AMD XCV100E-6CS144I

Overview

XCV100E-6CS144I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 94 user I/O pins in a 144-pin CSOP package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and targets high-speed communication and signal processing systems requiring reconfigurable logic with PCI-33/66 compliance.

For engineers reviewing the XCV100E-6CS144I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage, industrial temperature range (–40°C to +100°C), and support for true dual-port block RAM and SelectI/O+ standards including SSTL3, HSTL, and GTL.

Technical Context

The XCV100E-6CS144I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and flip-flops with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards via programmable VCCO and VREF per bank, with differential signaling (LVDS, BLVDS, LVPECL) enabled on dedicated pairs. Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication-critical for source-synchronous interfaces operating at up to 240 MHz system clock rates.

Key Specifications

Pinout & Package

The XCV100E-6CS144I uses a 144-pin Ceramic Staggered Pin Grid Array (CSOP) package with 12 × 12 pin arrangement, 1.27 mm pitch, and thermal pad. Pin functions are organized into eight I/O banks (Bank 0–7), each with dedicated VCCO and optional VREF pins. Global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK), and JTAG boundary-scan signals occupy fixed positions per DS022-4 Module 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100E-7CS144I and XCV100E-6PQ240C, the XCV100E-6CS144I uniquely balances industrial temperature operation, compact CSOP packaging, and guaranteed -6 speed performance-making it optimal for space-constrained, ruggedized embedded systems requiring deterministic timing.

Availability

XCV100E-6CS144I is available at Aetrix Electronics and suitable for high-reliability communication infrastructure, industrial control logic, and aerospace data acquisition systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XCV100E-6CS144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms for high-performance computing and embedded systems.

The Virtex-E family was designed for high-speed, high-density reconfigurable logic in telecommunications, test equipment, and military/aerospace applications-emphasizing I/O flexibility, clock management, and memory hierarchy.

FAQ

What is the maximum differential I/O pair count supported by the XCV100E-6CS144I?

The XCV100E-6CS144I supports up to 83 differential I/O pairs as specified in Table 1 of DS022-1. This capability is enabled by its SelectI/O+ architecture and applies specifically to the XCV100E device regardless of package; however, the CS144 package physically limits usable I/Os to 94 single-ended pins, constraining practical differential pair deployment to fewer than 83 due to pin allocation for power, clocks, and configuration. The XCV100E-6CS144I datasheet confirms this limit is device-level, not package-dependent.

Does the XCV100E-6CS144I support LVPECL clock inputs?

Yes, the XCV100E-6CS144I supports LVPECL clock inputs up to 300+ MHz as stated in the Features section of DS022-1. Its DLLs accept high-speed LVPECL and LVDS clock signals, converting them to internal logic levels with zero delay. This functionality is implemented in the IOBs and requires proper AC-coupling and termination per Xilinx application note XAPP165; the XCV100E-6CS144I pinout reserves dedicated global clock pins (GCLK0–GCLK3) for this purpose.

How many block RAMs does the XCV100E-6CS144I contain, and what is their configuration flexibility?

The XCV100E-6CS144I contains 20 block RAMs totaling 81,920 bits, as confirmed in Table 4 of DS022-2. Each block is a true dual-port 4096-bit RAM with independently configurable read/write data widths (1–36 bits per port), enabling built-in bus-width conversion. These blocks support synchronous read/write, byte-write enable, and programmable write mode-features documented in the Virtex-E Functional Description and directly applicable to the XCV100E-6CS144I device.

Is the XCV100E-6CS144I pin-compatible with other Virtex-E devices in the CS144 package?

No, the XCV100E-6CS144I is not pin-compatible with other Virtex-E devices in the CS144 package because only the XCV50E and XCV100E are offered in CS144 per Table 3 of DS022-1. While both share the same 144-pin footprint, their I/O counts differ (XCV50E: 94, XCV100E: 94), and pin functions-including VCCO assignments and bank boundaries-are device-specific. The XCV100E-6CS144I pinout is unique to its logic density and cannot substitute for XCV50E-6CS144I without redesign.

What configuration modes are supported by the XCV100E-6CS144I?

The XCV100E-6CS144I supports master serial (via external SPROM), slave serial, SelectMAP™ parallel, and IEEE 1149.1 JTAG configuration modes as described in DS022-1 Module 1 and DS022-2 Module 2. JTAG is used for boundary-scan testing and in-system programming; SelectMAP enables high-speed parallel loading from a microprocessor; and master serial provides autonomous boot from PROM. All modes are implemented in hardware and apply identically to the XCV100E-6CS144I device.