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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV100E-7PQ240C

Name: XCV100E-7PQ240C
Brand: AMD
SKU: XCV100E-7PQ240C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV100E-7PQ240C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 240-BFQFP

Datasheet:: XCV100E-7PQ240C.pdf

Description:: IC FPGA 158 I/O 240QFP

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Product details

Overview

XCV100E-7PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 196 user I/O pins in a 240-pin PQFP package. It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops for clock management in high-speed communication and signal processing systems.

For engineers reviewing the XCV100E-7PQ240C datasheet, pinout, applications, or equivalent options, this device is selected for PCI-compliant 33/66-MHz interface design, DDR memory controller implementation, and high-bandwidth source-synchronous data acquisition where deterministic timing, dual-port block RAM, and 1.8 V core voltage are critical.

Technical Context

The XCV100E-7PQ240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and LVDS-with banked VCCO/VREF supply domains, programmable slew rate and drive strength, and IEEE 1149.1 boundary-scan. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	32,400 - determines maximum combinational and sequential logic capacity; enables complex control/state machines and datapaths.
System Gates	128,236 - industry-standard metric for logic density; validates suitability for mid-scale ASIC replacement.
User I/O Pins	196 - fixed count for PQ240 package; supports high-pin-count parallel buses and multi-standard I/O banking.
Block RAM Bits	81,920 - distributed across 20 × 4096-bit true dual-port blocks; enables embedded FIFOs, coefficient storage, and protocol buffers without external memory.
Internal Performance	130 MHz (4-LUT level) - worst-case register-to-register timing; defines maximum synchronous system clock for logic-intensive designs.
DLL Count	8 - fully digital delay-locked loops; allows independent clock domain management for multiple interfaces (e.g., PCI + DDR + LVDS).
Core Voltage (VCCINT)	1.8 V - reduces dynamic power vs. 2.5 V Virtex; requires dedicated low-noise core regulator and careful decoupling.
I/O Standards	20 supported - includes PCI33_3, LVDS, SSTL3, HSTL IV; enables direct interfacing to memory, processors, and serial links without level shifters.

Pinout & Package

PQ240 (Plastic Quad Flat Package) with 240 leads, 0.5 mm pitch, and 32.0 × 32.0 mm body size. Complies with JEDEC MS-026 standard. Thermal pad not present; thermal dissipation relies on PCB copper area and airflow.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Inputs	Dedicated low-skew clock inputs feeding all DLLs and CLBs; required for synchronous system timing integrity.
VCCINT	Core Logic Supply	1.8 V supply for CLBs, RAM, and routing; must be filtered separately from I/O supplies to prevent noise coupling.
VCCO_0–VCCO_7	I/O Bank Power	Eight independent VCCO supplies (one per I/O bank); each sets output voltage and input threshold compatibility for its bank's standards.
VREF_0–VREF_7	Input Reference Voltage	Banked reference inputs for SSTL/HSTL/GTL standards; each bank requires one externally sourced VREF voltage.
TCK/TMS/TDI/TDO	JTAG Boundary-Scan	IEEE 1149.1 test access port; enables in-system programming, configuration verification, and interconnect testing.
INIT_DONE	Configuration Status	Open-drain output indicating successful bitstream loading; used to enable downstream logic after FPGA initialization.

Key Features

Feature	Design Value
True Dual-Port Block RAM	20 × 4096-bit blocks with independent read/write clocks and addresses-enables simultaneous data ingestion and processing in real-time pipelines.
SelectI/O+ Technology	Support for 20 I/O standards including LVDS (622 Mb/s) and LVPECL (300+ MHz clock inputs)-eliminates need for external serializers/deserializers in high-speed links.
Digital DLLs	Eight DLLs with 4× frequency multiplication and duty-cycle correction-provides precise clock deskewing and DDR clock generation without external PLLs.
Configurable LUT RAM	Each 4-input LUT can operate as 16×1-bit synchronous RAM or combine into 16×2/32×1/16×1 dual-port RAM-adds flexible local storage without consuming block RAM resources.
Carry Chain Arithmetic	Dedicated fast-carry logic per CLB slice-delivers sub-5 ns 16-bit adder propagation for DSP and control arithmetic.
SRAM-Based Configuration	Unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode-supports field-upgradable logic and dynamic partial reconfiguration.

