AMD XCV100E-6PQ240I

Overview

XCV100E-6PQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 158 user I/O pins in a 240-pin PQFP package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and targets high-speed communication and signal processing systems requiring PCI-compliant 3.3 V interfaces.

For engineers reviewing the XCV100E-6PQ240I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and industrial-temperature (-40°C to +100°C) operation requirements - all critical for FPGA-based system integration and timing closure.

Technical Context

The XCV100E-6PQ240I implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and 4× frequency multiplication - enabling precise clock domain control across multiple I/O banks.

I/O functionality is partitioned into eight banks with independent VCCO and VREF supply domains; LVTTL/LVCMOS2/PCI inputs are powered by VCCO (not VCCINT), and differential standards like LVDS require no external VREF. The device supports true dual-port block RAM (4096-bit per block), distributed RAM (38,400 bits), and SelectLink™ DDR interconnect between Virtex-E devices.

Key Specifications

Pinout & Package

PQ240 (Plastic Quad Flat Package) with 240 leads, 0.5 mm pitch, and 32.5 mm × 32.5 mm body size. Pin assignment follows Xilinx DS022-4 Module 4 pinout tables; I/O banks are distributed across four edges (Bank 0–7), each with dedicated VCCO/VREF pins and global clock inputs (GCLK0–GCLK3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV100E-6PQ240I, the -7 variant improves timing headroom for aggressive clock rates while the HQ240 variant addresses thermal limitations - neither changes logic capacity or I/O standard support, making them direct drop-in alternatives for specific environmental or performance constraints.

Availability

XCV100E-6PQ240I is available at Aetrix Electronics and suitable for high-reliability industrial control, medical imaging subsystems, and aerospace data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XCV100E-6PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms for high-performance computing and embedded systems.

The Virtex-E family was designed for demanding communication infrastructure and signal processing applications where high logic density, fast I/O, and flexible clock management are essential - delivering evolutionary improvements over Virtex with 1.8 V core voltage and enhanced DLL architecture.

FAQ

What is the maximum operating frequency of the XCV100E-6PQ240I internal logic?

The XCV100E-6PQ240I achieves up to 133 MHz internal register-to-register performance under worst-case timing conditions, with typical designs reaching over 311 MHz depending on placement and routing. This is enabled by its 0.18 μm 6-layer metal process and optimized CLB architecture - confirmed in DS022-3 Module 3 switching characteristics tables for the -6 speed grade.

Does the XCV100E-6PQ240I support LVDS input and output simultaneously on the same I/O bank?

Yes, the XCV100E-6PQ240I supports LVDS input, output, or bidirectional operation on any LVDS-capable pin, provided the bank's VCCO is set to 2.5 V and no conflicting I/O standards requiring different VREF voltages are assigned to the same bank - as specified in DS022-2 Table 1 and I/O Banking section.

How many block RAMs does the XCV100E-6PQ240I contain, and what is their configuration flexibility?

The XCV100E-6PQ240I contains 20 block RAMs totaling 81,920 bits, each configurable as true dual-port 4096-bit memory with independent read/write widths per port. This allows built-in bus-width conversion - for example, 32-bit write port and 8-bit read port - validated in DS022-2 Module 2 Block SelectRAM description and Table 4.

Is the XCV100E-6PQ240I pin-compatible with other Virtex-E devices in the PQ240 package?

Yes, all Virtex-E devices in the PQ240 package - including XCV50E, XCV100E, and XCV200E - share identical pinouts and mechanical footprint, with I/O assignments fixed per bank. However, unused pins may differ (e.g., NC pins vary by density), so PCB layout must follow the XCV100E-specific pin table in DS022-4 Module 4.

What configuration modes are supported by the XCV100E-6PQ240I?

The XCV100E-6PQ240I supports master serial (via external SPROM), slave serial, SelectMAP™ parallel, and IEEE 1149.1 JTAG configuration modes - enabling flexible programming during development, in-system updates, and boundary-scan testing as documented in DS022-1 Module 1 General Description and DS022-2 Module 2 Configuration Architecture.