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AMD XCV100-6PQ240C

Part No.:
XCV100-6PQ240C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV100-6PQ240C.pdf
Description:
IC FPGA 166 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,952

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Product details

Overview

XCV100-6PQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells, 166 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control. It supports 66-MHz PCI compliance, hot-swappable operation in Compact PCI systems, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, and HSTL Class IV.

For engineers reviewing the XCV100-6PQ240C datasheet, pinout, applications, or equivalent options, key selection considerations include its 0.22 μm 5-layer metal CMOS process, 200 MHz system performance ceiling, configurable dual-ported 4k-bit block RAMs, die-temperature sensor diode, and IEEE 1149.1 boundary-scan support.

Technical Context

The XCV100-6PQ240C implements a hierarchical architecture with a 20×30 CLB array, each CLB containing four logic cells (LCs) with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its routing hierarchy includes local VersaBlock interconnect, global general-purpose routing matrix (GRM), 24 secondary local clock nets, and four primary low-skew global clock distribution nets.

It integrates 10 block SelectRAM™ memory units (40,960 bits total), each configurable as synchronous dual-ported 4k-bit RAM with independent port widths (1–16 bits). I/O banking enforces voltage domain isolation: eight banks with shared VCCO per bank (3.3 V, 2.5 V, or 1.5 V) and optional VREF per bank for input thresholding.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 108,904 - defines logic capacity for ASIC replacement or complex digital system integration
Logic Cells 2,700 - provides granular, place-and-route-efficient resources for combinational and sequential logic
User I/O Pins 166 - enables high-pin-count interface bridging (e.g., PCI, memory buses, custom parallel protocols)
Block RAM Bits 40,960 - supports on-chip buffering, FIFOs, or lookup tables without external memory
Max System Clock 200 MHz - sustains high-throughput data processing in synchronous designs with tight timing closure
DLL Count 4 - allows independent phase alignment and jitter reduction for multiple clock domains
Process Technology 0.22 μm 5-layer metal CMOS - delivers higher density and lower static power vs prior FPGA generations

Pinout & Package

Package: PQ240 - 240-pin Plastic Quad Flat Pack, 0.5 mm pitch, 32.5 mm × 32.5 mm body size, lead-free compatible (per Xilinx documentation DS003-4).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew inputs feeding four primary global clock networks
IO_LxxN/IO_LxxP Configurable I/O Bank Pin Supports differential or single-ended standards (LVTTL, HSTL, SSTL) per bank's VCCO/VREF
VCCO_0–VCCO_7 I/O Power Supply Eight independent VCCO rails - one per I/O bank - enabling mixed-voltage interface design
VREF_0–VREF_7 Input Reference Voltage Bank-specific reference for input thresholding; required for HSTL/SSTL but not LVTTL
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface IEEE 1149.1-compliant test access port for programming and in-system verification
CCLK/INIT_DONE/PROGRAM_B Configuration Control Master serial configuration clock, initialization status flag, and active-low reconfiguration trigger

Key Features

Feature Design Value
SRAM-based In-System Configuration Enables unlimited field reprogramming via JTAG, SelectMAP™, or master serial PROM - no hardware change required
Configurable LUT-as-RAM Each 4-input LUT can operate as 16×1-bit synchronous RAM, 16×2-bit RAM, or 16-bit shift register - ideal for small buffers or DSP pipelines
Dedicated Carry Logic Two per CLB slice - accelerates arithmetic (adders, counters) with predictable propagation delay, avoiding LUT-based carry chains
Die-Temperature Sensor Diode On-die analog thermal sensing element - enables real-time junction temperature monitoring for thermal management
Internal 3-State Bussing Per-CLB BUFT drivers feed partitionable horizontal bus lines - supports internal tri-state data highways without consuming routing resources

Applications

PCI Bridge Controller High-Speed Data Acquisition

Use Scenario: Implementing a 66-MHz PCI Local Bus-to-custom peripheral bridge in industrial test equipment.

IC Role / Device Role / Timing Role: Configurable protocol translator and timing adapter handling PCI address/data multiplexing, arbitration, and burst transfers.

Use Value: Leverages native 66-MHz PCI compliance, DLL-controlled clock domain crossing, and 166 I/Os to replace ASICs while supporting firmware-upgradable logic.

Use Scenario: Capturing 100+ MSPS parallel ADC samples into on-chip FIFOs before serial transmission.

IC Role / Device Role / Timing Role: High-speed parallel-to-serial converter with synchronized sampling clocks, deep buffering, and deterministic latency.

Use Value: Uses 16-bit shift register mode per LUT and 40,960-bit block RAM to absorb burst data without external memory, reducing board area and power.

CompactPCI Hot-Swap Controller Multi-Standard I/O Aggregator

Use Scenario: Managing power sequencing, presence detection, and fault signaling during live insertion/removal of blades in telecom chassis.

