AMD XCV150-4BG352C

Overview

XCV150-4BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block RAM and LUTs configurable as RAM/shift register), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV150-4BG352C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and CLB-level timing parameters - all confirmed for the exact XCV150-4BG352C speed grade -4, commercial temperature range (0°C to +85°C), and BG352 package.

Technical Context

The XCV150-4BG352C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–6 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight independent banks, each requiring shared VCCO and (where applicable) a single VREF voltage. The device supports 16 SelectIO™ standards including LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL2/3, GTL+, and PCI 3.3 V - with strict bank-level voltage isolation enforced by its physical pinout and internal interconnect.

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 27 mm × 27 mm, 1.27 mm pitch, commercial temperature range (0°C to +85°C). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4, with eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), and dual-purpose configuration pins (INIT, PROGRAM, CCLK, DIN, DONE).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV150-4BG352C, the XCV150-5BG352C offers tighter timing margins without layout change, while the XCV200-4BG352C provides additional logic and I/O headroom - both retain identical configuration modes, SelectIO™ support, and DLL architecture, making them viable alternatives for timing-critical or resource-constrained upgrades.

Availability

XCV150-4BG352C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, telecom line card interfaces, and industrial motion controllers requiring stable component supply through extended product lifecycles.

Supply support for XCV150-4BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family - including XCV150-4BG352C - was engineered for high-performance, high-capacity logic replacement in demanding applications such as wired/wireless infrastructure, test equipment, and industrial automation, emphasizing place-and-route efficiency and silicon utilization.

FAQ

What is the maximum operating frequency supported by XCV150-4BG352C?

XCV150-4BG352C supports a maximum synchronous system clock rate of 200 MHz, including I/O timing, as validated for the -4 speed grade under commercial temperature conditions (0°C to +85°C). This figure is derived from worst-case timing analysis in DS003-1 Table 2 and applies to register-to-register paths with proper placement and routing; actual achievable frequency depends on design topology and I/O standard selection.

Does XCV150-4BG352C support hot-swap operation in Compact PCI systems?

Yes, XCV150-4BG352C supports hot-swappable operation in Compact PCI systems per its documented feature set. It includes IEEE 1149.1 boundary-scan logic, programmable weak-keeper circuits to maintain I/O states during insertion/removal, and I/O structures compliant with Compact PCI mechanical and electrical hot-swap specifications - all confirmed in DS003-1 Module 1 Features section.

How many block RAMs does XCV150-4BG352C contain, and what are their configurations?

XCV150-4BG352C contains twelve 4,096-bit block SelectRAMs totaling 49,152 bits. Each block is a fully synchronous dual-ported RAM with independent read/write controls, supporting configurable port widths (1–16 bits) and depths (256–4096) as defined in DS003-2 Table 4 - enabling flexible FIFO, buffer, and lookup table implementations without consuming CLB resources.

What I/O standards are supported by XCV150-4BG352C, and how are they grouped?

XCV150-4BG352C supports 16 SelectIO™ standards including LVTTL (5 V tolerant), HSTL Class I/III/IV, SSTL2/I/II, GTL+, and PCI 3.3 V. These are grouped into eight electrically isolated I/O banks (Bank 0–7), where each bank requires a common VCCO voltage and - for standards requiring it - a single shared VREF voltage, as specified in DS003-2 I/O Banking section.

Is XCV150-4BG352C still in active production, and what is its obsolescence status?

XCV150-4BG352C is listed as obsolete/under obsolescence per DS003-1 (v4.0) March 2013 revision history, with final status noted in XCN10016. However, Aetrix Electronics maintains legacy supply channels for this device, offering traceable, tested inventory with full documentation and lifecycle coordination support for ongoing industrial and aerospace programs.