AMD XCV150-4BG352I

Overview

XCV150-4BG352I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV150-4BG352I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and industrial-temperature (-40°C to +100°C) operation guidance - all critical for legacy system sustainment, reconfiguration planning, and obsolescence-mitigated board-level redesign.

Technical Context

The XCV150-4BG352I implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaRing I/O ring, and dedicated horizontal bus lines per CLB row. Its CLBs contain two slices each with four 4-input LUTs, carry chains, and dual flip-flops per slice, enabling synchronous arithmetic and wide-input logic functions.

It supports eight I/O banks with independent VCCO and VREF supply domains, allowing mixed-voltage signaling standards (e.g., LVTTL, HSTL Class IV, SSTL2) within bank-compatible groups. Each IOB includes programmable input delay, weak-keeper, and IEEE 1149.1 boundary-scan logic - essential for testability in high-reliability industrial systems.

Key Specifications

Pinout & Package

The XCV150-4BG352I is housed in a 352-ball fine-pitch ball grid array (BG352) package with 260 user I/O pins distributed across eight I/O banks. Power and ground balls are arranged per bank to minimize switching noise; dedicated global clock inputs (GCLK0–GCLK3) and configuration pins (INIT, PROGRAM, CCLK, DIN, DONE) occupy fixed positions per DS003-4 Pinout Tables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV150-4BG352I, the -5 variant offers tighter timing margins for demanding clock domains, while the XCV200-4BG352I provides headroom for logic growth - both retain identical thermal profile, I/O banking structure, and configuration interface, simplifying qualification in sustained-production programs.

Availability

XCV150-4BG352I is available at Aetrix Electronics and suitable for industrial motion control, avionics sensor interfacing, medical imaging data aggregation, and PCI bridge controller applications requiring stable component supply amid long product lifecycles.

Supply support for XCV150-4BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family to deliver high-density, high-performance reconfigurable logic for telecommunications, aerospace, and industrial systems.

The Virtex family was designed to replace mask-programmed gate arrays with field-upgradable, high-speed logic solutions - emphasizing place-and-route efficiency, clock management, and mixed-signal I/O flexibility for complex system-on-chip integration.

FAQ

Is XCV150-4BG352I still in production or supported by Xilinx?

No - XCV150-4BG352I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Xilinx discontinued the Virtex family in favor of Spartan and Virtex-II successors. Aetrix Electronics maintains legacy inventory with full traceability and offers engineering support for sustaining existing designs that rely on XCV150-4BG352I.

What configuration modes does XCV150-4BG352I support?

XCV150-4BG352I supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial, SelectMAP (8-bit parallel slave mode), and JTAG (boundary-scan programming). All modes use the same dedicated pins (DIN, CCLK, INIT, PROGRAM, DONE), with mode selected via MODE pins during power-up.

Can XCV150-4BG352I interface with 3.3 V LVTTL and 1.5 V HSTL devices simultaneously?

Yes - XCV150-4BG352I supports concurrent LVTTL (3.3 V) and HSTL Class I/III/IV (1.5 V) signaling, but only in separate I/O banks. Each bank requires its own VCCO and VREF; mixing incompatible standards within one bank violates I/O banking rules and risks damage or timing failure.

What is the maximum operating frequency of internal logic in XCV150-4BG352I?

XCV150-4BG352I achieves up to 200 MHz system clock rates for synchronous logic, including I/O paths. Worst-case register-to-register delay is 5.0 ns at speed grade -4, corresponding to 200 MHz theoretical maximum; actual achievable frequency depends on design complexity, placement, and routing congestion.

Does XCV150-4BG352I include on-chip temperature sensing?

Yes - XCV150-4BG352I integrates a die-temperature sensor diode, enabling real-time junction temperature monitoring via external circuitry. This feature supports thermal throttling and reliability validation in industrial and avionics applications where ambient conditions exceed commercial limits.