
40960
Number of I/O:
176
Number of Gates:
108904
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XCV100-6FG256C FAQ

1.How can I place an order for XCV100-6FG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV100-6FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV100-6FG256C reliable?

The price and inventory of XCV100-6FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100-6FG256C is usually 5 days.

3.What payment methods are accepted for XCV100-6FG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100-6FG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV100-6FG256C?

XCV100-6FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV100-6FG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV100-6FG256C?

For technical support, including XCV100-6FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100-6FG256C requirements.

6.How does Aetrix verify that XCV100-6FG256C is sourced from the original manufacturer or authorized distributors?

All XCV100-6FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100-6FG256C meets industry standards.

7.What is the process for return or replacement of XCV100-6FG256C?

All XCV100-6FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100-6FG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV100-6FG256C part is unused and in its original packaging.

Return procedure for XCV100-6FG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV100-6FG256C Tags

  • XCV100-6FG256C
  • XCV100-6FG256C PDF
  • XCV100-6FG256C Datasheet
  • XCV100-6FG256C Specifications
  • XCV100-6FG256C Images
  • AMD
  • AMD XCV100-6FG256C
  • Buy XCV100-6FG256C
  • XCV100-6FG256C Price
  • XCV100-6FG256C Distributor
  • XCV100-6FG256C Supplier
  • XCV100-6FG256C Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER