AMD XCV100E-6BG352C

Overview

XCV100E-6BG352C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 196 user I/O pins in a 352-ball BGA package, and eight digital Delay-Locked Loops (DLLs) supporting 240 MHz system clocking and 622 Mb/s LVDS data rates. It integrates 81,920 bits of synchronous block RAM and 38,400 bits of distributed RAM for high-bandwidth memory-intensive applications such as baseband signal processing in wireless infrastructure.

For engineers reviewing the XCV100E-6BG352C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade timing performance, 1.8 V core voltage with 3.3 V I/O tolerance, PCI-compliant interface capability, and support for differential standards including LVDS, BLVDS, and LVPECL.

Technical Context

The XCV100E-6BG352C implements a regular array architecture of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and up to 4× frequency multiplication - enabling precise clock domain control across high-speed I/O and internal logic paths.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed signaling standards only when sharing the same VCCO voltage (e.g., LVTTL and PCI33_3 at 3.3 V). The device uses SelectI/O+ technology to deliver up to 804 single-ended or 344 differential I/O pairs, with programmable drive strength, slew rate, and weak-keeper circuits on all pins.

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100E-6BG352C, the -7 variant delivers improved timing headroom without changing pinout or power profile, while the PQ240 offers easier hand-soldering and debugging at the expense of I/O count and thermal performance.

Availability

XCV100E-6BG352C is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, test instrumentation, and network equipment requiring stable component supply over extended product lifecycles.

Supply support for XCV100E-6BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding compute and connectivity applications.

The Virtex-E product line was engineered specifically for high-speed digital signal processing, communications infrastructure, and embedded vision systems requiring both logic density and I/O flexibility with low-power 1.8 V operation.

FAQ

What is the maximum operating junction temperature for XCV100E-6BG352C?

The XCV100E-6BG352C is rated for commercial temperature range operation (0°C to +85°C junction temperature). This specification is defined in the DS022-1 Production Product Specification, Module 1, and applies to all Virtex-E devices with 'C' suffix. Thermal design must ensure that under full logic utilization and worst-case ambient conditions, the die temperature remains within this limit using appropriate heatsinking or airflow.

Does XCV100E-6BG352C support partial reconfiguration?

No, XCV100E-6BG352C does not support partial reconfiguration. The Virtex-E architecture lacks the hardware features required for dynamic module swapping, such as hierarchical configuration ports or frame-level addressability. Reconfiguration requires full bitstream loading via JTAG, SelectMAP, or master serial mode. Partial reconfiguration was introduced in later Virtex-II and Virtex-4 families.

Can XCV100E-6BG352C interface directly with 5 V TTL logic?

XCV100E-6BG352C I/O pins are 3 V tolerant and can withstand 5 V inputs only when an external 100 Ω series resistor is used per pin. Direct 5 V connection violates absolute maximum ratings and risks damage. For robust 5 V interfacing, level-shifting buffers or voltage translators are recommended. PCI 5 V signaling is explicitly unsupported per DS022-1 documentation.

How many DLLs are available in XCV100E-6BG352C and what are their primary functions?

XCV100E-6BG352C contains eight fully digital Delay-Locked Loops (DLLs). Each DLL provides zero-delay clock conversion, 50% duty-cycle correction for DDR applications, clock multiplication (up to 4×), and clock division. They accept high-speed LVPECL or LVDS inputs and generate low-jitter clocks for internal logic and I/O, eliminating need for external clock synthesizers in most designs.

Is XCV100E-6BG352C pin-compatible with earlier Virtex devices?

XCV100E-6BG352C is not pin-compatible with original Virtex devices due to differences in banking architecture, VCCO/VREF pin allocation, and I/O buffer power domains. While some packages share identical ball counts (e.g., BG352), pin functions differ significantly - particularly for VCCO, VREF, and global clock assignments. Migration requires PCB redesign and full I/O constraint revalidation per DS022-1 Section "Virtex-E Compared to Virtex Devices".