AMD XCV100-6TQ144C

Overview

XCV100-6TQ144C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 108,904 system gates, 2,700 logic cells in a 20×30 CLB array, and 98 user I/O pins in a 144-pin Thin Quad Flat Pack (TQFP) package. It features four delay-locked loops (DLLs), supports 66-MHz PCI compliance, and operates within the commercial temperature range (0°C to +85°C). It is used in high-speed digital signal processing and reconfigurable embedded control systems.

For engineers reviewing the XCV100-6TQ144C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, dual-port 4k-bit block RAM configuration, LUT-based 16-bit shift register capability, SelectIO™ interface support for LVTTL/PCI/HSTL/SSTL standards, and IEEE 1149.1 boundary-scan testability.

Technical Context

The XCV100-6TQ144C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling efficient place-and-route for complex synchronous designs. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input logic, and dual LUTs configurable as 16×1/16×2/32×1 RAM or 16-bit shift registers.

Each IOB supports independent input/output flip-flops with programmable clock enable, synchronous/asynchronous set/reset, and polarity control. I/O banking enforces shared VCCO per bank (3.3 V, 2.5 V, or 1.5 V), with eight banks in the TQ144 package, and supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards.

Key Specifications

Pinout & Package

Package: 144-pin Thin Quad Flat Pack (TQ144), 20 mm × 20 mm body, 0.5 mm pitch, lead-free compatible. Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - Pinout Tables, with eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), and JTAG boundary-scan interface (TCK, TMS, TDI, TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100-6TQ144C, the -5 variant trades performance for cost and power efficiency, while the XCV150-6TQ144C offers gate-count headroom and memory scalability - both retain identical pinout, I/O banking, and configuration interface, enabling direct migration paths in layout-constrained systems.

Availability

XCV100-6TQ144C is available at Aetrix Electronics and suitable for communications baseband processing, industrial motion control, and medical imaging data acquisition requiring stable component supply throughout extended product lifecycles.

Supply support for XCV100-6TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and design toolchains widely adopted in aerospace, telecom, and industrial markets.

The Virtex family - including XCV100-6TQ144C - was engineered for high-performance reconfigurable computing, targeting applications demanding 200 MHz system clocks, multi-standard I/O, and deterministic timing in ASIC-alternative deployments.

FAQ

What is the maximum operating frequency supported by the XCV100-6TQ144C?

The XCV100-6TQ144C is characterized for a maximum system clock frequency of 200 MHz, including I/O timing paths. This rating applies under worst-case conditions (commercial temperature, 2.5 V core, -6 speed grade) and assumes proper PCB layout, power integrity, and timing constraints. Actual achievable frequency depends on design complexity, placement, and routing - verified via Xilinx ISE timing analysis tools using the XCV100-6TQ144C device model.

Does the XCV100-6TQ144C support hot-swap functionality?

Yes, the XCV100-6TQ144C supports hot-swappable operation in Compact PCI systems, as confirmed in DS003-1 (v4.0). Its I/O structure includes robust ESD protection, controlled slew rates, and bus-hold circuitry compatible with live-insertion requirements. Implementation requires adherence to Compact PCI mechanical and electrical specifications, including proper sequencing of VCCO, VCCINT, and configuration signals during insertion.

How many block RAMs does the XCV100-6TQ144C contain, and what are their configurations?

The XCV100-6TQ144C contains ten 4k-bit block SelectRAMs totaling 40,960 bits. Each block is a fully synchronous dual-ported RAM with independent address, data, and control lines per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible bus-width conversion and simultaneous read/write operations - critical for buffering and data staging in XCV100-6TQ144C-based systems.

Is the XCV100-6TQ144C still in production, or is it obsolete?

The XCV100-6TQ144C is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with end-of-life status confirmed in XCN10016. However, Aetrix Electronics maintains legacy inventory and offers traceable, tested units for continued support of installed base systems. Lifecycle coordination services include last-time-buy planning and cross-reference guidance for migration paths.

Can the XCV100-6TQ144C be configured via JTAG, and what are the requirements?

Yes, the XCV100-6TQ144C supports IEEE 1149.1 JTAG configuration through dedicated TCK, TMS, TDI, and TDO pins. JTAG mode requires no external PROM and enables in-system programming, boundary-scan testing, and readback verification. A compliant JTAG cable and Xilinx iMPACT or ChipScope software are required; the device must be powered at 2.5 V core and 3.3 V I/O, with all VCCO banks properly terminated before initiating configuration.