AMD XCV100E-7PQ240I

Overview

XCV100E-7PQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 196 user I/O pins in a 240-pin PQFP package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface design.

For engineers reviewing the XCV100E-7PQ240I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-power reprogrammable logic solution for PCI-compliant 33/66 MHz systems, source-synchronous data transmission architectures, and DDR memory interfacing requiring deterministic clock management and flexible I/O banking.

Technical Context

The XCV100E-7PQ240I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS-with VCCO-supplied input buffers and programmable drive strength (up to 24 mA source / 48 mA sink). Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control across multiple voltage domains and I/O banks.

Key Specifications

Pinout & Package

The XCV100E-7PQ240I uses a 240-pin Plastic Quad Flat Pack (PQFP) package with 0.5 mm pitch and 32.5 mm × 32.5 mm body size. Pin assignments follow Xilinx DS022-4 Module 4 pinout tables, with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM_B, DONE), JTAG boundary-scan signals (TCK/TMS/TDI/TDO), and grouped I/O banks (Bank 0–7) each requiring shared VCCO and optional VREF.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV100E-6PQ240I, the XCV100E-7PQ240I delivers tighter timing closure for 130 MHz internal logic and 622 Mb/s LVDS links; compared with XCV100E-7HQ240I, it offers identical functionality in a standard PQFP package optimized for cost-sensitive volume production rather than thermal-intensive deployments.

Availability

XCV100E-7PQ240I is available at Aetrix Electronics and suitable for high-speed communication interface design, PCI bus controller development, industrial motion control systems, and automated test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XCV100E-7PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneer in programmable logic technology and was acquired by AMD in 2022. The company developed foundational FPGA architectures and toolchains widely adopted in aerospace, communications, and industrial markets.

The Virtex-E product line was engineered for high-performance, high-density reconfigurable logic in 0.18 μm CMOS, targeting applications demanding advanced clock management, mixed-voltage I/O, and integrated memory hierarchy-especially in telecom infrastructure and test instrumentation.

FAQ

What is the maximum operating junction temperature for the XCV100E-7PQ240I?

The XCV100E-7PQ240I is rated for industrial temperature range operation with a maximum junction temperature of +100 °C. This specification is defined by its "I" suffix and validated across all speed grades and package variants. Thermal design must ensure that under full configuration and switching activity, the die temperature remains within this limit using appropriate PCB copper area, thermal vias, and ambient airflow. The on-die temperature sensor diode supports real-time monitoring in deployed systems.

Does the XCV100E-7PQ240I support IEEE 1149.1 boundary scan?

Yes, the XCV100E-7PQ240I includes full IEEE 1149.1-compliant boundary scan logic integrated into its IOBs. This enables JTAG-based interconnect testing, in-system programming, and debug visibility without requiring additional test circuitry. The TCK, TMS, TDI, and TDO pins are dedicated and electrically isolated from user I/O functions, ensuring reliable test access even when other pins are configured for high-speed differential signaling or mixed-voltage operation.

How many block RAMs does the XCV100E-7PQ240I contain, and what is their configuration flexibility?

The XCV100E-7PQ240I contains 20 block RAMs totaling 81,920 bits, each structured as a 4096-bit true dual-port synchronous memory. These blocks support independent data width configuration per port (e.g., 16×256 and 32×128), built-in bus-width conversion, and direct routing to CLBs or adjacent block RAMs. They are physically arranged in columns aligned with CLB arrays-specifically at columns 0, 12, 18, and 30-enabling efficient memory-intensive datapaths in DSP and packet buffering applications.

Can the XCV100E-7PQ240I interface directly with 200 MHz DDR SDRAM?

Yes, the XCV100E-7PQ240I supports 200 Mb/s DDR SDRAM interfacing through its SelectI/O+™ technology and DLL-based clock management. Its LVCMOS2 and SSTL2 I/O standards, combined with DLL-generated 100 MHz differential clocks and precise output enable timing, meet JEDEC DDR-200 timing requirements. The device's 196 user I/Os allow full 16-bit data bus, address/control lines, and DQS strobe routing with matched trace lengths, while block RAM handles command queueing and write leveling calibration logic.

Is the XCV100E-7PQ240I pin-compatible with other Virtex-E devices in the PQ240 package?

Yes, the XCV100E-7PQ240I shares identical pinout with other Virtex-E devices offered in the PQ240 package-including XCV50E-7PQ240I and XCV200E-7PQ240I-as confirmed in Xilinx DS022-4 Module 4. This enables footprint-compatible migration across density tiers. However, I/O bank voltage assignments, VREF pin usage, and unused pin states (e.g., "No Connect") differ between devices and must be verified per device-specific pinout tables before PCB reuse.