AMD XCV100-6FG256C
- Part No.:
- XCV100-6FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XCV100-6FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,452
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Product details
Overview
XCV100-6FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, 176 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control. It supports 66-MHz PCI compliance, hot-swappable operation in Compact PCI systems, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, SSTL2, and HSTL.
For engineers reviewing the XCV100-6FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, 4k-bit synchronous dual-ported block RAM per memory block, fine-pitch BGA (FG256) package with 176 user I/O, -6 speed grade timing, and commercial temperature range (0°C to +85°C).
Technical Context
The XCV100-6FG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and a programmable routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and flip-flops/latches with independent clock enable, synchronous/asynchronous set/reset.
Its IOBs support 16 interface standards via SelectIO™ technology, with banked VCCO and VREF domains enabling mixed-voltage I/O operation. Four DLLs feed four low-skew global clock nets and 24 local clock nets, while distributed LUTs serve as 16-bit RAM/shift registers and block RAMs provide configurable dual-ported 4k-bit memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 108,904 - defines logic capacity for complex digital functions like protocol engines or DSP pipelines |
| Logic Cells | 2,700 - provides discrete, placeable-and-routable units each containing LUT, carry, and storage |
| User I/O Pins | 176 - enables high-pin-count peripheral interfacing (e.g., memory buses, parallel ADC/DAC) |
| Block RAM Bits | 40,960 - delivers 10 × 4k-bit synchronous dual-ported RAM blocks for FIFOs or data buffering |
| Max System Clock | 200 MHz - supports high-speed synchronous design including PCI-66 and DDR-SDRAM control |
| Speed Grade | -6 - guarantees worst-case timing performance meeting 200 MHz register-to-register paths |
| Operating Voltage | 2.5 V core / 3.3 V or 2.5 V I/O - enables low-power logic with legacy-compatible signaling |
Pinout & Package
Package: Fine-pitch Ball Grid Array (FG256) with 256 balls, 1.27 mm pitch, and 176 user I/O pins arranged across eight I/O banks. Thermal and mechanical characteristics align with JEDEC MO-205 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew inputs feeding four DLL-controlled clock distribution networks |
| IO_LxxN/IO_LxxP | Configurable I/O Bank Pin | Supports differential or single-ended standards (LVTTL, SSTL2, HSTL) per bank voltage domain |
| VCCO_0–VCCO_7 | I/O Power Supply | Eight independent VCCO rails-each powers one I/O bank and sets output voltage level |
| VREF_0–VREF_7 | Input Reference Voltage | Bank-specific reference for SSTL/HSTL inputs; must be externally supplied and stable |
| M0–M2, INIT, PROGRAM | Configuration Control | Define master/slave serial or SelectMAP mode; PROGRAM initiates reconfiguration |
| CCLK, DIN, DOUT, DONE | JTAG/Serial Configuration | Enable boundary-scan testing and bitstream loading via JTAG or serial PROM interface |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DLLs | Four on-chip delay-locked loops eliminate clock skew and enable phase-aligned multi-domain timing |
| SelectIO™ Interface | 16 supported standards-including PCI-66, SSTL2, and HSTL Class IV-allow direct connection to memory and bus devices |
| LUT-as-RAM | Each 4-input LUT configures as 16×1-bit synchronous RAM or 16-bit shift register for pipeline capture or small buffers |
| Block SelectRAM | 10 × 4k-bit dual-ported RAM blocks with independent address/data widths per port for true asynchronous read/write |
| Carry Chain Logic | Dedicated fast-carry path per CLB slice enables efficient arithmetic (adders, counters) without LUT resource penalty |
Applications
| PCI-66 Interface Controller | High-Speed Data Acquisition |
|---|---|
Use Scenario: Implementing a 66 MHz PCI bus master in industrial test equipment requiring real-time DMA transfers. IC Role / Device Role / Timing Role: Configurable PCI interface core with timing-compliant setup/hold, DLL-synchronized clock domain crossing, and 32-bit address/data multiplexing. Use Value: Eliminates need for external PCI bridge ASIC; leverages 176 I/O and -6 speed grade to meet PCI-66 timing without external logic. |
Use Scenario: Capturing 100+ MSPS parallel ADC samples into on-chip memory before streaming to host via USB or Ethernet. IC Role / Device Role / Timing Role: High-speed parallel I/O frontend with LUT-based shift registers for sample alignment and block RAM for ping-pong buffering. Use Value: Achieves deterministic 200 MHz sampling clock domain using DLL-controlled global nets and avoids external FIFO ICs. |
| Protocol Translation Bridge | Legacy System Emulator |
Use Scenario: Translating between RS-422 serial control and parallel 8-bit microcontroller bus in avionics maintenance tools. IC Role / Device Role / Timing Role: Dual-clock domain bridge with asynchronous FIFOs built from block RAM, synchronized by DLL-managed clocks. Use Value: Enables seamless voltage-level and timing-domain translation between disparate subsystems using only internal resources. |
