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AMD XCV100E-6PQG240C

Part No.:
XCV100E-6PQG240C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV100E-6PQG240C.pdf
Description:
IC FPGA 158 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,887

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Product details

Overview

XCV100E-6PQG240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 196 user I/O pins in a 240-pin PQFP package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface design.

For engineers reviewing the XCV100E-6PQG240C datasheet, pinout, applications, or equivalent options, this device is selected for PCI-compliant 33/66-MHz system interfaces, DDR memory controllers requiring true dual-port block RAM, and source-synchronous data acquisition systems demanding deterministic clock management via DLLs.

Technical Context

The XCV100E-6PQG240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected by a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and LVDS-with banked VCCO (3.3 V/2.5 V/1.5 V) and optional VREF. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control for high-speed serial and parallel interfaces.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 32,400 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths
System Gates 128,236 - indicates silicon density suitable for medium-complexity ASIC replacements
Block RAM Bits 81,920 - enables 20 × 4096-bit true dual-port synchronous RAM blocks for FIFOs, buffers, and memory-mapped peripherals
User I/O Pins 196 - supports wide parallel buses, multi-standard interface coexistence, and high-bandwidth inter-chip communication
DLL Count 8 - allows independent clock domain management for multiple high-speed interfaces (e.g., DDR, LVDS, PCI)
Max I/O Speed 622 Mb/s (LVDS) - enables source-synchronous SerDes-like links without external PHYs
Internal Performance 130 MHz (4-LUT-level path) - defines worst-case synchronous logic depth for pipelined arithmetic and control loops
VCCINT 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling lower thermal design power in dense logic implementations

Pinout & Package

PQG240 denotes a 240-pin Plastic Quad Flat Package (PQFP) with 0.5 mm lead pitch, JEDEC MS-026 compliant, suitable for through-hole and surface-mount assembly. Thermal performance supports commercial temperature operation (0°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Inputs Dedicated low-skew clock inputs routed to all DLLs and CLBs; required for synchronous system timing
VCCINT Core Logic Supply 1.8 V supply for CLBs, RAM, and routing; must be decoupled locally to maintain signal integrity
VCCO_0–VCCO_7 I/O Bank Power Bank-specific 3.3 V / 2.5 V / 1.5 V supplies; each bank's VCCO sets output voltage and input threshold compatibility
VREF_0–VREF_7 Input Reference Voltage Bank-specific reference for SSTL/HSTL/GTL inputs; must be stable ±1% to meet setup/hold margins
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface for programming, debugging, and interconnect verification
PROGRAM_B Configuration Reset Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence

Key Features

Feature Design Value
SelectI/O+™ Technology Supports 20 I/O standards (LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, LVPECL) with banked VCCO/VREF-enables mixed-voltage board design without level shifters
SelectRAM+™ Hierarchy 81,920 bits of true dual-port block RAM + distributed RAM in CLBs-allows simultaneous read/write access for ping-pong buffering and memory-mapped peripherals
SelectLink™ DDR Interface Double Data Rate link between FPGA and external memory controllers-reduces pin count and increases bandwidth vs. SDR interfaces
Digital DLLs Eight fully digital delay-locked loops with 4× multiplication and duty-cycle correction-eliminates need for external clock synthesizers in DDR and high-speed I/O designs
Carry Chain Logic Dedicated fast-carry paths per CLB slice-enables 32-bit adders/subtractors with <5 ns propagation delay for real-time arithmetic
Configurable LUTs Each 4-input LUT operates as logic function generator, 16×1-bit RAM, or 16-bit shift register-supports embedded memory and high-speed data capture without external FIFOs

Applications

PCI Bridge Controller DDR Memory Interface

Use Scenario: Implementing a configurable PCI-to-custom peripheral bridge in industrial control backplanes.

IC Role / Device Role / Timing Role: XCV100E-6PQG240C acts as protocol translator and arbiter, managing 32-bit/33-MHz PCI transactions while synchronizing to local logic clocks via DLL.

Use Value: Leverages 196 I/Os for full PCI bus width, built-in boundary scan for production test, and 1.8 V core for lower power vs. legacy FPGAs in fanless enclosures.

Use Scenario: Building a high-bandwidth video frame buffer controller interfacing to 200 MHz DDR SDRAM.

IC Role / Device Role / Timing Role: XCV100E-6PQG240C provides address/command generation, data strobe alignment, and true dual-port block RAM for write/read separation.

Use Value: Uses eight DLLs to deskew DQS/DQ signals, achieves 400 MB/s sustained bandwidth, and avoids external PHY complexity.

Optical Line Card Interface Test Equipment Pattern Generator

Use Scenario: Aggregating multiple T1/E1 streams into OC-3 SONET framer in telecom line cards.

IC Role / Device Role / Timing Role: XCV100E-6PQG240C serves as time-division multiplexer with LVDS I/O for backplane connectivity and DLL-synchronized framing clocks.

