AMD XCV100E-7BG352C
- Part No.:
- XCV100E-7BG352C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 352-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV100E-7BG352C.pdf
- Description:
- IC FPGA 196 I/O 352MBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,590
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Product details
Overview
XCV100E-7BG352C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 32,400 logic cells, 196 user I/O pins in a 352-ball BGA package, and eight digital Delay-Locked Loops (DLLs). It delivers up to 240 MHz system clock performance and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed data acquisition and communication subsystems.
For engineers reviewing the XCV100E-7BG352C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration, and real-world FPGA integration considerations for industrial control and telecom interface design.
Technical Context
The XCV100E-7BG352C implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice. Its eight fully digital DLLs support zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication - critical for source-synchronous interfaces like LVDS at 622 Mb/s.
I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO (not VCCINT), enabling mixed-voltage signaling within bank constraints. Block RAM resources consist of 20 × 4096-bit true dual-port synchronous memory blocks, arranged in columns aligned with CLB arrays.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 32,400 - defines maximum combinational+sequential logic capacity; maps to ~128 k system gates for RTL synthesis estimation. |
| User I/O Pins | 196 - usable single-ended signals in BG352 package; supports up to 83 differential I/O pairs with shared routing resources. |
| Block RAM | 81,920 bits (20 × 4096-bit blocks) - enables true dual-port memory access with independent read/write widths per port for FIFO or buffer applications. |
| DLL Count | 8 - provides independent clock domain management; each supports multiply/divide, duty-cycle correction, and LVPECL/LVDS clock deskew. |
| Max System Clock | 240 MHz - achievable with optimized placement/routing; includes I/O timing for 33/66 MHz PCI and 200 MHz ZBT SRAM interfacing. |
| VCCINT | 1.8 V ± 0.1 V - core logic supply; lower voltage than Virtex family (2.5 V), reducing dynamic power by ~40% at equivalent performance. |
| I/O Voltage Support | LVTTL, LVCMOS2, LVCMOS18, SSTL3, HSTL, PCI33_3, LVDS, BLVDS, LVPECL - requires bank-level VCCO/VREF assignment per I/O standard. |
Pinout & Package
Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature range (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Dedicated low-skew clock inputs routed to all DLLs; require external termination when used with LVPECL/LVDS sources. |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; must be decoupled locally with ≤10 nF ceramic capacitors near each pin. |
| VCCO_0–VCCO_7 | I/O Bank Power | Eight independent VCCO supplies (one per bank); each sets output drive voltage and input threshold reference for associated I/O pins. |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/GTL standards; must be externally sourced and stable within ±1%. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; enables in-system configuration, debugging, and post-configuration verification. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s) and LVPECL (300+ MHz clocks) with bank-isolated VCCO/VREF control. |
| SelectRAM+™ Memory Hierarchy | 81,920 bits of true dual-port block RAM + 38,400 bits distributed RAM; enables pipelined memory access without external controllers. |
| SelectLink™ DDR Interface | Hardened DDR link between FPGA fabric and external memory; reduces HDL development effort for high-bandwidth data streaming. |
| Digital DLL Architecture | Eight DLLs with 4× multiplication, duty-cycle correction, and zero-delay clock conversion - eliminates external clock buffers for LVDS-to-LVTTL translation. |
| Flexible CLB Structure | Each CLB contains four LUTs with carry logic, dual flip-flops, and F5/F6 multiplexers - supports wide-input functions (up to 19 inputs) and efficient arithmetic implementation. |
Applications
| High-Speed Data Acquisition | Telecom Line Card Interface |
|---|---|
|
Use Scenario: Capturing parallel ADC outputs at 100+ MSPS with real-time preprocessing before serial transmission. IC Role / Device Role / Timing Role: XCV100E-7BG352C acts as a programmable front-end processor, synchronizing multiple ADC channels using DLL-managed clocks and buffering data in block RAM. Use Value: Enables deterministic latency (<5 ns jitter) and eliminates need for external FIFOs or clock conditioners due to integrated DLLs and true dual-port RAM. |
Use Scenario: Implementing protocol bridging between TDM backplane and packet-switched Ethernet in modular line cards. IC Role / Device Role / Timing Role: XCV100E-7BG352C serves as a media access controller with embedded PCI interface, managing time-division multiplexing and packet assembly under strict 66 MHz timing. Use Value: Delivers PCI-compliant 32-bit/66 MHz host interface plus LVDS SerDes links - consolidates two ASICs into single reconfigurable device. |
| Industrial Motion Control | Medical Imaging Subsystem |
|
Use Scenario: Closed-loop servo control with synchronized PWM generation, encoder feedback decoding, and safety monitoring. IC Role / Device Role / Timing Role: XCV100E-7BG352C functions as a real-time motion engine, using dedicated carry logic for fast position interpolation and BUFT-driven internal bussing for deterministic interrupt response. Use Value: Achieves sub-microsecond jitter on 20 kHz PWM outputs and supports simultaneous 4-axis encoder counting via parallel I/O banks. |
