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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV100E-7FG256C

Name: XCV100E-7FG256C
Brand: AMD
SKU: XCV100E-7FG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV100E-7FG256C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 256-BGA

Datasheet:: XCV100E-7FG256C.pdf

Description:: IC FPGA 176 I/O 256FBGA

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Product details

Overview

XCV100E-7FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 196 user I/O pins in a 256-ball Fine-Pitch BGA package, and eight digital Delay-Locked Loops (DLLs) supporting 240 MHz system clocking and 622 Mb/s LVDS data rates. It delivers high-density programmable logic for telecom line cards requiring PCI-compliant 33/66 MHz interfaces and synchronous memory controllers.

For engineers reviewing the XCV100E-7FG256C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, block RAM configuration, DLL timing behavior, and FPGA-specific design considerations for high-speed interface implementation.

Technical Context

The XCV100E-7FG256C implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice, enabling high-speed arithmetic and wide-input logic functions. Its IOBs support 20 I/O standards-including LVDS, LVPECL, SSTL, and HSTL-with VCCO-supplied input buffers and programmable weak-keeper circuits.

Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR applications, and up to 4× frequency multiplication. The device integrates 20 block SelectRAMs (81,920 bits total), each configured as true dual-port 4096-bit RAM with independent port widths, and 38,400 bits of distributed RAM implemented in LUTs.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	32,400 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths
User I/O Pins	196 - supports high-pin-count parallel buses and multi-standard I/O banks with voltage-isolated VCCO domains
Block RAM Bits	81,920 - enables 20 × 4096-bit true dual-port memory blocks for FIFOs, frame buffers, or protocol engines
DLL Count	8 - allows independent clock domain management for multiple high-speed interfaces (e.g., LVDS + PCI + DDR)
Max System Clock	240 MHz - achievable with optimized placement/routing and DLL-assisted clock distribution
I/O Standard Support	20 standards including LVDS (622 Mb/s), LVPECL, SSTL3/2, HSTL I/III/IV - enables direct interfacing to memory, SERDES, and backplane ICs
Process Technology	0.18 μm 6-layer metal CMOS - enables lower power (1.8 V VCCINT) and higher density vs. prior Virtex generation

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermal performance rated for commercial temperature range (0°C to +85°C).

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Dedicated low-skew clock inputs routed to all DLLs and CLBs; require LVPECL/LVDS termination for >300 MHz operation
VCCINT	Core Supply	1.8 V supply for CLBs, RAM, and routing; must be decoupled within 1 cm of each pin per Xilinx layout guidelines
VCCO_0–VCCO_7	I/O Bank Supply	Bank-specific 1.5–3.3 V supplies; each bank's VCCO sets output drive strength and input threshold for all I/Os in that bank
VREF_0–VREF_7	Input Reference Voltage	Required only for SSTL/HSTL/GTL standards; shared across all pins in same bank; must be externally filtered and stable ±1%
TCK/TMS/TDI/TDO	JTAG Boundary Scan	IEEE 1149.1-compliant test interface; used for configuration, debugging, and in-system verification

Key Features

Feature	Design Value
SelectI/O+™ Technology	Supports 20 I/O standards with per-bank VCCO/VREF control-enables mixed-voltage board designs without level shifters
SelectRAM+™ Memory Hierarchy	81,920 bits block RAM + 38,400 bits distributed RAM-provides flexible memory depth/width trade-offs for packet buffering and lookup tables
Digital Delay-Locked Loops (DLLs)	Eight independent DLLs with 4× multiplication and duty-cycle correction-eliminates external clock synthesizers for DDR and source-synchronous interfaces
Configurable Logic Architecture	32,400 logic cells with dedicated carry chains and F5/F6 multiplexers-supports efficient arithmetic, wide muxes, and cascaded logic functions
SRAM-Based Configuration	Unlimited reprogrammability via JTAG, SelectMAP, or master serial mode-enables field updates and design iteration without hardware change