Use Value: Supports 622 Mb/s LVDS signaling across 344 differential pairs, uses distributed RAM for jitter-tolerant elastic buffers, and meets Telcordia GR-1244-CORE jitter specs.

Use Scenario: Generating high-speed digital stimulus patterns for ATE systems targeting ASIC validation.

IC Role / Device Role / Timing Role: XCV100E-6PQG240C functions as programmable pattern sequencer with on-chip 16-bit shift registers and precise DLL-controlled output timing.

Use Value: Delivers deterministic sub-nanosecond edge placement accuracy, supports 130 MHz internal logic for complex vector generation, and enables field-upgradable test algorithms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV100E-7PQG240C Higher speed grade (-7 vs. -6): 1.2× faster worst-case register-to-register delay (4.3 ns vs. 5.1 ns at 133 MHz) Better suited for 160+ MHz system clocks or tighter timing closure in deep-pipeline designs Select when timing margin is critical and board layout supports same PQG240 footprint
XCV100E-6HQ240C Same speed grade but HQ240 package: enhanced thermal dissipation, identical pinout, higher I/O drive strength Preferred for thermally constrained environments or designs requiring >24 mA output drive per pin Choose for industrial temperature range extension or improved signal integrity in noisy EMI environments

Compared with XCV100E-6PQG240C, the -7PQG240C offers higher timing margin for aggressive clock rates, while the -6HQ240C improves thermal reliability and drive capability without changing logic design-both retain full bitstream and pin compatibility.

Availability

XCV100E-6PQG240C is available at Aetrix Electronics and suitable for PCI-compliant interface development, DDR memory controller implementation, optical transport equipment, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XCV100E-6PQG240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains used across aerospace, communications, and industrial markets.

The Virtex-E family was engineered to deliver high-density, low-power 1.8 V FPGA solutions for PCI, DDR, and source-synchronous interface applications-bridging the performance gap between ASICs and earlier FPGA generations.

FAQ

What is the maximum operating frequency of the XCV100E-6PQG240C?

The XCV100E-6PQG240C supports internal synchronous logic operation up to 130 MHz for four-LUT-level paths and system clock rates up to 240 MHz in optimized designs. Its eight DLLs enable precise clock deskewing and 50% duty cycle correction for DDR applications, making the XCV100E-6PQG240C suitable for high-speed interface timing closure.

Does the XCV100E-6PQG240C support LVDS I/O?

Yes, the XCV100E-6PQG240C supports LVDS (622 Mb/s), BLVDS, and LVPECL differential signaling with dedicated differential I/O pairs. It requires proper termination and VCCO = 2.5 V for LVDS outputs, and its IOBs include programmable drive strength and slew rate control to meet LVDS electrical specifications.

How many block RAMs does the XCV100E-6PQG240C contain?

The XCV100E-6PQG240C contains 20 block SelectRAM units, totaling 81,920 bits of true dual-port synchronous RAM. Each block is 4096 bits with independent read/write ports, supporting configurations like 256×32, 512×16, or 1024×8-ideal for FIFOs, coefficient storage, and memory-mapped peripherals in the XCV100E-6PQG240C.

Is the XCV100E-6PQG240C pin-compatible with other Virtex-E devices in the PQG240 package?

Yes, the XCV100E-6PQG240C shares the same 240-pin PQFP footprint with other Virtex-E devices in the PQG240 package (e.g., XCV50E-6PQG240C, XCV200E-6PQG240C). Pin functions are consistent across the family, though I/O bank assignments and VCCO/VREF pin counts vary-designers must verify bank voltage constraints per device density.

What configuration modes does the XCV100E-6PQG240C support?

The XCV100E-6PQG240C supports master serial (via external SPROM), slave serial, SelectMAP™ parallel, and IEEE 1149.1 JTAG configuration modes. JTAG is used for boundary scan testing and in-system programming, while SelectMAP™ enables high-speed parallel loading for rapid prototyping and production programming of the XCV100E-6PQG240C.

XCV100E-6PQG240C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Total RAM Bits:
81920
Number of I/O:
158
Number of Gates:
128236
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV100E-6PQG240C FAQ

1.How can I place an order for XCV100E-6PQG240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV100E-6PQG240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV100E-6PQG240C reliable?

The price and inventory of XCV100E-6PQG240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100E-6PQG240C is usually 5 days.

3.What payment methods are accepted for XCV100E-6PQG240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100E-6PQG240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV100E-6PQG240C?

XCV100E-6PQG240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV100E-6PQG240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV100E-6PQG240C?

For technical support, including XCV100E-6PQG240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100E-6PQG240C requirements.

6.How does Aetrix verify that XCV100E-6PQG240C is sourced from the original manufacturer or authorized distributors?

All XCV100E-6PQG240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100E-6PQG240C meets industry standards.

7.What is the process for return or replacement of XCV100E-6PQG240C?

All XCV100E-6PQG240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100E-6PQG240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV100E-6PQG240C part is unused and in its original packaging.

Return procedure for XCV100E-6PQG240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV100E-6PQG240C Tags

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