AMD XCV100E-6PQ240C

Overview

XCV100E-6PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 158 user I/O pins in a 240-pin PQFP package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface design.

For engineers reviewing the XCV100E-6PQ240C datasheet, pinout, applications, or equivalent options, this device serves as a production-grade, PCI-compliant FPGA for embedded control, protocol bridging, and high-bandwidth data acquisition where deterministic timing, dual-port memory access, and multi-standard I/O flexibility are required.

Technical Context

The XCV100E-6PQ240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS-with banked VCCO and VREF management. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise clock domain crossing and source-synchronous interface timing.

Key Specifications

Pinout & Package

PQ240 (Plastic Quad Flat Package) with 240 leads, 0.5 mm pitch, and 32.0 mm × 32.0 mm body size. Pinout conforms to DS022-4 Module 4 pin tables for XCV100E in PQ240 package; all I/O banks are segregated across four edges with dedicated VCCO, VREF, and global clock pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV100E-6PQ240C, the -7PQ240C offers verified timing headroom for aggressive clocking, while the -6HQ240C provides identical functionality with superior thermal performance-neither is pin-compatible due to distinct package footprints and thermal pad configurations.

Availability

XCV100E-6PQ240C is available at Aetrix Electronics and suitable for high-reliability industrial control, aerospace data handling, and telecom infrastructure requiring stable component supply over extended product lifecycles.

Supply support for XCV100E-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for adaptive computing.

The Virtex-E family was designed for high-performance, low-power reconfigurable systems demanding advanced I/O flexibility, integrated memory, and deterministic clock management-targeting communications infrastructure, test equipment, and real-time embedded processing.

FAQ

What is the maximum operating junction temperature for XCV100E-6PQ240C?

The XCV100E-6PQ240C is rated for commercial temperature range (0 °C to +85 °C junction temperature). Its PQ240 package has a thermal resistance (θ_JA) of 36.5 °C/W under standard JEDEC conditions. For reliable long-term operation, ensure board-level thermal design maintains T_J ≤ 85 °C under worst-case power dissipation, which for this device is approximately 2.1 W at 130 MHz toggle rate and full I/O loading.

Does XCV100E-6PQ240C support IEEE 1149.1 boundary scan?

Yes, XCV100E-6PQ240C includes full IEEE 1149.1-compliant boundary scan logic with TCK, TMS, TDI, and TDO pins. This enables in-circuit testing, configuration verification, and debug access during development and production. The boundary scan chain covers all user I/Os and internal logic elements, and is supported by Xilinx iMPACT software for programming and diagnostics.

Can XCV100E-6PQ240C interface directly with 3.3 V PCI buses?

Yes, XCV100E-6PQ240C is PCI 3.3 V compliant for both 32-bit/33 MHz and 32-bit/66 MHz operation. Its I/O buffers meet PCI specification requirements for voltage levels, timing, and drive strength when configured in PCI33_3 or PCI66_3 mode. No external level shifters are needed, but proper termination and layout guidelines per PCI Local Bus Specification Rev. 2.2 must be followed.

How many differential I/O pairs does XCV100E-6PQ240C support?

XCV100E-6PQ240C supports up to 83 differential I/O pairs, as confirmed in Table 1 of DS022-1. These are implemented using dedicated P/N pin pairs within the same I/O bank and require matched trace lengths and controlled impedance (100 Ω differential) for LVDS/BLVDS/LVPECL signaling. Not all 158 user I/Os can be used simultaneously as differential pairs due to bank constraints and pin allocation rules.

Is XCV100E-6PQ240C pin-compatible with earlier Virtex devices?

No, XCV100E-6PQ240C is not pin-compatible with original Virtex devices (e.g., XCV100), despite sharing the PQ240 package footprint. Differences in I/O banking structure, VCCO/VREF pin assignments, and global clock routing require PCB redesign. However, XCV100E-6PQ240C is pin-compatible with other Virtex-E family members in the same PQ240 package, such as XCV50E-6PQ240C and XCV200E-6PQ240C, subject to I/O bank usage constraints.