AMD XCV100-6PQ240C
- Part No.:
- XCV100-6PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV100-6PQ240C.pdf
- Description:
- IC FPGA 166 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,952
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Product details
Overview
XCV100-6PQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, 166 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control. It supports 66-MHz PCI compliance, hot-swappable operation in Compact PCI systems, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, and HSTL Class IV.
For engineers reviewing the XCV100-6PQ240C datasheet, pinout, applications, or equivalent options, key selection considerations include its 0.22 μm 5-layer metal CMOS process, 200 MHz system performance ceiling, configurable dual-ported 4k-bit block RAMs, die-temperature sensor diode, and IEEE 1149.1 boundary-scan support.
Technical Context
The XCV100-6PQ240C implements a hierarchical architecture with a 20×30 CLB array, each CLB containing four logic cells (LCs) with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its routing hierarchy includes local VersaBlock interconnect, global general-purpose routing matrix (GRM), 24 secondary local clock nets, and four primary low-skew global clock distribution nets.
It integrates 10 block SelectRAM™ memory units (40,960 bits total), each configurable as synchronous dual-ported 4k-bit RAM with independent port widths (1–16 bits). I/O banking enforces voltage domain isolation: eight banks with shared VCCO per bank (3.3 V, 2.5 V, or 1.5 V) and optional VREF per bank for input thresholding.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 108,904 - defines logic capacity for ASIC replacement or complex digital system integration |
| Logic Cells | 2,700 - provides granular, place-and-route-efficient resources for combinational and sequential logic |
| User I/O Pins | 166 - enables high-pin-count interface bridging (e.g., PCI, memory buses, custom parallel protocols) |
| Block RAM Bits | 40,960 - supports on-chip buffering, FIFOs, or lookup tables without external memory |
| Max System Clock | 200 MHz - sustains high-throughput data processing in synchronous designs with tight timing closure |
| DLL Count | 4 - allows independent phase alignment and jitter reduction for multiple clock domains |
| Process Technology | 0.22 μm 5-layer metal CMOS - delivers higher density and lower static power vs prior FPGA generations |
Pinout & Package
Package: PQ240 - 240-pin Plastic Quad Flat Pack, 0.5 mm pitch, 32.5 mm × 32.5 mm body size, lead-free compatible (per Xilinx documentation DS003-4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew inputs feeding four primary global clock networks |
| IO_LxxN/IO_LxxP | Configurable I/O Bank Pin | Supports differential or single-ended standards (LVTTL, HSTL, SSTL) per bank's VCCO/VREF |
| VCCO_0–VCCO_7 | I/O Power Supply | Eight independent VCCO rails - one per I/O bank - enabling mixed-voltage interface design |
| VREF_0–VREF_7 | Input Reference Voltage | Bank-specific reference for input thresholding; required for HSTL/SSTL but not LVTTL |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming and in-system verification |
| CCLK/INIT_DONE/PROGRAM_B | Configuration Control | Master serial configuration clock, initialization status flag, and active-low reconfiguration trigger |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based In-System Configuration | Enables unlimited field reprogramming via JTAG, SelectMAP™, or master serial PROM - no hardware change required |
| Configurable LUT-as-RAM | Each 4-input LUT can operate as 16×1-bit synchronous RAM, 16×2-bit RAM, or 16-bit shift register - ideal for small buffers or DSP pipelines |
| Dedicated Carry Logic | Two per CLB slice - accelerates arithmetic (adders, counters) with predictable propagation delay, avoiding LUT-based carry chains |
| Die-Temperature Sensor Diode | On-die analog thermal sensing element - enables real-time junction temperature monitoring for thermal management |
| Internal 3-State Bussing | Per-CLB BUFT drivers feed partitionable horizontal bus lines - supports internal tri-state data highways without consuming routing resources |
Applications
| PCI Bridge Controller | High-Speed Data Acquisition |
|---|---|
|
Use Scenario: Implementing a 66-MHz PCI Local Bus-to-custom peripheral bridge in industrial test equipment. IC Role / Device Role / Timing Role: Configurable protocol translator and timing adapter handling PCI address/data multiplexing, arbitration, and burst transfers. Use Value: Leverages native 66-MHz PCI compliance, DLL-controlled clock domain crossing, and 166 I/Os to replace ASICs while supporting firmware-upgradable logic. |
Use Scenario: Capturing 100+ MSPS parallel ADC samples into on-chip FIFOs before serial transmission. IC Role / Device Role / Timing Role: High-speed parallel-to-serial converter with synchronized sampling clocks, deep buffering, and deterministic latency. Use Value: Uses 16-bit shift register mode per LUT and 40,960-bit block RAM to absorb burst data without external memory, reducing board area and power. |
| CompactPCI Hot-Swap Controller | Multi-Standard I/O Aggregator |
|
Use Scenario: Managing power sequencing, presence detection, and fault signaling during live insertion/removal of blades in telecom chassis. IC Role / Device Role / Timing Role: Real-time safety monitor interfacing to backplane sensors, relays, and LED indicators with fail-safe state machines. Use Value: Relies on die-temperature sensor diode for thermal derating and IEEE 1149.1 boundary scan for post-insertion diagnostics - critical for field reliability. |
