AMD XCV100E-8PQ240C

Overview

XCV100E-8PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 32,400 logic cells, 20 block RAMs (81,920 bits), and 196 user I/O pins in a 240-pin PQFP package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and targets high-speed communication and embedded control applications requiring reconfigurable logic.

For engineers reviewing the XCV100E-8PQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and real-world FPGA integration considerations for PCI-compliant, source-synchronous, and DDR-capable designs.

Technical Context

The XCV100E-8PQ240C implements a regular array of Configurable Logic Blocks (CLBs) with dual-slice architecture, each containing four 4-input LUTs, dedicated carry chains, and edge-triggered flip-flops with independent clock enable and synchronous/asynchronous set/reset. Its IOBs support 20 I/O standards-including LVTTL, SSTL, HSTL, LVDS, and LVPECL-with VCCO- and VREF-dependent banking rules across eight I/O banks.

It integrates eight fully digital DLLs for zero-delay clock conversion, duty-cycle correction for DDR, and frequency multiplication (up to 4×); block RAMs are true dual-port 4096-bit modules configurable for independent data widths per port; distributed RAM is implemented within LUTs as 16×1, 16×2, or 32×1 synchronous RAM or 16-bit shift registers.

Key Specifications

Pinout & Package

PQ240 (Plastic Quad Flat Package) with 240 leads, 0.5 mm pitch, and 34.6 mm × 34.6 mm body size. Pinout conforms to Xilinx DS022-4 Module 4 pin tables for XCV100E in PQ240 package, including dedicated global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary-scan (TCK/TMS/TDI/TDO), and bank-specific VCCO/VREF assignments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV100E-7PQ240C, the XCV100E-8PQ240C delivers guaranteed timing closure at higher frequencies; compared with XCV200E-8PQ240C, it offers lower cost and power for mid-complexity designs where 32K logic cells and 82 Kb block RAM are sufficient.

Availability

XCV100E-8PQ240C is available at Aetrix Electronics and suitable for high-speed communication interface design, PCI bus controller implementation, DDR SDRAM memory controller development, and industrial motion control systems requiring stable component supply over extended production lifecycles.

Supply support for XCV100E-8PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA toolchains for high-performance digital system design.

The Virtex-E family was engineered for high-speed, high-density reconfigurable computing in telecommunications infrastructure, test equipment, and military/aerospace systems-emphasizing I/O flexibility, clock management, and memory hierarchy.

FAQ

What is the maximum differential I/O pair count supported by XCV100E-8PQ240C?

XCV100E-8PQ240C supports up to 83 differential I/O pairs, as confirmed in Table 1 of DS022-1. This capability is enabled by its SelectI/O+ technology and applies specifically to the XCV100E device in PQ240 packaging. Each differential pair requires two adjacent pins within the same I/O bank and shared VCCO supply.

Does XCV100E-8PQ240C support LVPECL clock inputs?

Yes, XCV100E-8PQ240C supports LVPECL clock inputs up to 300+ MHz, as documented in the Features section of DS022-1. These inputs are routed directly to DLLs for zero-delay conversion to internal logic levels, enabling high-frequency clock distribution without external level-shifting circuitry.

How many block RAMs does XCV100E-8PQ240C contain, and what is their configuration capability?

XCV100E-8PQ240C contains 20 block RAMs totaling 81,920 bits. Each block is a true dual-port 4096-bit RAM with independent address, data width, and control signals per port-supporting configurations such as 256×32, 512×16, or 1024×8, as specified in Table 4 of DS022-2.

Is XCV100E-8PQ240C pin-compatible with other Virtex-E devices in the PQ240 package?

XCV100E-8PQ240C shares the same PQ240 pinout with XCV50E and XCV200E in that package, but bank-specific VCCO/VREF assignments and I/O count differ. For example, XCV50E supports only 176 user I/Os in PQ240, while XCV100E supports 196-requiring careful review of pin tables in DS022-4 before substitution.

What is the role of the die-temperature sensor diode in XCV100E-8PQ240C?

The die-temperature sensor diode in XCV100E-8PQ240C provides an analog voltage output proportional to junction temperature, enabling real-time thermal monitoring. It is accessible via dedicated analog pins and used in conjunction with external ADC circuitry for thermal management in high-power-density applications.