Applications

Telecom Line Card Interface	PCI Express Endpoint Controller
Use Scenario: High-speed data aggregation between framer ASICs and packet processors in OC-48/STM-16 line cards. IC Role / Device Role / Timing Role: FPGA acts as protocol bridge and elastic buffer, synchronizing 622 Mb/s LVDS framer outputs to 133 MHz internal bus using DLL-managed clocks. Use Value: Leverages 196 I/Os and LVDS support to replace discrete level shifters and clock buffers, reducing BOM count by 7 components per interface.	Use Scenario: Add-in card implementing PCIe x1 endpoint with legacy PCI 66 MHz host interface. IC Role / Device Role / Timing Role: FPGA serves as translation layer, converting PCIe TLPs to PCI transaction packets while managing split transactions and address mapping. Use Value: Uses 8 DLLs to independently lock to PCIe 100 MHz REFCLK and PCI 66 MHz clock, eliminating need for separate clock generators.
DDR SDRAM Memory Controller	High-Speed Test Equipment Pattern Generator
Use Scenario: Embedded controller for 200 Mb/s DDR SDRAM in medical imaging subsystem. IC Role / Device Role / Timing Role: FPGA implements full DDR PHY with DQS gating, write leveling, and refresh arbitration using distributed RAM for command queues. Use Value: 81,920-bit block RAM provides 2 KB of true dual-port buffer space for read/write coalescing, improving effective bandwidth by 35% over single-port alternatives.	Use Scenario: Automated test equipment generating 622 Mb/s PRBS patterns for jitter tolerance validation. IC Role / Device Role / Timing Role: FPGA functions as deterministic pattern generator with LVDS outputs, using LUT-based shift registers for high-speed serial data synthesis. Use Value: 4-input LUTs configured as 16-bit shift registers enable 622 Mb/s pattern generation without external serializer ICs.

Telecom Line Card Interface

PCI Express Endpoint Controller

Use Scenario: High-speed data aggregation between framer ASICs and packet processors in OC-48/STM-16 line cards.

IC Role / Device Role / Timing Role: FPGA acts as protocol bridge and elastic buffer, synchronizing 622 Mb/s LVDS framer outputs to 133 MHz internal bus using DLL-managed clocks.

Use Value: Leverages 196 I/Os and LVDS support to replace discrete level shifters and clock buffers, reducing BOM count by 7 components per interface.

Use Scenario: Add-in card implementing PCIe x1 endpoint with legacy PCI 66 MHz host interface.

IC Role / Device Role / Timing Role: FPGA serves as translation layer, converting PCIe TLPs to PCI transaction packets while managing split transactions and address mapping.

Use Value: Uses 8 DLLs to independently lock to PCIe 100 MHz REFCLK and PCI 66 MHz clock, eliminating need for separate clock generators.

DDR SDRAM Memory Controller

High-Speed Test Equipment Pattern Generator

Use Scenario: Embedded controller for 200 Mb/s DDR SDRAM in medical imaging subsystem.

IC Role / Device Role / Timing Role: FPGA implements full DDR PHY with DQS gating, write leveling, and refresh arbitration using distributed RAM for command queues.

Use Value: 81,920-bit block RAM provides 2 KB of true dual-port buffer space for read/write coalescing, improving effective bandwidth by 35% over single-port alternatives.

Use Scenario: Automated test equipment generating 622 Mb/s PRBS patterns for jitter tolerance validation.

IC Role / Device Role / Timing Role: FPGA functions as deterministic pattern generator with LVDS outputs, using LUT-based shift registers for high-speed serial data synthesis.

