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AMD XCV100E-7CS144C

Part No.:
XCV100E-7CS144C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
144-TFBGA, CSPBGA
Datasheet:
AetrixXCV100E-7CS144C.pdf
Description:
IC FPGA 94 I/O 144CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,844

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Product details

Overview

XCV100E-7CS144C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 94 user I/O pins in a 144-pin CSOP package. It delivers 130 MHz internal performance (four LUT levels), supports PCI 3.3 V/33–66 MHz, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communication interface design and embedded reconfigurable computing.

For engineers reviewing the XCV100E-7CS144C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage with 3.3 V I/O tolerance, dual-port block RAM capability, and support for LVDS (622 Mb/s), LVPECL, and HSTL I/O standards.

Technical Context

The XCV100E-7CS144C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards including LVTTL, LVCMOS2, SSTL3, HSTL I/IV, and differential LVDS/LVPECL, with banked VCCO and VREF constraints. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and up to 4× frequency multiplication - enabling precise timing control across high-speed source-synchronous interfaces.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 32,400 - determines maximum combinational and sequential logic capacity for complex state machines or datapaths.
System Gates 128,236 - indicates silicon density suitable for mid-scale ASIC replacement or protocol acceleration.
User I/O Pins 94 - fixed count for CS144 package; enables compact board layout with balanced signal routing.
Block RAM Bits 81,920 - distributed across 20 × 4096-bit true dual-port blocks for independent read/write access and bus-width conversion.
Speed Grade -7 - guarantees ≤4.3 ns register-to-register delay (worst-case), supporting 232+ MHz system clocks in optimized designs.
Core Voltage (VCCINT) 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling lower thermal footprint in dense embedded systems.
I/O Voltage Tolerance 3.3 V tolerant (with external resistor for 5 V) - allows direct interfacing to legacy PCI, LVTTL, and SSTL peripherals without level shifters.
DLL Count 8 - provides independent clock domain management for multi-rate interfaces (e.g., separate DDR, LVDS, and system clocks).

Pinout & Package

Package: 144-pin Ceramic Staggered Pin Grid Array (CSOP), 0.8 mm pitch, body size 22.3 × 22.3 mm, RoHS-compliant, commercial temperature range (0°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Inputs Four dedicated low-skew clock inputs routed to all DLLs and CLBs; essential for synchronous system timing.
VCCINT Core Power Supply 1.8 V supply for internal logic and memory; requires local decoupling near package corner pins.
VCCO_0–VCCO_3 I/O Bank Power Supplies Independent 3.3 V (or 2.5 V/1.8 V) supplies per I/O bank; enables mixed-voltage signaling within device boundaries.
IO_LxxN/IO_LxxP Differential I/O Pairs LVDS-compatible complementary pairs (e.g., IO_L12N/IO_L12P); support 622 Mb/s source-synchronous data capture.
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface for configuration verification, in-system programming, and debug.

Key Features

Feature Design Value
SelectI/O+™ Technology Supports 20 I/O standards (LVTTL, LVCMOS2, SSTL3, HSTL I/IV, LVDS, LVPECL) with programmable drive strength and slew rate - eliminates external level translators in mixed-signaling systems.
SelectRAM+™ Memory Hierarchy 81,920 bits of true dual-port block RAM + 38,400 bits distributed RAM - enables on-chip FIFOs, frame buffers, and lookup tables without external memory latency.
Digital Delay-Locked Loops (DLLs) Eight independent DLLs with 4× multiplication, duty-cycle correction, and zero-delay LVPECL/LVDS clock conversion - critical for jitter-sensitive SerDes and DDR PHY timing.
Carry Chain & Arithmetic Logic Dedicated 2-bit-per-CLB carry chain + XOR/AND gates - accelerates adders, counters, and multiplier accumulation with predictable propagation delay.
Configurable Storage Elements Per-slice D-flip-flops/latches with independent CE, SR/BY, and polarity control - supports gated clocks, pipeline staging, and asynchronous reset isolation.

Applications

High-Speed Communication Interface PCI Bus Acceleration

Use Scenario: Implementing a 66 MHz PCI-X slave interface with burst-mode addressing and DMA handshaking.

IC Role / Device Role / Timing Role: XCV100E-7CS144C acts as protocol bridge and address decoder, managing PCI command decoding, data multiplexing, and timing compliance using DLL-synchronized strobes.

Use Value: Leverages 94 I/Os with PCI-compliant 3.3 V signaling and 4.3 ns register-to-register delay to meet PCI timing closure without external glue logic.

Use Scenario: Offloading TCP/IP packet parsing and checksum calculation from host CPU in network edge devices.

IC Role / Device Role / Timing Role: XCV100E-7CS144C serves as a reconfigurable packet processor, executing parallel pattern matching and CRC-32 computation using distributed LUT RAM and carry chains.

Use Value: Uses 32,400 logic cells and 81,920 block RAM bits to sustain 1 Gbps line-rate processing with sub-microsecond latency.

LVDS-Based Camera Link Interface DDR SDRAM Controller

Use Scenario: Capturing 8-bit, 65 MHz pixel streams from industrial CMOS sensors over 4-lane LVDS links.

