AMD XCV100E-7CS144C
- Part No.:
- XCV100E-7CS144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-TFBGA, CSPBGA
- Datasheet:
-
XCV100E-7CS144C.pdf
- Description:
- IC FPGA 94 I/O 144CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV100E-7CS144C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 94 user I/O pins in a 144-pin CSOP package. It delivers 130 MHz internal performance (four LUT levels), supports PCI 3.3 V/33–66 MHz, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communication interface design and embedded reconfigurable computing.
For engineers reviewing the XCV100E-7CS144C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage with 3.3 V I/O tolerance, dual-port block RAM capability, and support for LVDS (622 Mb/s), LVPECL, and HSTL I/O standards.
Technical Context
The XCV100E-7CS144C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.
Its IOBs support 20 I/O standards including LVTTL, LVCMOS2, SSTL3, HSTL I/IV, and differential LVDS/LVPECL, with banked VCCO and VREF constraints. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and up to 4× frequency multiplication - enabling precise timing control across high-speed source-synchronous interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 32,400 - determines maximum combinational and sequential logic capacity for complex state machines or datapaths. |
| System Gates | 128,236 - indicates silicon density suitable for mid-scale ASIC replacement or protocol acceleration. |
| User I/O Pins | 94 - fixed count for CS144 package; enables compact board layout with balanced signal routing. |
| Block RAM Bits | 81,920 - distributed across 20 × 4096-bit true dual-port blocks for independent read/write access and bus-width conversion. |
| Speed Grade | -7 - guarantees ≤4.3 ns register-to-register delay (worst-case), supporting 232+ MHz system clocks in optimized designs. |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling lower thermal footprint in dense embedded systems. |
| I/O Voltage Tolerance | 3.3 V tolerant (with external resistor for 5 V) - allows direct interfacing to legacy PCI, LVTTL, and SSTL peripherals without level shifters. |
| DLL Count | 8 - provides independent clock domain management for multi-rate interfaces (e.g., separate DDR, LVDS, and system clocks). |
Pinout & Package
Package: 144-pin Ceramic Staggered Pin Grid Array (CSOP), 0.8 mm pitch, body size 22.3 × 22.3 mm, RoHS-compliant, commercial temperature range (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Four dedicated low-skew clock inputs routed to all DLLs and CLBs; essential for synchronous system timing. |
| VCCINT | Core Power Supply | 1.8 V supply for internal logic and memory; requires local decoupling near package corner pins. |
| VCCO_0–VCCO_3 | I/O Bank Power Supplies | Independent 3.3 V (or 2.5 V/1.8 V) supplies per I/O bank; enables mixed-voltage signaling within device boundaries. |
| IO_LxxN/IO_LxxP | Differential I/O Pairs | LVDS-compatible complementary pairs (e.g., IO_L12N/IO_L12P); support 622 Mb/s source-synchronous data capture. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for configuration verification, in-system programming, and debug. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVTTL, LVCMOS2, SSTL3, HSTL I/IV, LVDS, LVPECL) with programmable drive strength and slew rate - eliminates external level translators in mixed-signaling systems. |
| SelectRAM+™ Memory Hierarchy | 81,920 bits of true dual-port block RAM + 38,400 bits distributed RAM - enables on-chip FIFOs, frame buffers, and lookup tables without external memory latency. |
| Digital Delay-Locked Loops (DLLs) | Eight independent DLLs with 4× multiplication, duty-cycle correction, and zero-delay LVPECL/LVDS clock conversion - critical for jitter-sensitive SerDes and DDR PHY timing. |
| Carry Chain & Arithmetic Logic | Dedicated 2-bit-per-CLB carry chain + XOR/AND gates - accelerates adders, counters, and multiplier accumulation with predictable propagation delay. |
| Configurable Storage Elements | Per-slice D-flip-flops/latches with independent CE, SR/BY, and polarity control - supports gated clocks, pipeline staging, and asynchronous reset isolation. |
Applications
| High-Speed Communication Interface | PCI Bus Acceleration |
|---|---|
|
Use Scenario: Implementing a 66 MHz PCI-X slave interface with burst-mode addressing and DMA handshaking. IC Role / Device Role / Timing Role: XCV100E-7CS144C acts as protocol bridge and address decoder, managing PCI command decoding, data multiplexing, and timing compliance using DLL-synchronized strobes. Use Value: Leverages 94 I/Os with PCI-compliant 3.3 V signaling and 4.3 ns register-to-register delay to meet PCI timing closure without external glue logic. |
Use Scenario: Offloading TCP/IP packet parsing and checksum calculation from host CPU in network edge devices. IC Role / Device Role / Timing Role: XCV100E-7CS144C serves as a reconfigurable packet processor, executing parallel pattern matching and CRC-32 computation using distributed LUT RAM and carry chains. Use Value: Uses 32,400 logic cells and 81,920 block RAM bits to sustain 1 Gbps line-rate processing with sub-microsecond latency. |
| LVDS-Based Camera Link Interface | DDR SDRAM Controller |
|
Use Scenario: Capturing 8-bit, 65 MHz pixel streams from industrial CMOS sensors over 4-lane LVDS links. IC Role / Device Role / Timing Role: XCV100E-7CS144C functions as serializer/deserializer and frame buffer controller, using LVDS I/O pairs and DLL-aligned sampling clocks. Use Value: Achieves 622 Mb/s per LVDS lane with built-in differential termination and zero-jitter clock recovery via DLL phase alignment. |
