AMD XCV100E-6FG256I

Overview

XCV100E-6FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 32,400 logic cells, 176 user I/O pins in FG256 package, and eight digital Delay-Locked Loops (DLLs). It delivers up to 240 MHz system clock performance and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed data acquisition and communication subsystems.

For engineers reviewing the XCV100E-6FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade timing, industrial temperature range (-40°C to +100°C), 1.8 V core voltage, dual-port block RAM capability, and compatibility with Xilinx Foundation and Alliance development tools.

Technical Context

The XCV100E-6FG256I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice.

Its IOBs support SelectI/O+™ technology with programmable drive strength, slew rate, and independent polarity control across 20 interface standards-including LVTTL, LVCMOS2, SSTL, HSTL, and differential LVDS/LVPECL-under banked VCCO/VREF constraints.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG256) with 256 balls, 1.0 mm pitch, and 176 user I/O pins distributed across eight I/O banks. VCCINT, VCCO, and VREF pins are bank-specific and require proper decoupling per Xilinx DS022-4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100E-6FG256I, the -7 variant trades timing performance for lower cost while maintaining identical functionality, whereas the PQ240 variant sacrifices I/O count and temperature range for package form factor and commercial qualification.

Availability

XCV100E-6FG256I is available at Aetrix Electronics and suitable for high-reliability industrial control, telecom infrastructure, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV100E-6FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding system-level applications.

The Virtex-E product line was designed specifically for applications requiring higher speed, greater density, and enhanced I/O flexibility than prior Virtex devices-targeting communications, computing, and industrial automation markets.

FAQ

What is the maximum operating frequency of the XCV100E-6FG256I?

The XCV100E-6FG256I achieves up to 240 MHz synchronous system clock performance with I/O included, and internal logic can operate above 133 MHz depending on design implementation. Its -6 speed grade guarantees worst-case register-to-register timing of 4.3 ns, validated under industrial temperature conditions. The eight DLLs support precise clock domain control and DDR clock synthesis essential for meeting these timing targets in real-world layouts.

Does the XCV100E-6FG256I support LVDS I/O?

Yes, the XCV100E-6FG256I supports LVDS I/O at data rates up to 622 Mb/s using differential pin pairs (IO_LxxN/IO_LxxP). It requires proper PCB layout with controlled impedance (100 Ω differential), matched trace lengths, and termination. LVDS operation is enabled per I/O bank and depends on correct VCCO (2.5 V) and absence of VREF on those pins. This capability is confirmed in DS022-1 Table 1 and DS022-2 Section "Differential Signalling Support".

How many block RAMs does the XCV100E-6FG256I contain?

The XCV100E-6FG256I contains 20 block RAMs, each 4096 bits in size, totaling 81,920 bits of true dual-port synchronous memory. These blocks are arranged in columns adjacent to CLB arrays and support independent read/write clocks and configurable data widths. This memory hierarchy is documented in DS022-2 Table 4 and enables efficient FIFOs, frame buffers, and lookup tables without consuming logic resources.

Is the XCV100E-6FG256I pin-compatible with other Virtex-E devices in FG256 package?

No, the XCV100E-6FG256I is not pin-compatible with other Virtex-E devices in the FG256 package. While XCV50E and XCV100E both offer FG256 variants, their I/O counts differ (158 vs. 176), and pin assignments-including VCCO, VREF, and dedicated clock locations-are device-specific. DS022-4 Pinout Tables confirm unique mappings per device. Migration between densities requires PCB redesign unless constrained to common signal subsets.

What development tools support the XCV100E-6FG256I?

The XCV100E-6FG256I is supported by Xilinx Foundation Series™ and Alliance Series™ development systems, including synthesis, place-and-route, simulation, and bitstream generation. These tools provide HDL entry (VHDL/Verilog), behavioral and post-route timing analysis, and JTAG-based configuration. Web-based HDL generation via SelectLink™ methodology is also available. Tool compatibility is specified in DS022-1 Module 1 and remains valid for legacy design flows targeting this production-part-number.