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AMD XCV100E-7BG352C

Part No.:
XCV100E-7BG352C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
352-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV100E-7BG352C.pdf
Description:
IC FPGA 196 I/O 352MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,590

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Product details

Overview

XCV100E-7BG352C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 32,400 logic cells, 196 user I/O pins in a 352-ball BGA package, and eight digital Delay-Locked Loops (DLLs). It delivers up to 240 MHz system clock performance and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed data acquisition and communication subsystems.

For engineers reviewing the XCV100E-7BG352C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration, and real-world FPGA integration considerations for industrial control and telecom interface design.

Technical Context

The XCV100E-7BG352C implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice. Its eight fully digital DLLs support zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication - critical for source-synchronous interfaces like LVDS at 622 Mb/s.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO (not VCCINT), enabling mixed-voltage signaling within bank constraints. Block RAM resources consist of 20 × 4096-bit true dual-port synchronous memory blocks, arranged in columns aligned with CLB arrays.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 32,400 - defines maximum combinational+sequential logic capacity; maps to ~128 k system gates for RTL synthesis estimation.
User I/O Pins 196 - usable single-ended signals in BG352 package; supports up to 83 differential I/O pairs with shared routing resources.
Block RAM 81,920 bits (20 × 4096-bit blocks) - enables true dual-port memory access with independent read/write widths per port for FIFO or buffer applications.
DLL Count 8 - provides independent clock domain management; each supports multiply/divide, duty-cycle correction, and LVPECL/LVDS clock deskew.
Max System Clock 240 MHz - achievable with optimized placement/routing; includes I/O timing for 33/66 MHz PCI and 200 MHz ZBT SRAM interfacing.
VCCINT 1.8 V ± 0.1 V - core logic supply; lower voltage than Virtex family (2.5 V), reducing dynamic power by ~40% at equivalent performance.
I/O Voltage Support LVTTL, LVCMOS2, LVCMOS18, SSTL3, HSTL, PCI33_3, LVDS, BLVDS, LVPECL - requires bank-level VCCO/VREF assignment per I/O standard.

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature range (0°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Inputs Dedicated low-skew clock inputs routed to all DLLs; require external termination when used with LVPECL/LVDS sources.
VCCINT Core Logic Supply 1.8 V supply for CLBs, RAM, and routing; must be decoupled locally with ≤10 nF ceramic capacitors near each pin.
VCCO_0–VCCO_7 I/O Bank Power Eight independent VCCO supplies (one per bank); each sets output drive voltage and input threshold reference for associated I/O pins.
VREF_0–VREF_7 I/O Threshold Reference Bank-specific reference voltage for SSTL/HSTL/GTL standards; must be externally sourced and stable within ±1%.
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface; enables in-system configuration, debugging, and post-configuration verification.

Key Features

Feature Design Value
SelectI/O+™ Technology Supports 20 I/O standards including LVDS (622 Mb/s) and LVPECL (300+ MHz clocks) with bank-isolated VCCO/VREF control.
SelectRAM+™ Memory Hierarchy 81,920 bits of true dual-port block RAM + 38,400 bits distributed RAM; enables pipelined memory access without external controllers.
SelectLink™ DDR Interface Hardened DDR link between FPGA fabric and external memory; reduces HDL development effort for high-bandwidth data streaming.
Digital DLL Architecture Eight DLLs with 4× multiplication, duty-cycle correction, and zero-delay clock conversion - eliminates external clock buffers for LVDS-to-LVTTL translation.
Flexible CLB Structure Each CLB contains four LUTs with carry logic, dual flip-flops, and F5/F6 multiplexers - supports wide-input functions (up to 19 inputs) and efficient arithmetic implementation.

Applications

High-Speed Data Acquisition Telecom Line Card Interface

Use Scenario: Capturing parallel ADC outputs at 100+ MSPS with real-time preprocessing before serial transmission.

IC Role / Device Role / Timing Role: XCV100E-7BG352C acts as a programmable front-end processor, synchronizing multiple ADC channels using DLL-managed clocks and buffering data in block RAM.

Use Value: Enables deterministic latency (<5 ns jitter) and eliminates need for external FIFOs or clock conditioners due to integrated DLLs and true dual-port RAM.

Use Scenario: Implementing protocol bridging between TDM backplane and packet-switched Ethernet in modular line cards.

IC Role / Device Role / Timing Role: XCV100E-7BG352C serves as a media access controller with embedded PCI interface, managing time-division multiplexing and packet assembly under strict 66 MHz timing.

Use Value: Delivers PCI-compliant 32-bit/66 MHz host interface plus LVDS SerDes links - consolidates two ASICs into single reconfigurable device.

Industrial Motion Control Medical Imaging Subsystem

Use Scenario: Closed-loop servo control with synchronized PWM generation, encoder feedback decoding, and safety monitoring.

IC Role / Device Role / Timing Role: XCV100E-7BG352C functions as a real-time motion engine, using dedicated carry logic for fast position interpolation and BUFT-driven internal bussing for deterministic interrupt response.

