AMD XCV100E-6BG352I

Overview

XCV100E-6BG352I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 196 user I/O pins in a 352-ball BGA package, and eight digital Delay-Locked Loops (DLLs) for clock management. It delivers up to 240 MHz system performance and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed communication in telecom line cards.

For engineers reviewing the XCV100E-6BG352I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade timing, industrial temperature range (-40°C to +100°C), 1.8 V core voltage, dual-port block RAM capacity (81,920 bits), and compatibility with Xilinx Foundation and Alliance development tools.

Technical Context

The XCV100E-6BG352I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and flip-flops with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL, HSTL, LVDS, and LVPECL-within eight I/O banks, each requiring shared VCCO and optionally VREF. The device integrates 20 block RAMs (4096-bit each) arranged in four columns and features die-temperature sensing diodes for thermal monitoring.

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial ambient operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100E-6BG352I, the -7 variant trades 7% timing performance for lower static/dynamic power, while the -6FG456I retains identical speed and logic but adds 45% more I/O pins and tighter 1.0 mm ball pitch for space-constrained PCB layouts.

Availability

XCV100E-6BG352I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XCV100E-6BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and developed the Virtex family as high-performance programmable logic solutions for demanding system-level applications.

The Virtex-E product line was engineered for 1.8 V operation using a 0.18 μm 6-layer metal CMOS process, targeting high-speed communications, signal processing, and industrial control where density, I/O flexibility, and clock management are critical.

FAQ

What is the maximum operating frequency of the XCV100E-6BG352I?

The XCV100E-6BG352I achieves up to 240 MHz synchronous system clock rates including I/O, verified under worst-case industrial conditions. Its -6 speed grade guarantees register-to-register delays of ≤4.3 ns, and internal logic can operate above 133 MHz in typical designs. Actual frequency depends on design topology, placement, and routing.

Does the XCV100E-6BG352I support LVDS I/O standards?

Yes, the XCV100E-6BG352I supports LVDS as a differential I/O standard with data rates up to 622 Mb/s. LVDS signals require dedicated differential pin pairs and external 100 Ω termination resistors. The device's IOBs configure LVDS inputs and outputs natively without external biasing networks.

How many block RAMs does the XCV100E-6BG352I contain?

The XCV100E-6BG352I contains 20 block RAMs, each 4096 bits in size, totaling 81,920 bits of synchronous block memory. These blocks support true dual-port operation with independent read/write addresses and widths, enabling efficient FIFOs, frame buffers, and lookup tables in hardware.

Is the XCV100E-6BG352I pin-compatible with other Virtex-E devices in the BG352 package?

No - the XCV100E-6BG352I has a unique pinout within the BG352 package. While XCV50E and XCV100E share the BG352 option, their I/O counts differ (176 vs. 196), resulting in distinct ball assignments. Pin compatibility only holds between same-device variants (e.g., XCV100E-6BG352I and XCV100E-7BG352I).

What configuration modes does the XCV100E-6BG352I support?

The XCV100E-6BG352I supports JTAG (IEEE 1149.1), SelectMAP, slave serial, and master serial configuration modes. JTAG enables in-system programming and boundary-scan testing; SelectMAP allows high-speed parallel loading via microprocessor bus; master serial uses external SPROM for autonomous boot.