IC Role / Device Role / Timing Role: Real-time safety monitor interfacing to backplane sensors, relays, and LED indicators with fail-safe state machines.

Use Value: Relies on die-temperature sensor diode for thermal derating and IEEE 1149.1 boundary scan for post-insertion diagnostics - critical for field reliability.

Use Scenario: Consolidating disparate legacy interfaces (LVTTL, HSTL, SSTL2) onto a single processor bus in avionics display subsystems.

IC Role / Device Role / Timing Role: Voltage-level and timing protocol translator between heterogeneous peripherals and host controller.

Use Value: Exploits eight independent I/O banks with per-bank VCCO/VREF to co-locate 3.3 V LVTTL, 2.5 V SSTL2, and 1.5 V HSTL signals on one device - eliminating level-shifters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV100-6HQ240C Same logic resources and speed grade, but HQ240 package has higher thermal dissipation and different mechanical footprint Preferred for convection-cooled industrial enclosures where PQ240 thermal resistance is insufficient Select when board layout accommodates HQ240's larger pad pitch and requires enhanced thermal performance
XCV150-6PQ240C Higher density (164,674 gates, 3,888 logic cells), same PQ240 package and I/O count Suitable for designs requiring additional logic margin or future scalability without PCB redesign Choose when gate utilization exceeds 85% on XCV100-6PQ240C or when reserve capacity is needed for firmware updates

Compared with XCV100-6PQ240C, the XCV100-6HQ240C offers identical functionality in a thermally robust QFP variant, while the XCV150-6PQ240C provides 51% more logic cells in the same footprint - enabling either thermal headroom or logic scalability without changing board layout.

Availability

XCV100-6PQ240C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, and CompactPCI hot-swap management requiring stable component supply across extended product lifecycles.

Supply support for XCV100-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA toolchains for high-performance digital system design.

The Virtex family - including XCV100-6PQ240C - was engineered for high-capacity, high-speed applications demanding ASIC-like performance with FPGA flexibility, targeting communications infrastructure, test & measurement, and industrial automation.

FAQ

What is the maximum operating frequency supported by the XCV100-6PQ240C?

The XCV100-6PQ240C supports synchronous system clock rates up to 200 MHz, including I/O timing. This maximum is achievable under worst-case conditions using the -6 speed grade and optimized placement/routing. Real-world performance depends on design complexity, resource utilization, and signal integrity - typical register-to-register paths achieve 5.0 ns delay (200 MHz), as verified in Xilinx DS003-1 Table 2.

Does the XCV100-6PQ240C support hot-swap functionality in CompactPCI systems?

Yes, the XCV100-6PQ240C is explicitly designed for hot-swappable operation in CompactPCI environments. Its I/O structure, power sequencing behavior, and configuration architecture meet CompactPCI hot-swap requirements, enabling safe insertion and removal while the backplane remains powered - a feature confirmed in the DS003-1 "Features" section and "Higher Performance" chapter.

How many block RAMs does the XCV100-6PQ240C contain, and what are their configurations?

The XCV100-6PQ240C contains 10 block SelectRAM™ units totaling 40,960 bits. Each block is a fully synchronous, dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096), supporting built-in bus-width conversion. This is documented in DS003-2 Table 3 and Figure 6.

Is the XCV100-6PQ240C still in production, or is it obsolete?

The XCV100-6PQ240C is marked as obsolete/under obsolescence per Xilinx DS003-1 (v4.0) revision history dated March 2013. While no longer manufactured, Aetrix Electronics maintains legacy supply channels with traceable, tested inventory for continued support of installed base systems and long-lifecycle industrial programs.

What I/O standards are supported by the XCV100-6PQ240C, and how are they grouped?

The XCV100-6PQ240C supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI (3.3 V and 5 V), HSTL Classes I/III/IV, SSTL2/I/II, GTL/GTL+, and CTT. These are grouped into eight I/O banks - four per side - with independent VCCO and VREF per bank, as defined in DS003-2 "I/O Banking" and Table 1.

XCV100-6PQ240C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Total RAM Bits:
40960
Number of I/O:
166
Number of Gates:
108904
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV100-6PQ240C FAQ

1.How can I place an order for XCV100-6PQ240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV100-6PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV100-6PQ240C reliable?

The price and inventory of XCV100-6PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100-6PQ240C is usually 5 days.

3.What payment methods are accepted for XCV100-6PQ240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100-6PQ240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV100-6PQ240C?

XCV100-6PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV100-6PQ240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV100-6PQ240C?

For technical support, including XCV100-6PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100-6PQ240C requirements.

6.How does Aetrix verify that XCV100-6PQ240C is sourced from the original manufacturer or authorized distributors?

All XCV100-6PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100-6PQ240C meets industry standards.

7.What is the process for return or replacement of XCV100-6PQ240C?

All XCV100-6PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100-6PQ240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV100-6PQ240C part is unused and in its original packaging.

Return procedure for XCV100-6PQ240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV100-6PQ240C Tags

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