Applications

PCI Interface Card	DDR Memory Controller
Use Scenario: A 32-bit, 66-MHz PCI bus interface card for industrial data acquisition, requiring compliance with PCI Local Bus Specification Rev 2.2. IC Role / Device Role / Timing Role: XCV100E-7PQ240C implements the PCI target interface logic, address/data multiplexing, parity generation, and bus arbitration state machine. Use Value: Native 3.3 V PCI compliance, 196 I/Os for full address/data bus, and DLL-controlled setup/hold timing ensure plug-and-play interoperability with host systems without external glue logic.	Use Scenario: Embedded DDR SDRAM controller in a video processing module handling 200 Mb/s burst transfers between FPGA fabric and external memory. IC Role / Device Role / Timing Role: XCV100E-7PQ240C serves as the DDR PHY and command scheduler, managing DQS strobes, write leveling, and read capture using DLL-synchronized I/O. Use Value: LVDS-compatible I/O banks, 8 DLLs for precise DQS-to-clock alignment, and 81,920 block RAM bits for write-posting buffers reduce latency and eliminate external memory controller ICs.
LVDS Camera Link Interface	High-Speed Test Equipment Pattern Generator
Use Scenario: Camera Link base configuration (28-bit parallel, 85 MHz pixel clock) connecting industrial CMOS sensors to frame grabbers. IC Role / Device Role / Timing Role: XCV100E-7PQ240C acts as serializer/deserializer bridge, converting parallel sensor data to LVDS pairs and recovering embedded clock via DLL-based CDR. Use Value: 622 Mb/s LVDS I/O capability, programmable input delay matching, and 196 I/Os support full Base CL (28 data + 3 control + clock) with margin for future expansion.	Use Scenario: Automated test equipment generating synchronized 100+ MHz digital stimulus patterns across 64 channels for ASIC validation. IC Role / Device Role / Timing Role: XCV100E-7PQ240C functions as pattern sequencer and timing engine, driving parallel outputs with sub-nanosecond skew control via DLL-managed global clocks. Use Value: Eight DLLs enable independent channel-group clocking, 32,400 logic cells implement deep pattern memory and state-based sequencing, and 1.8 V core reduces switching noise during high-frequency toggling.

PCI Interface Card

DDR Memory Controller

Use Scenario: A 32-bit, 66-MHz PCI bus interface card for industrial data acquisition, requiring compliance with PCI Local Bus Specification Rev 2.2.

IC Role / Device Role / Timing Role: XCV100E-7PQ240C implements the PCI target interface logic, address/data multiplexing, parity generation, and bus arbitration state machine.

Use Value: Native 3.3 V PCI compliance, 196 I/Os for full address/data bus, and DLL-controlled setup/hold timing ensure plug-and-play interoperability with host systems without external glue logic.

Use Scenario: Embedded DDR SDRAM controller in a video processing module handling 200 Mb/s burst transfers between FPGA fabric and external memory.

IC Role / Device Role / Timing Role: XCV100E-7PQ240C serves as the DDR PHY and command scheduler, managing DQS strobes, write leveling, and read capture using DLL-synchronized I/O.

Use Value: LVDS-compatible I/O banks, 8 DLLs for precise DQS-to-clock alignment, and 81,920 block RAM bits for write-posting buffers reduce latency and eliminate external memory controller ICs.

LVDS Camera Link Interface

High-Speed Test Equipment Pattern Generator

Use Scenario: Camera Link base configuration (28-bit parallel, 85 MHz pixel clock) connecting industrial CMOS sensors to frame grabbers.

IC Role / Device Role / Timing Role: XCV100E-7PQ240C acts as serializer/deserializer bridge, converting parallel sensor data to LVDS pairs and recovering embedded clock via DLL-based CDR.

Use Value: 622 Mb/s LVDS I/O capability, programmable input delay matching, and 196 I/Os support full Base CL (28 data + 3 control + clock) with margin for future expansion.

Use Scenario: Automated test equipment generating synchronized 100+ MHz digital stimulus patterns across 64 channels for ASIC validation.

IC Role / Device Role / Timing Role: XCV100E-7PQ240C functions as pattern sequencer and timing engine, driving parallel outputs with sub-nanosecond skew control via DLL-managed global clocks.

