AMD XCV150-4BG256C

Overview

XCV150-4BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 180 user I/O pins in a 256-ball BGA package. It integrates four delay-locked loops (DLLs), 4 primary global clock nets, and 49,152 bits of block SelectRAM for high-speed digital signal processing and embedded control applications.

For engineers reviewing the XCV150-4BG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex-1 to later families - all grounded in DS003-1 (v4.0) and DS003-4.

Technical Context

The XCV150-4BG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and dual-port 4k-bit block RAMs configurable across 16 depth/width combinations.

It supports multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV (200 MHz), and SSTL2, with strict I/O banking: eight independent banks requiring shared VCCO per bank and single VREF per bank. All IOBs include programmable pull-ups, weak-keepers, and IEEE 1149.1 boundary-scan logic.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, commercial temperature range (0°C to +85°C). Pinout conforms to DS003-4 Module 4; ball assignments grouped into eight I/O banks with dedicated VCCO and VREF pins per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV150-4BG256C, XCV200-4BG256C offers gate scalability within identical packaging and thermal envelope, while XCV150-5BG256C delivers higher performance without architectural or layout changes - both preserve toolchain compatibility and JTAG debug infrastructure.

Availability

XCV150-4BG256C is available at Aetrix Electronics and suitable for industrial motion control, communications backplane interface, and medical imaging data acquisition requiring stable component supply despite end-of-life status.

Supply support for XCV150-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex family was designed for high-speed, high-density logic replacement in telecommunications infrastructure, aerospace avionics, and industrial automation - emphasizing clock management, I/O flexibility, and SRAM configurability.

FAQ

What is the maximum operating frequency of the XCV150-4BG256C?

The XCV150-4BG256C achieves up to 200 MHz system clock performance with DLL compensation and HSTL Class IV I/O. Worst-case register-to-register timing is 5.0 ns per DS003-1 Table 2. Actual frequency depends on design placement, routing, and I/O standard selection - LVTTL at 180 MHz and HSTL Class IV at 200 MHz are guaranteed under commercial conditions.

Does the XCV150-4BG256C support hot-swap operation?

Yes, the XCV150-4BG256C is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure, power sequencing tolerance, and configuration robustness meet PICMG 2.1 requirements. The device retains configuration state during brief power interruptions and resumes operation without reprogramming upon stable power restoration.

How many block RAMs does the XCV150-4BG256C contain?

The XCV150-4BG256C contains twelve 4,096-bit block SelectRAMs totaling 49,152 bits. Each block is fully synchronous dual-ported with independent address/data/control per port and supports depth/width configurations from 1×4096 to 16×256. These are physically arranged in two columns along the vertical edges of the die.

What I/O standards are supported by the XCV150-4BG256C?

The XCV150-4BG256C supports 16 SelectIO™ standards including LVTTL (5 V tolerant), LVCMOS2, PCI 3.3 V, HSTL Class I/III/IV, SSTL2/SSTL3, GTL/GTL+, and CTT. Support requires correct VCCO and VREF assignment per I/O bank - for example, HSTL Class IV requires 1.5 V VCCO and 0.9 V VREF in the same bank.

Is the XCV150-4BG256C still in production?

No, the XCV150-4BG256C is obsolete per DS003-1 (v4.0) March 2013 revision and XCN10016 notice. Xilinx discontinued manufacturing and no new wafers are being produced. Aetrix Electronics supplies remaining factory-new inventory with full traceability and extended lifecycle support for legacy system maintenance.