IC Role / Device Role / Timing Role: XCV100E-7CS144C functions as serializer/deserializer and frame buffer controller, using LVDS I/O pairs and DLL-aligned sampling clocks.

Use Value: Achieves 622 Mb/s per LVDS lane with built-in differential termination and zero-jitter clock recovery via DLL phase alignment.

Use Scenario: Managing 200 MHz DDR SDRAM for video frame buffering in portable medical imaging systems.

IC Role / Device Role / Timing Role: XCV100E-7CS144C implements full DDR PHY with write leveling, read deskew, and command scheduling using block RAM for command queues.

Use Value: Delivers 1.66 Tb/s equivalent memory bandwidth via true dual-port block RAM and dedicated DDR timing controls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV100E-6CS144C Slower -6 speed grade (4.6 ns register-to-register delay); identical logic density, I/O count, and package. Suitable for cost-sensitive designs where 232 MHz system clock is not required; lower static power at same VCCINT. Select when timing margin exists and BOM cost reduction is prioritized over peak performance.
XCV100E-7PQ240C Same -7 speed grade and logic resources, but 240-pin PQFP package with 158 user I/Os and larger PCB footprint. Required when more I/Os or enhanced thermal dissipation are needed; supports additional banks for mixed-voltage I/O expansion. Choose when board layout allows larger package and >94 I/Os are necessary for system interconnect.

Compared with XCV100E-7CS144C, the -6 variant trades 7% speed for lower cost and power, while the -7PQ240C retains speed but expands I/O and thermal headroom at the expense of board area - making the CS144 variant optimal for space-constrained, high-clock-frequency embedded controllers.

Availability

XCV100E-7CS144C is available at Aetrix Electronics and suitable for high-speed communication interface design, PCI bus acceleration, LVDS camera link implementation, and DDR SDRAM controller development requiring stable component supply across extended production cycles.

Supply support for XCV100E-7CS144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute solutions since 1984.

The Virtex-E family was designed for high-performance, low-power reconfigurable computing in communications infrastructure, test equipment, and embedded vision - emphasizing I/O flexibility, clock precision, and memory bandwidth over raw gate count.

FAQ

What is the maximum operating frequency supported by XCV100E-7CS144C?

XCV100E-7CS144C achieves up to 240 MHz synchronous system clock rates (including I/O) and 622 Mb/s LVDS data rates under worst-case timing conditions. Its -7 speed grade guarantees ≤4.3 ns register-to-register delay, enabling robust timing closure for designs targeting 232+ MHz clocks with proper placement and routing.

Does XCV100E-7CS144C support JTAG configuration and boundary scan?

Yes, XCV100E-7CS144C includes IEEE 1149.1-compliant boundary scan logic with dedicated TCK, TMS, TDI, and TDO pins. This enables in-system programming, configuration verification, and structural testing without requiring external programmers - a standard feature across all Virtex-E devices.

Can XCV100E-7CS144C interface directly with 5 V logic components?

XCV100E-7CS144C I/O pins are 3.3 V tolerant by default and can be made 5 V tolerant using an external 100 Ω series resistor per pin. However, native 5 V PCI signaling is not supported - only 3.3 V PCI (33/66 MHz) complies with its electrical specifications.

How many block RAMs does XCV100E-7CS144C contain, and what are their configurations?

XCV100E-7CS144C contains 20 block RAMs, each 4096 bits, totaling 81,920 bits. Each block supports true dual-port operation with independent read/write addresses, enabling simultaneous access for applications like ping-pong buffering or FIFOs with configurable data widths (1–36 bits per port).

Is XCV100E-7CS144C pin-compatible with other Virtex-E devices in the CS144 package?

Yes, all Virtex-E devices offered in the CS144 package - including XCV50E-7CS144C and XCV100E-7CS144C - share identical pinouts and I/O banking structure. This enables hardware scalability: a design targeting XCV50E can be upgraded to XCV100E without PCB revision, provided power and thermal margins allow.

XCV100E-7CS144C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
144-TFBGA, CSPBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Total RAM Bits:
81920
Number of I/O:
94
Number of Gates:
128236
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
144-LCSBGA (12x12)

XCV100E-7CS144C FAQ

1.How can I place an order for XCV100E-7CS144C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV100E-7CS144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV100E-7CS144C reliable?

The price and inventory of XCV100E-7CS144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100E-7CS144C is usually 5 days.

3.What payment methods are accepted for XCV100E-7CS144C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100E-7CS144C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV100E-7CS144C?

XCV100E-7CS144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV100E-7CS144C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV100E-7CS144C?

For technical support, including XCV100E-7CS144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100E-7CS144C requirements.

6.How does Aetrix verify that XCV100E-7CS144C is sourced from the original manufacturer or authorized distributors?

All XCV100E-7CS144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100E-7CS144C meets industry standards.

7.What is the process for return or replacement of XCV100E-7CS144C?

All XCV100E-7CS144C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100E-7CS144C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV100E-7CS144C part is unused and in its original packaging.

Return procedure for XCV100E-7CS144C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV100E-7CS144C Tags

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