Use Scenario: Real-time image reconstruction pipeline processing raw sensor data from CT or MRI detectors. IC Role / Device Role / Timing Role: XCV100E-7BG352C performs pixel-level filtering, histogram equalization, and DICOM header insertion using distributed RAM LUTs and block RAM frame buffers. Use Value: Provides 1.66 Tb/s aggregate memory bandwidth - sufficient for 16-bit 1024×1024 frame buffering at >60 fps without external DRAM bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV100E-6BG352C | Slower speed grade (-6 vs. -7): 0.3 ns longer register-to-register delay; same logic density, I/O count, and DLL count. | Suitable for non-critical timing paths where 240 MHz system clock is not required; marginally lower power consumption. | Select XCV100E-6BG352C only if design meets timing closure with ≥15% slack at target frequency. |
| XCV100E-7PQ240C | Different package: 240-pin PQFP instead of 352-ball BGA; reduced I/O count (158 vs. 196) and no differential I/O support in PQ240 variant. | Better suited for prototyping or cost-sensitive applications where board space allows larger footprint and lower pin count suffices. | Choose XCV100E-7PQ240C only when PCB layout constraints favor QFP or when differential signaling is unnecessary. |
Compared with XCV100E-6BG352C and XCV100E-7PQ240C, the XCV100E-7BG352C offers optimal balance of speed, I/O bandwidth, and package density - making it the preferred choice for production designs requiring LVDS interfacing, PCI compliance, and tight timing closure.
Availability
XCV100E-7BG352C is available at Aetrix Electronics and suitable for high-speed data acquisition, telecom line card interface, industrial motion control, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for XCV100E-7BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined platforms for aerospace, automotive, and communications markets.
The Virtex-E family was designed specifically for high-performance, low-power reconfigurable computing in infrastructure equipment - emphasizing I/O flexibility, clock management, and memory bandwidth over raw gate count.
FAQ
What is the maximum differential I/O pair count supported by XCV100E-7BG352C?
XCV100E-7BG352C supports up to 83 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capability is enabled by its SelectI/O+™ architecture and requires proper VCCO/VREF assignment per I/O bank to maintain signal integrity for LVDS or LVPECL standards.
Does XCV100E-7BG352C support true dual-port block RAM operation?
Yes, XCV100E-7BG352C includes 20 block RAM units, each configured as a true dual-port 4096-bit memory with independent read/write addresses, enables, and clocks per port. This is documented in DS022-2 (v2.8) Section "Block SelectRAM" and enables concurrent data ingestion and egress without arbitration logic.
Can XCV100E-7BG352C operate with 5 V tolerant I/Os?
No, XCV100E-7BG352C I/O pins are not 5 V tolerant by default. They support 3.3 V LVTTL/PCI and 2.5 V LVDS, but 5 V tolerance requires external 100 Ω series resistors per pin - and even then, PCI 5 V signaling is explicitly unsupported per DS022-1.
How many DLLs does XCV100E-7BG352C integrate, and what are their key capabilities?
XCV100E-7BG352C integrates eight fully digital Delay-Locked Loops (DLLs), each supporting clock multiply/divide, 50% duty-cycle correction for DDR, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard - all without external components.
Is XCV100E-7BG352C pin-compatible with earlier Virtex family devices?
XCV100E-7BG352C is not bitstream-compatible with Virtex devices, but shares pin compatibility with equivalent Virtex devices in the same BG352 package - with minor exceptions documented in DS022-4 pinout tables, such as NC assignments on specific pins like J10.
XCV100E-7BG352C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 352-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 81920
- Number of I/O:
- 196
- Number of Gates:
- 128236
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 352-MBGA (35x35)
XCV100E-7BG352C FAQ
1.How can I place an order for XCV100E-7BG352C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV100E-7BG352C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV100E-7BG352C reliable?
The price and inventory of XCV100E-7BG352C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100E-7BG352C is usually 5 days.
3.What payment methods are accepted for XCV100E-7BG352C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100E-7BG352C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV100E-7BG352C?
XCV100E-7BG352C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV100E-7BG352C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV100E-7BG352C?
For technical support, including XCV100E-7BG352C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100E-7BG352C requirements.
6.How does Aetrix verify that XCV100E-7BG352C is sourced from the original manufacturer or authorized distributors?
All XCV100E-7BG352C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100E-7BG352C meets industry standards.
7.What is the process for return or replacement of XCV100E-7BG352C?
All XCV100E-7BG352C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100E-7BG352C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV100E-7BG352C part is unused and in its original packaging.
Return procedure for XCV100E-7BG352C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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