Use Scenario: Consolidating disparate legacy interfaces (LVTTL, HSTL, SSTL2) onto a single processor bus in avionics display subsystems. IC Role / Device Role / Timing Role: Voltage-level and timing protocol translator between heterogeneous peripherals and host controller. Use Value: Exploits eight independent I/O banks with per-bank VCCO/VREF to co-locate 3.3 V LVTTL, 2.5 V SSTL2, and 1.5 V HSTL signals on one device - eliminating level-shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV100-6HQ240C | Same logic resources and speed grade, but HQ240 package has higher thermal dissipation and different mechanical footprint | Preferred for convection-cooled industrial enclosures where PQ240 thermal resistance is insufficient | Select when board layout accommodates HQ240's larger pad pitch and requires enhanced thermal performance |
| XCV150-6PQ240C | Higher density (164,674 gates, 3,888 logic cells), same PQ240 package and I/O count | Suitable for designs requiring additional logic margin or future scalability without PCB redesign | Choose when gate utilization exceeds 85% on XCV100-6PQ240C or when reserve capacity is needed for firmware updates |
Compared with XCV100-6PQ240C, the XCV100-6HQ240C offers identical functionality in a thermally robust QFP variant, while the XCV150-6PQ240C provides 51% more logic cells in the same footprint - enabling either thermal headroom or logic scalability without changing board layout.
Availability
XCV100-6PQ240C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, and CompactPCI hot-swap management requiring stable component supply across extended product lifecycles.
Supply support for XCV100-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA toolchains for high-performance digital system design.
The Virtex family - including XCV100-6PQ240C - was engineered for high-capacity, high-speed applications demanding ASIC-like performance with FPGA flexibility, targeting communications infrastructure, test & measurement, and industrial automation.
FAQ
What is the maximum operating frequency supported by the XCV100-6PQ240C?
The XCV100-6PQ240C supports synchronous system clock rates up to 200 MHz, including I/O timing. This maximum is achievable under worst-case conditions using the -6 speed grade and optimized placement/routing. Real-world performance depends on design complexity, resource utilization, and signal integrity - typical register-to-register paths achieve 5.0 ns delay (200 MHz), as verified in Xilinx DS003-1 Table 2.
Does the XCV100-6PQ240C support hot-swap functionality in CompactPCI systems?
Yes, the XCV100-6PQ240C is explicitly designed for hot-swappable operation in CompactPCI environments. Its I/O structure, power sequencing behavior, and configuration architecture meet CompactPCI hot-swap requirements, enabling safe insertion and removal while the backplane remains powered - a feature confirmed in the DS003-1 "Features" section and "Higher Performance" chapter.
How many block RAMs does the XCV100-6PQ240C contain, and what are their configurations?
The XCV100-6PQ240C contains 10 block SelectRAM™ units totaling 40,960 bits. Each block is a fully synchronous, dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096), supporting built-in bus-width conversion. This is documented in DS003-2 Table 3 and Figure 6.
Is the XCV100-6PQ240C still in production, or is it obsolete?
The XCV100-6PQ240C is marked as obsolete/under obsolescence per Xilinx DS003-1 (v4.0) revision history dated March 2013. While no longer manufactured, Aetrix Electronics maintains legacy supply channels with traceable, tested inventory for continued support of installed base systems and long-lifecycle industrial programs.
What I/O standards are supported by the XCV100-6PQ240C, and how are they grouped?
The XCV100-6PQ240C supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI (3.3 V and 5 V), HSTL Classes I/III/IV, SSTL2/I/II, GTL/GTL+, and CTT. These are grouped into eight I/O banks - four per side - with independent VCCO and VREF per bank, as defined in DS003-2 "I/O Banking" and Table 1.
XCV100-6PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 40960
- Number of I/O:
- 166
- Number of Gates:
- 108904
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV100-6PQ240C FAQ
1.How can I place an order for XCV100-6PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV100-6PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV100-6PQ240C reliable?
The price and inventory of XCV100-6PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100-6PQ240C is usually 5 days.
3.What payment methods are accepted for XCV100-6PQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100-6PQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV100-6PQ240C?
XCV100-6PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV100-6PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV100-6PQ240C?
For technical support, including XCV100-6PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100-6PQ240C requirements.
6.How does Aetrix verify that XCV100-6PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV100-6PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100-6PQ240C meets industry standards.
7.What is the process for return or replacement of XCV100-6PQ240C?
All XCV100-6PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100-6PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV100-6PQ240C part is unused and in its original packaging.
Return procedure for XCV100-6PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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