Use Value: Achieves sub-microsecond jitter on 20 kHz PWM outputs and supports simultaneous 4-axis encoder counting via parallel I/O banks.

Use Scenario: Real-time image reconstruction pipeline processing raw sensor data from CT or MRI detectors.

IC Role / Device Role / Timing Role: XCV100E-7BG352C performs pixel-level filtering, histogram equalization, and DICOM header insertion using distributed RAM LUTs and block RAM frame buffers.

Use Value: Provides 1.66 Tb/s aggregate memory bandwidth - sufficient for 16-bit 1024×1024 frame buffering at >60 fps without external DRAM bottlenecks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV100E-6BG352C Slower speed grade (-6 vs. -7): 0.3 ns longer register-to-register delay; same logic density, I/O count, and DLL count. Suitable for non-critical timing paths where 240 MHz system clock is not required; marginally lower power consumption. Select XCV100E-6BG352C only if design meets timing closure with ≥15% slack at target frequency.
XCV100E-7PQ240C Different package: 240-pin PQFP instead of 352-ball BGA; reduced I/O count (158 vs. 196) and no differential I/O support in PQ240 variant. Better suited for prototyping or cost-sensitive applications where board space allows larger footprint and lower pin count suffices. Choose XCV100E-7PQ240C only when PCB layout constraints favor QFP or when differential signaling is unnecessary.

Compared with XCV100E-6BG352C and XCV100E-7PQ240C, the XCV100E-7BG352C offers optimal balance of speed, I/O bandwidth, and package density - making it the preferred choice for production designs requiring LVDS interfacing, PCI compliance, and tight timing closure.

Availability

XCV100E-7BG352C is available at Aetrix Electronics and suitable for high-speed data acquisition, telecom line card interface, industrial motion control, and medical imaging subsystems requiring stable component supply across extended product lifecycles.

Supply support for XCV100E-7BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined platforms for aerospace, automotive, and communications markets.

The Virtex-E family was designed specifically for high-performance, low-power reconfigurable computing in infrastructure equipment - emphasizing I/O flexibility, clock management, and memory bandwidth over raw gate count.

FAQ

What is the maximum differential I/O pair count supported by XCV100E-7BG352C?

XCV100E-7BG352C supports up to 83 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capability is enabled by its SelectI/O+™ architecture and requires proper VCCO/VREF assignment per I/O bank to maintain signal integrity for LVDS or LVPECL standards.

Does XCV100E-7BG352C support true dual-port block RAM operation?

Yes, XCV100E-7BG352C includes 20 block RAM units, each configured as a true dual-port 4096-bit memory with independent read/write addresses, enables, and clocks per port. This is documented in DS022-2 (v2.8) Section "Block SelectRAM" and enables concurrent data ingestion and egress without arbitration logic.

Can XCV100E-7BG352C operate with 5 V tolerant I/Os?

No, XCV100E-7BG352C I/O pins are not 5 V tolerant by default. They support 3.3 V LVTTL/PCI and 2.5 V LVDS, but 5 V tolerance requires external 100 Ω series resistors per pin - and even then, PCI 5 V signaling is explicitly unsupported per DS022-1.

How many DLLs does XCV100E-7BG352C integrate, and what are their key capabilities?

XCV100E-7BG352C integrates eight fully digital Delay-Locked Loops (DLLs), each supporting clock multiply/divide, 50% duty-cycle correction for DDR, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard - all without external components.

Is XCV100E-7BG352C pin-compatible with earlier Virtex family devices?

XCV100E-7BG352C is not bitstream-compatible with Virtex devices, but shares pin compatibility with equivalent Virtex devices in the same BG352 package - with minor exceptions documented in DS022-4 pinout tables, such as NC assignments on specific pins like J10.

XCV100E-7BG352C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
352-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Total RAM Bits:
81920
Number of I/O:
196
Number of Gates:
128236
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
352-MBGA (35x35)

XCV100E-7BG352C FAQ

1.How can I place an order for XCV100E-7BG352C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV100E-7BG352C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV100E-7BG352C reliable?

The price and inventory of XCV100E-7BG352C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100E-7BG352C is usually 5 days.

3.What payment methods are accepted for XCV100E-7BG352C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100E-7BG352C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV100E-7BG352C?

XCV100E-7BG352C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV100E-7BG352C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV100E-7BG352C?

For technical support, including XCV100E-7BG352C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100E-7BG352C requirements.

6.How does Aetrix verify that XCV100E-7BG352C is sourced from the original manufacturer or authorized distributors?

All XCV100E-7BG352C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100E-7BG352C meets industry standards.

7.What is the process for return or replacement of XCV100E-7BG352C?

All XCV100E-7BG352C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100E-7BG352C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV100E-7BG352C part is unused and in its original packaging.

Return procedure for XCV100E-7BG352C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV100E-7BG352C Tags

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