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AMD XCV100E-6BG352I0773
- Part No.:
- XCV100E-6BG352I0773
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 352-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV100E-6BG352I0773.pdf
- Description:
- VIRTEX FPGA, 600CLBS
- Quantity:
- Payment:
- Shipping:
Inventory:2,762
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Product details
Overview
XCV100E-6BG352I0773 from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 196 user I/O pins in a 352-ball BGA package, and eight digital Delay-Locked Loops (DLLs) supporting 240 MHz system clocking and 622 Mb/s LVDS data rates. It delivers high-density programmable logic for telecom line cards, industrial motion controllers, and high-speed protocol bridging.
For engineers reviewing the XCV100E-6BG352I0773 datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration, and legacy Virtex-E family compatibility guidance.
Technical Context
The XCV100E-6BG352I0773 implements a regular CLB array (20 × 30) with four logic cells per CLB, each containing dual 4-input LUTs, dedicated carry chains, and configurable flip-flops/latches with independent clock enable and synchronous/asynchronous set/reset. Its IOBs support 20 I/O standards-including LVDS, LVPECL, SSTL, HSTL-within eight voltage-defined I/O banks requiring shared VCCO and single VREF per bank.
It integrates 20 block SelectRAMs (81,920 bits total), each configured as true dual-port 4096-bit RAM with independent port widths, plus distributed RAM (38,400 bits) implemented in LUTs. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and up to 4× frequency multiplication-critical for source-synchronous interfaces and high-speed memory controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 32,400 - defines maximum combinational and sequential logic capacity; enables implementation of multi-channel DSP pipelines or multi-protocol MAC engines. |
| User I/O Pins | 196 - supports high-pin-count parallel buses (e.g., 32-bit PCI-X, 16-bit DDR SDRAM) with mixed-voltage bank partitioning. |
| Block RAM | 81,920 bits across 20 blocks - provides true dual-port memory for FIFO buffering, frame storage, or lookup tables without consuming CLB resources. |
| DLL Count | 8 - enables independent clock domain management for multiple high-speed interfaces (e.g., separate clocks for LVDS SerDes, DDR controller, and PCIe bridge). |
| Max System Clock | 240 MHz - achievable in register-to-register paths with -6 speed grade; supports real-time control loops and packet processing at sub-5 ns timing. |
| I/O Standards | LVDS, LVPECL, SSTL3/2, HSTL, LVTTL, LVCMOS - allows direct interfacing to memory, transceivers, and ASICs without level-shifting components. |
| Process Node | 0.18 μm 6-metal CMOS - delivers lower static power vs. 2.5 V Virtex, enabling higher integration density within thermal limits of industrial PCBs. |
Pinout & Package
Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew routing to all DLLs and CLBs; required for synchronous system timing and DLL reference input. |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and DLL logic; must be tightly regulated ±3% to maintain timing closure and avoid configuration loss. |
| VCCO_0–VCCO_7 | I/O Bank Supply | Bank-specific 1.5–3.3 V supplies; determines compatible output standards (e.g., VCCO=3.3 V enables LVTTL/PCI; VCCO=1.5 V enables HSTL). |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/LVCMOS inputs; must be stable ±1% to ensure setup/hold margin compliance. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1 interface for configuration, debugging, and production test; mandatory for in-system programming and fault isolation. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards with per-bank VCCO/VREF control-enables mixed-voltage board design without external level shifters. |
| SelectRAM+™ Memory Hierarchy | 81,920-bit block RAM + 38,400-bit distributed RAM-provides on-chip memory bandwidth >1.66 Tb/s for video frame buffers or packet reassembly. |
| Digital Delay-Locked Loops (DLLs) | Eight independent DLLs with 4× multiplication and duty-cycle correction-eliminates external clock synthesizers for DDR and source-synchronous links. |
| Flexible CLB Architecture | Four LCs per CLB with carry chains, F5/F6 multiplexers, and BUFTs-supports wide-input logic (up to 19 inputs), arithmetic-intensive functions, and internal bus driving. |
| SRAM-Based Configuration | Unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode-enables field-upgradable firmware and dynamic partial reconfiguration. |
Applications
| Telecom Line Card | Industrial Motion Controller |
|---|---|
Use Scenario: High-density TDM over SONET/SDH with 64-channel E1/T1 framing and jitter attenuation. IC Role / Device Role / Timing Role: Protocol mapper, framer, and clock domain crossing engine using DLL-synchronized LVDS interfaces to PHYs. Use Value: 196 I/Os support parallel 8× E1 interfaces; 8 DLLs manage independent line clock recovery and system timing; block RAM stores frame buffers. |
Use Scenario: Multi-axis servo drive with real-time position loop (20 kHz), EtherCAT slave stack, and analog I/O conditioning. IC Role / Device Role / Timing Role: Real-time deterministic controller implementing PID, encoder interpolation, and fieldbus protocol stack. Use Value: 32,400 logic cells host dual-core soft CPU + hardware accelerators; 240 MHz clock enables sub-500 ns control cycles; distributed RAM stores coefficient tables. |
| High-Speed Protocol Bridge | Medical Imaging Interface |
Use Scenario: PCIe-to-10GbE bridging in diagnostic imaging servers with DMA offload and packet classification. IC Role / Device Role / Timing Role: High-bandwidth interconnect fabric with embedded DMA engines and TCAM-based filtering logic. Use Value: 81,920-bit block RAM implements descriptor queues; LVDS I/Os interface to 10GbE PHYs at 622 Mb/s; DLLs synchronize PCIe and Ethernet clocks. |
