AMD XCV100E-8FG256C

Overview

XCV100E-8FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 176 user I/O pins in a 256-ball Fine-Pitch BGA package, and eight digital Delay-Locked Loops (DLLs) supporting 240 MHz system clocking and 622 Mb/s LVDS I/O - deployed in high-speed communications infrastructure and test equipment requiring reconfigurable logic with PCI-compliant interfaces.

For engineers reviewing the XCV100E-8FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -8 speed grade timing (4.3 ns register-to-register), 1.8 V core supply with 3.3 V I/O tolerance, dual-port block RAM configuration, DLL-based clock management, and compatibility with Xilinx Foundation/Alliance design tools.

Technical Context

The XCV100E-8FG256C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL, with banked VCCO and VREF constraints. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and up to 4× frequency multiplication - all operating at 1.8 V VCCINT with 3 V-tolerant I/O pins.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermally enhanced.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV100E-8FG256C, the -7 variant trades 0.3 ns timing margin for lower cost and power, while the -8HQ240C retains identical speed but improves thermal reliability in convection-limited enclosures - neither is pin-compatible due to differing ball counts and thermal pad layouts.

Availability

XCV100E-8FG256C is available at Aetrix Electronics and suitable for wireless infrastructure, test instrumentation, and industrial control systems requiring stable component supply across long production lifecycles.

Supply support for XCV100E-8FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in high-performance FPGAs, adaptive SoCs, and AI inference acceleration platforms.

The Virtex-E family was designed for high-speed, high-density reconfigurable computing in communications and instrumentation - delivering 1.8 V core efficiency, advanced I/O flexibility, and integrated clock management before mainstream adoption of low-voltage processes.

FAQ

What is the maximum operating junction temperature for XCV100E-8FG256C?

The XCV100E-8FG256C is rated for commercial temperature range (0 °C to +85 °C junction temperature). Its FG256 package uses a thermally enhanced construction to maintain safe thermal margins under full logic utilization at 1.8 V VCCINT and 3.3 V VCCO loads.

Does XCV100E-8FG256C support JTAG boundary scan for in-circuit testing?

Yes, XCV100E-8FG256C includes IEEE 1149.1-compliant boundary scan logic with TCK, TMS, TDI, and TDO pins. This enables full visibility into I/O states and interconnect integrity during manufacturing test and field diagnostics - independent of configuration status.

Can XCV100E-8FG256C interface directly with 5 V TTL logic?

No, XCV100E-8FG256C I/O pins are 3 V tolerant only. Interfacing with 5 V TTL requires external level-shifting circuitry - such as series 100 Ω resistors plus clamping diodes - as specified in DS022-1 Section "I/O Pin Voltage Tolerance".

How many true dual-port block RAMs does XCV100E-8FG256C contain?

XCV100E-8FG256C contains 20 true dual-port block RAMs, each 4096 bits deep, totaling 81,920 bits. Each block supports independent read/write addresses and clocks on both ports - enabling efficient FIFOs, frame buffers, and memory-mapped peripherals without external SRAM.

Is XCV100E-8FG256C pin-compatible with earlier Virtex family devices?

No, XCV100E-8FG256C is not pin-compatible with original Virtex devices. While some packages share ball counts (e.g., FG256), banking rules, VCCO/VREF pin assignments, and DLL routing differ significantly - requiring PCB redesign for migration from Virtex to Virtex-E.