Use Value: 4-input LUTs configured as 16-bit shift registers enable 622 Mb/s pattern generation without external serializer ICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV100E-6FG256C	Same logic density and I/O count but -6 speed grade: 15% slower max register-to-register delay (5.1 ns vs. 4.3 ns at -7)	Suitable for non-critical timing paths where 240 MHz system clock not required	Select when cost sensitivity outweighs need for worst-case 240 MHz operation
XCV200E-7FG256C	Higher logic density (63,504 cells), same package, 284 user I/Os, and 114,688 block RAM bits	Enables larger protocol stacks or additional SERDES channels within same PCB footprint	Choose when future scalability or increased on-chip memory is required without board redesign

Compared with XCV100E-7FG256C, the -6 variant trades speed for cost in static logic paths, while the XCV200E-7FG256C extends capacity and I/O without changing package-making both viable alternatives depending on whether timing margin or resource headroom is the primary constraint.

Availability

XCV100E-7FG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, and test equipment applications requiring stable component supply and long-term obsolescence management.

Supply support for XCV100E-7FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance programmable logic solutions targeting communications, aerospace, and computing markets.

The Virtex-E product line was engineered to deliver 30% higher speed and 1.8 V core operation versus prior Virtex devices, specifically for applications demanding PCI compliance, LVDS interfacing, and integrated memory controllers.

FAQ

What is the maximum operating frequency of the XCV100E-7FG256C?

The XCV100E-7FG256C achieves up to 240 MHz synchronous system clocking when using DLL-assisted clock distribution and optimized place-and-route. This figure represents worst-case timing across the entire device under commercial temperature conditions and is confirmed in DS022-3 switching characteristics tables for the -7 speed grade.

Does the XCV100E-7FG256C support LVDS I/O at 622 Mb/s?

Yes, the XCV100E-7FG256C supports LVDS I/O at 622 Mb/s as specified in DS022-1 Table 2 and DS022-2 architectural description. This capability requires proper PCB layout with controlled impedance traces, differential pair routing, and termination matching to maintain signal integrity at that data rate.

How many block RAMs does the XCV100E-7FG256C contain?

The XCV100E-7FG256C contains 20 block SelectRAMs totaling 81,920 bits, as documented in DS022-2 Table 4 and Module 1 Table 1. Each block is a true dual-port 4096-bit RAM with independent address and data buses per port, configurable for various depth/width combinations.

Is the XCV100E-7FG256C pin-compatible with other Virtex-E devices in FG256 packaging?

No, the XCV100E-7FG256C is not fully pin-compatible with other Virtex-E devices in FG256 packages. While XCV50E and XCV100E share the FG256 option, their I/O counts differ (176 vs. 196), and pin functions such as VREF and VCCO assignments vary per device size-requiring unique PCB layouts per part number.

What configuration modes does the XCV100E-7FG256C support?

The XCV100E-7FG256C supports master serial, slave serial, SelectMAP, and JTAG configuration modes as described in DS022-1 Module 1 and DS022-2 architectural overview. JTAG is used for boundary scan testing and in-system programming, while SelectMAP enables high-speed parallel configuration from microprocessors or flash memory.

XCV100E-7FG256C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-E

Package/Case:: 256-BGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 600

Number of Logic Elements/Cells:: 2700

Total RAM Bits:: 81920

Number of I/O:: 176

Number of Gates:: 128236

Voltage - Supply:: 1.71V ~ 1.89V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 256-FBGA (17x17)

XCV100E-7FG256C FAQ

1.How can I place an order for XCV100E-7FG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV100E-7FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV100E-7FG256C reliable?

The price and inventory of XCV100E-7FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100E-7FG256C is usually 5 days.

3.What payment methods are accepted for XCV100E-7FG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100E-7FG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV100E-7FG256C?

XCV100E-7FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV100E-7FG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV100E-7FG256C?

For technical support, including XCV100E-7FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100E-7FG256C requirements.

6.How does Aetrix verify that XCV100E-7FG256C is sourced from the original manufacturer or authorized distributors?

All XCV100E-7FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100E-7FG256C meets industry standards.

7.What is the process for return or replacement of XCV100E-7FG256C?

All XCV100E-7FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100E-7FG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV100E-7FG256C part is unused and in its original packaging.

Return procedure for XCV100E-7FG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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