Use Scenario: Ultrasound beamformer interfacing to ADCs (125 MSPS), FPGA-based digital down-conversion, and display pipeline. IC Role / Device Role / Timing Role: Real-time signal processor handling channel aggregation, FIR filtering, and scan conversion. Use Value: LUT-based distributed RAM stores filter coefficients; true dual-port block RAM buffers echo data streams; 200 MHz ZBT SRAM interface reduces external memory latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV100E-8BG352I | Higher speed grade (-8 vs. -6): 20% faster register-to-register timing (3.8 ns vs. 4.6 ns), tighter DLL jitter specs. | Suitable for designs requiring >200 MHz system clocks or stricter hold-time margins in LVDS source-synchronous capture. | Select when timing closure fails at -6 grade or when migrating from prototype to volume production with margin tightening. |
| XCV200E-6BG352I | Higher density: 63,504 logic cells (+96%), 284 user I/Os (+45%), 114,688-bit block RAM (+40%). Same package footprint. | Enables larger designs (e.g., full PCIe endpoint + video encoder) without PCB redesign; requires updated place-and-route constraints. | Choose for scalability path where future feature expansion is anticipated; same BG352 package simplifies board reuse. |
Compared with XCV100E-6BG352I0773, the -8 variant improves timing margin for high-frequency interfaces, while the XCV200E-6BG352I offers headroom for logic growth-both retain identical I/O banking rules, DLL architecture, and configuration methodology.
Availability
XCV100E-6BG352I0773 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply and long-term obsolescence management.
Supply support for XCV100E-6BG352I0773 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered high-performance FPGA architectures and developed the Virtex family for demanding system-level integration.
The Virtex-E product line was designed specifically for high-speed, high-density applications requiring advanced I/O flexibility, integrated memory, and precise clock management-targeting telecom, test equipment, and industrial control markets.
FAQ
Is XCV100E-6BG352I0773 still in production?
No, XCV100E-6BG352I0773 is obsolete per Xilinx Notice XCN09001 and XCN12026 (March 2014). Aetrix Electronics maintains limited legacy inventory and supports obsolescence mitigation through cross-reference analysis, second-source qualification, and lifetime buy planning for existing designs.
What is the maximum LVDS data rate supported by XCV100E-6BG352I0773?
XCV100E-6BG352I0773 supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Table 2 and the "Differential Signalling Support" section. This rate applies to source-synchronous interfaces using DLL-synchronized capture and is validated for industrial temperature operation.
Does XCV100E-6BG352I0773 support true dual-port block RAM?
Yes, XCV100E-6BG352I0773 includes 20 block SelectRAMs, each configurable as true dual-port 4096-bit RAM with independent read/write addresses, enables, and clocks per port-verified in DS022-2 Module 2, Table 4 and Figure 6.
Can XCV100E-6BG352I0773 replace Virtex devices in existing designs?
XCV100E-6BG352I0773 is not bitstream-compatible with Virtex devices, but Virtex designs can be recompiled for XCV100E-6BG352I0773. Pin compatibility exists with minor exceptions-refer to DS022-1 Module 4 pinout tables for exact mapping and bank voltage constraints.
What I/O standards require VREF on XCV100E-6BG352I0773?
XCV100E-6BG352I0773 requires VREF for SSTL3/I&II (1.50 V), SSTL2/I&II (1.25 V), HSTL I (0.75 V), HSTL III&IV (0.90 V), GTL (0.80 V), and GTL+ (1.0 V)-per DS022-2 Table 1. Each I/O bank uses one shared VREF voltage; mixing standards requiring different VREF is prohibited within a bank.
XCV100E-6BG352I0773 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 352-LBGA Exposed Pad, Metal
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 81920
- Number of I/O:
- 196
- Number of Gates:
- 128236
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 352-MBGA (35x35)
XCV100E-6BG352I0773 FAQ
1.How can I place an order for XCV100E-6BG352I0773 through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV100E-6BG352I0773 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV100E-6BG352I0773 reliable?
The price and inventory of XCV100E-6BG352I0773 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100E-6BG352I0773 is usually 5 days.
3.What payment methods are accepted for XCV100E-6BG352I0773?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100E-6BG352I0773 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV100E-6BG352I0773?
XCV100E-6BG352I0773 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV100E-6BG352I0773 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV100E-6BG352I0773?
For technical support, including XCV100E-6BG352I0773 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100E-6BG352I0773 requirements.
6.How does Aetrix verify that XCV100E-6BG352I0773 is sourced from the original manufacturer or authorized distributors?
All XCV100E-6BG352I0773 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100E-6BG352I0773 meets industry standards.
7.What is the process for return or replacement of XCV100E-6BG352I0773?
All XCV100E-6BG352I0773 units undergo pre-shipment inspection (PSI). If there is an issue with XCV100E-6BG352I0773, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV100E-6BG352I0773 part is unused and in its original packaging.
Return procedure for XCV100E-6BG352I0773:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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