Use Scenario: Replacing obsolete gate array logic in military radar signal processors where PCB redesign is prohibited. IC Role / Device Role / Timing Role: Pin-compatible functional replacement for mask-ROM PLD with identical FG256 footprint and I/O mapping. Use Value: Restores field-deployed systems using same board layout; leverages SRAM configuration for rapid firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV100-5FG256C | Slower -5 speed grade; 15–20% longer propagation delays in critical paths | Suitable for non-PCI-66 designs or lower-frequency control logic | Select when 200 MHz system clock is not required and cost optimization is prioritized |
| XCV150-6FG256C | Higher density (164,674 gates, 3,888 logic cells), same FG256 package and pinout | Enables larger state machines or additional protocol cores without PCB change | Choose for design scalability where future feature expansion is anticipated |
Compared with XCV100-6FG256C, the -5 variant trades speed for cost in static logic, while the XCV150-6FG256C offers headroom for logic growth within identical mechanical and thermal constraints-neither is pin-compatible with XCV100-6FG256C unless explicitly validated for migration.
Availability
XCV100-6FG256C is available at Aetrix Electronics and suitable for industrial control systems, legacy avionics upgrades, and test equipment requiring stable component supply amid obsolescence management programs.
Supply support for XCV100-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family-including XCV100-6FG256C-was engineered for high-performance, high-density digital system integration in communications infrastructure, aerospace, and industrial automation where reconfigurability and timing precision are critical.
FAQ
What is the maximum operating frequency supported by the XCV100-6FG256C?
The XCV100-6FG256C supports synchronous system clock rates up to 200 MHz, verified under worst-case timing conditions with the -6 speed grade. This includes register-to-register paths and I/O timing compliant with 66-MHz PCI specifications. Actual achievable frequency depends on design placement, routing, and resource utilization-but the -6 grade guarantees timing closure at 200 MHz for typical logic depth and fanout.
Does the XCV100-6FG256C support hot-swap functionality?
Yes, the XCV100-6FG256C supports hot-swappable operation in Compact PCI systems. Its I/O structure, power sequencing tolerance, and configuration architecture allow safe insertion/removal while the backplane remains powered. This capability is enabled by robust ESD protection, controlled I/O drive strength, and IEEE 1149.1 boundary-scan test access-all integral to the XCV100-6FG256C silicon design.
How many block RAMs does the XCV100-6FG256C contain, and what are their configurations?
The XCV100-6FG256C contains 10 block SelectRAMs totaling 40,960 bits. Each block is a fully synchronous, dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096). Address and data buses are parameterized per port, enabling true asynchronous read/write operations and built-in bus-width conversion-critical for FIFOs, frame buffers, and protocol translation.
Is the XCV100-6FG256C still in active production?
No, the XCV100-6FG256C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains legacy inventory and supports obsolescence mitigation through traceable sourcing, lifetime buy programs, and cross-reference engineering for functional replacements.
What configuration modes are supported by the XCV100-6FG256C?
The XCV100-6FG256C supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial (receives bitstream via dedicated pins), SelectMAP (8-bit parallel interface), and JTAG (IEEE 1149.1 boundary-scan). Mode selection is controlled by M0–M2 pins at power-up, and all modes support full readback and verification of configuration memory-ensuring reliability in mission-critical deployments of XCV100-6FG256C.
XCV100-6FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 176
- Number of Gates:
- 108904
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XCV100-6FG256C FAQ
1.How can I place an order for XCV100-6FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV100-6FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV100-6FG256C reliable?
The price and inventory of XCV100-6FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100-6FG256C is usually 5 days.
3.What payment methods are accepted for XCV100-6FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100-6FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV100-6FG256C?
XCV100-6FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV100-6FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV100-6FG256C?
For technical support, including XCV100-6FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100-6FG256C requirements.
6.How does Aetrix verify that XCV100-6FG256C is sourced from the original manufacturer or authorized distributors?
All XCV100-6FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100-6FG256C meets industry standards.
7.What is the process for return or replacement of XCV100-6FG256C?
All XCV100-6FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100-6FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV100-6FG256C part is unused and in its original packaging.
Return procedure for XCV100-6FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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