Use Value: Eight DLLs enable independent channel-group clocking, 32,400 logic cells implement deep pattern memory and state-based sequencing, and 1.8 V core reduces switching noise during high-frequency toggling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV100E-6PQ240C	Slower speed grade (-6 vs. -7): 0.3 ns longer TCO, 5 MHz lower max system clock in worst-case paths.	Suitable for non-critical timing margins; lower cost but requires timing closure verification at 125 MHz instead of 130 MHz.	Select when design operates below 120 MHz and cost sensitivity outweighs timing margin requirements.
XCV100E-8PQ240C	Faster speed grade (-8): 0.2 ns shorter TCO, supports 135 MHz internal operation; same power and package.	Enables tighter timing closure in high-fanout or long-path designs; identical pinout and configuration interface.	Choose for designs pushing timing limits or requiring headroom for future firmware upgrades.

Compared with XCV100E-6PQ240C and XCV100E-8PQ240C, the XCV100E-7PQ240C provides the optimal balance of timing margin, power efficiency, and cost for mainstream PCI/DDR/LVDS applications where 130 MHz internal performance is the verified target.

Availability

XCV100E-7PQ240C is available at Aetrix Electronics and suitable for PCI interface cards, DDR memory controllers, LVDS camera link bridges, and high-speed test equipment requiring stable component supply throughout extended production lifecycles.

Supply support for XCV100E-7PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.

The Virtex-E family was engineered for high-speed, high-density system integration in communications infrastructure and industrial computing-delivering 1.8 V core efficiency, advanced I/O flexibility, and deterministic timing without ASIC-level NRE costs.

FAQ

What is the maximum operating junction temperature for the XCV100E-7PQ240C?

The XCV100E-7PQ240C is rated for commercial temperature range (0 °C to +85 °C junction). Its PQ240 package has a thermal resistance (θJA) of 36.5 °C/W under JEDEC JESD51-2 conditions. Proper PCB copper pour and airflow are required to maintain junction temperature within spec at full static/dynamic power dissipation.

Does the XCV100E-7PQ240C support partial reconfiguration?

The XCV100E-7PQ240C does not support hardware-accelerated partial reconfiguration. Its SRAM-based configuration requires full bitstream reload for any logic change. Dynamic functionality updates must use internal state machines or external memory-mapped control registers-not runtime module swapping.

Can the XCV100E-7PQ240C interface directly with 5 V TTL logic?

No. The XCV100E-7PQ240C I/O pins are 3 V tolerant only. Driving or receiving 5 V signals requires external level-shifting circuitry. While some pins tolerate 5 V with a 100 Ω series resistor, this is not guaranteed for sustained operation and violates PCI and LVCMOS specifications.

How many DLLs are available in the XCV100E-7PQ240C and what are their key capabilities?

The XCV100E-7PQ240C integrates eight fully digital Delay-Locked Loops. Each supports clock multiply (up to 4×), divide, phase shift, and 50% duty-cycle correction. They enable zero-delay clock conversion from LVPECL/LVDS inputs to any I/O standard and are essential for DDR source-synchronous timing.

Is the XCV100E-7PQ240C pin-compatible with other Virtex-E devices in the PQ240 package?

Yes. All Virtex-E devices in the PQ240 package-including XCV50E, XCV100E, XCV200E, and XCV300E-are pin-compatible. However, I/O bank assignments, VCCO/VREF pin counts, and dedicated function pin usage (e.g., GCLK, M0/M1/M2) vary by density; PCB design must follow the specific device's pinout table.

XCV100E-7PQ240C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-E

Package/Case:: 240-BFQFP

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 600

Number of Logic Elements/Cells:: 2700

Total RAM Bits:: 81920

Number of I/O:: 158

Number of Gates:: 128236

Voltage - Supply:: 1.71V ~ 1.89V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 240-PQFP (32x32)

XCV100E-7PQ240C FAQ

1.How can I place an order for XCV100E-7PQ240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV100E-7PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV100E-7PQ240C reliable?

The price and inventory of XCV100E-7PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV100E-7PQ240C is usually 5 days.

3.What payment methods are accepted for XCV100E-7PQ240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV100E-7PQ240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV100E-7PQ240C?

XCV100E-7PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV100E-7PQ240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV100E-7PQ240C?

For technical support, including XCV100E-7PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV100E-7PQ240C requirements.

6.How does Aetrix verify that XCV100E-7PQ240C is sourced from the original manufacturer or authorized distributors?

All XCV100E-7PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV100E-7PQ240C meets industry standards.

7.What is the process for return or replacement of XCV100E-7PQ240C?

All XCV100E-7PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV100E-7PQ240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV100E-7PQ240C part is unused and in its original packaging.

Return procedure for XCV100E-7PQ240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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