AMD XCV100E-6FG256C

Overview

XCV100E-6FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 176 user I/O pins in a 256-ball Fine-Pitch BGA package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface design.

For engineers reviewing the XCV100E-6FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal, 240 MHz system clock), 1.8 V core voltage with 3.3 V I/O tolerance, PCI-compliant 32/64-bit 33/66 MHz interface support, and compatibility with Xilinx Foundation™ and Alliance Series™ development tools.

Technical Context

The XCV100E-6FG256C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS-organized across eight I/O banks with bank-specific VCCO and VREF requirements. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermal pad optional.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100E-6FG256C, the -7 variant improves worst-case timing by 7% but increases cost and power; the PQ240 alternative trades 18 I/O pins and thermal performance for assembly simplicity and lower PCB fabrication cost.

Availability

XCV100E-6FG256C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, industrial control systems, and embedded vision applications requiring stable component supply across extended product lifecycles.

Supply support for XCV100E-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic solutions, delivering FPGAs, adaptive SoCs, and software-defined platforms for aerospace, automotive, and data center markets.

The Virtex-E family was designed specifically for high-performance, high-density digital systems demanding advanced I/O flexibility, integrated memory, and deterministic clock management-targeting communications, test equipment, and military avionics.

FAQ

What is the maximum operating junction temperature for XCV100E-6FG256C?

The XCV100E-6FG256C is rated for commercial temperature range (0 °C to +85 °C junction temperature). This is specified in the ordering code suffix 'C' per DS022-1 Section "Virtex-E Ordering Information". Thermal design must ensure die temperature remains within this limit under full static and dynamic loading, especially when using all 8 DLLs and high I/O toggle rates.

Does XCV100E-6FG256C support IEEE 1149.1 boundary-scan testing?

Yes, XCV100E-6FG256C includes full IEEE 1149.1 boundary-scan logic as standard. The TCK, TMS, TDI, and TDO pins are dedicated JTAG interface pins documented in Module 4 of DS022-4. This enables in-circuit testing, configuration verification, and debug access without requiring additional test points or probes on the PCB.

Can XCV100E-6FG256C be configured via JTAG only, or are other methods supported?

XCV100E-6FG256C supports multiple configuration modes: JTAG (boundary-scan), SelectMAP™ (parallel slave), master serial (via external PROM), and slave serial. All are detailed in DS022-2 Module 2. JTAG is mandatory for initial programming and debug, but production systems often use master serial for autonomous boot or SelectMAP™ for high-speed reconfiguration during operation.

What is the purpose of the die-temperature sensor diode in XCV100E-6FG256C?

The die-temperature sensor diode in XCV100E-6FG256C provides an analog voltage output proportional to junction temperature, calibrated to ±5 °C accuracy. It is accessed via dedicated analog pins (e.g., TEMP_DIODE in FG256 pinout) and used for thermal monitoring in fan-controlled systems or safety-critical applications where overheating must trigger shutdown before damage occurs.

Is XCV100E-6FG256C pin-compatible with earlier Virtex family devices?

No, XCV100E-6FG256C is not pin-compatible with original Virtex devices despite similar package footprints. DS022-1 explicitly states "The Virtex-E family is not bitstream-compatible with the Virtex family" and notes "some minor exceptions" in pin assignments-even identical packages require board redesign due to VCCO/VREF banking changes and relocated global clock pins.