AMD XCV100E-7FG256I

Overview

XCV100E-7FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 176 user I/O pins in a 256-ball Fine-Pitch BGA package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communications infrastructure.

For engineers reviewing the XCV100E-7FG256I datasheet, pinout, applications, or equivalent options, key selection considerations include its -7 speed grade, industrial temperature range (–40°C to +100°C), 1.8 V core voltage, PCI-compliant 3.3 V I/O, and compatibility with Xilinx Foundation™ and Alliance Series™ design tools.

Technical Context

The XCV100E-7FG256I implements a flexible CLB architecture with two slices per block, each containing four 4-input LUTs, dedicated carry logic, and dual flip-flops with independent clock enable, synchronous/asynchronous set/reset. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×.

I/O functionality is organized into eight banks with bank-specific VCCO and VREF requirements; it supports 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, PCI33_3/66_3, LVDS, and LVPECL - all with programmable drive strength, slew rate, and weak-keeper circuits. The device uses a 0.18 μm 6-layer metal CMOS process and is 100% factory tested.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermal-enhanced construction with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV100E-7FG256I, the -8 variant improves timing margin without changing footprint or power profile, while the FG456 variant trades package size and cost for I/O scalability and thermal robustness - both retain full bitstream compatibility within the Virtex-E family.

Availability

XCV100E-7FG256I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and avionics applications requiring stable component supply, long-term lifecycle support, and traceable sourcing of legacy Xilinx Virtex-E devices.

Supply support for XCV100E-7FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-E product line was engineered for high-performance, low-power reconfigurable computing in communications and signal processing systems, leveraging 0.18 μm process technology and advanced clock management to replace ASICs in rapidly evolving protocols.

FAQ

What is the maximum differential I/O pair count supported by XCV100E-7FG256I?

XCV100E-7FG256I supports up to 83 differential I/O pairs (166 pins), as confirmed in Table 1 of DS022-1. This capability enables high-speed source-synchronous interfaces such as LVDS camera links or backplane interconnects without external serializers.

Does XCV100E-7FG256I support PCI-X or only standard PCI?

XCV100E-7FG256I is compliant with 3.3 V, 32/64-bit, 33/66 MHz PCI (PCI Rev 2.2), but does not support PCI-X. Its I/O architecture meets PCI electrical specifications including setup/hold timing and drive strength, verified under industrial temperature conditions.

Can XCV100E-7FG256I be configured via JTAG in-system?

Yes, XCV100E-7FG256I supports IEEE 1149.1 JTAG boundary scan for in-system configuration, debugging, and verification. The TCK/TMS/TDI/TDO pins enable full access to configuration memory and internal logic states without requiring external programming hardware beyond a standard JTAG adapter.

What is the role of the die-temperature sensor diode in XCV100E-7FG256I?

The die-temperature sensor diode in XCV100E-7FG256I provides an analog voltage output proportional to junction temperature, allowing external monitoring circuitry to implement thermal throttling or fan control. It is factory-calibrated and accessible via dedicated analog test pins per DS022-4 pinout tables.

Is XCV100E-7FG256I pin-compatible with other Virtex-E devices in the FG256 package?

XCV100E-7FG256I is pin-compatible with other Virtex-E devices offered in the FG256 package (e.g., XCV50E-7FG256I, XCV200E-7FG256I), subject to I/O banking constraints and VCCO/VREF pin allocation differences. Pinouts are documented in DS022-4 Module 4, confirming mechanical and electrical interoperability within the same package footprint.