Use Scenario: Managing 200 MHz DDR SDRAM for video frame buffering in portable medical imaging systems. IC Role / Device Role / Timing Role: XCV100E-7CS144C implements full DDR PHY with write leveling, read deskew, and command scheduling using block RAM for command queues. Use Value: Delivers 1.66 Tb/s equivalent memory bandwidth via true dual-port block RAM and dedicated DDR timing controls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV100E-6CS144C | Slower -6 speed grade (4.6 ns register-to-register delay); identical logic density, I/O count, and package. | Suitable for cost-sensitive designs where 232 MHz system clock is not required; lower static power at same VCCINT. | Select when timing margin exists and BOM cost reduction is prioritized over peak performance. |
| XCV100E-7PQ240C | Same -7 speed grade and logic resources, but 240-pin PQFP package with 158 user I/Os and larger PCB footprint. | Required when more I/Os or enhanced thermal dissipation are needed; supports additional banks for mixed-voltage I/O expansion. | Choose when board layout allows larger package and >94 I/Os are necessary for system interconnect. |
Compared with XCV100E-7CS144C, the -6 variant trades 7% speed for lower cost and power, while the -7PQ240C retains speed but expands I/O and thermal headroom at the expense of board area - making the CS144 variant optimal for space-constrained, high-clock-frequency embedded controllers.
Availability
XCV100E-7CS144C is available at Aetrix Electronics and suitable for high-speed communication interface design, PCI bus acceleration, LVDS camera link implementation, and DDR SDRAM controller development requiring stable component supply across extended production cycles.
Supply support for XCV100E-7CS144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute solutions since 1984.
The Virtex-E family was designed for high-performance, low-power reconfigurable computing in communications infrastructure, test equipment, and embedded vision - emphasizing I/O flexibility, clock precision, and memory bandwidth over raw gate count.
FAQ
What is the maximum operating frequency supported by XCV100E-7CS144C?
XCV100E-7CS144C achieves up to 240 MHz synchronous system clock rates (including I/O) and 622 Mb/s LVDS data rates under worst-case timing conditions. Its -7 speed grade guarantees ≤4.3 ns register-to-register delay, enabling robust timing closure for designs targeting 232+ MHz clocks with proper placement and routing.
Does XCV100E-7CS144C support JTAG configuration and boundary scan?
Yes, XCV100E-7CS144C includes IEEE 1149.1-compliant boundary scan logic with dedicated TCK, TMS, TDI, and TDO pins. This enables in-system programming, configuration verification, and structural testing without requiring external programmers - a standard feature across all Virtex-E devices.
Can XCV100E-7CS144C interface directly with 5 V logic components?
XCV100E-7CS144C I/O pins are 3.3 V tolerant by default and can be made 5 V tolerant using an external 100 Ω series resistor per pin. However, native 5 V PCI signaling is not supported - only 3.3 V PCI (33/66 MHz) complies with its electrical specifications.
How many block RAMs does XCV100E-7CS144C contain, and what are their configurations?
XCV100E-7CS144C contains 20 block RAMs, each 4096 bits, totaling 81,920 bits. Each block supports true dual-port operation with independent read/write addresses, enabling simultaneous access for applications like ping-pong buffering or FIFOs with configurable data widths (1–36 bits per port).
Is XCV100E-7CS144C pin-compatible with other Virtex-E devices in the CS144 package?
Yes, all Virtex-E devices offered in the CS144 package - including XCV50E-7CS144C and XCV100E-7CS144C - share identical pinouts and I/O banking structure. This enables hardware scalability: a design targeting XCV50E can be upgraded to XCV100E without PCB revision, provided power and thermal margins allow.
XCV100E-7CS144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 144-TFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 600
- Number of Logic Elements/Cells:
- 2700
- Total RAM Bits:
- 81920
- Number of I/O:
- 94
- Number of Gates:
- 128236
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-LCSBGA (12x12)
XCV100E-7CS144C FAQ
1.How can I place an order for XCV100E-7CS144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV100E-7CS144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV100E-7CS144C reliable?
The price and inventory of XCV100E-7CS144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100E-7CS144C is usually 5 days.
3.What payment methods are accepted for XCV100E-7CS144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100E-7CS144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV100E-7CS144C?
XCV100E-7CS144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV100E-7CS144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV100E-7CS144C?
For technical support, including XCV100E-7CS144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100E-7CS144C requirements.
6.How does Aetrix verify that XCV100E-7CS144C is sourced from the original manufacturer or authorized distributors?
All XCV100E-7CS144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100E-7CS144C meets industry standards.
7.What is the process for return or replacement of XCV100E-7CS144C?
All XCV100E-7CS144C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100E-7CS144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV100E-7CS144C part is unused and in its original packaging.
Return procedure for XCV100E-7CS144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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