AMD XCV150-4FG256C

Overview

XCV150-4FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 maximum user I/O pins in a 256-ball fine-pitch BGA (FG256) package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM), and supports 66-MHz PCI-compliant interfaces - deployed in high-speed industrial control and communications infrastructure.

For engineers reviewing the XCV150-4FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -4 speed grade (200 MHz system performance), FG256 package compatibility with compact PCB layouts, dual-port block RAM configuration flexibility, and multi-standard SelectIO™ support for LVTTL, HSTL, SSTL, and PCI I/O standards.

Technical Context

The XCV150-4FG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input logic, and LUTs configurable as 16-bit RAM, shift registers, or dual-ported RAM.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. I/O banking enforces VCCO and VREF voltage grouping across eight banks, enabling mixed-voltage signaling within defined constraints.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256), 256-ball, 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV150-4FG256C, the XCV150-5FG256C offers tighter timing margins at identical density and footprint, while the XCV200-4FG256C provides 44% more logic cells in the same package - making the former ideal for timing-critical refinements and the latter for functional growth without layout change.

Availability

XCV150-4FG256C is available at Aetrix Electronics and suitable for industrial motion control, telecom line card development, and PCI-based data acquisition requiring stable component supply throughout extended production cycles.

Supply support for XCV150-4FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures used across aerospace, communications, and industrial markets.

The Virtex family - including XCV150-4FG256C - was engineered for high-performance, high-density system-on-chip integration, targeting applications demanding advanced clock management, multi-standard I/O, and large on-chip memory resources.

FAQ

What is the operating voltage requirement for XCV150-4FG256C?

XCV150-4FG256C requires a 2.5 V ± 3% core supply (VCCINT) and bank-specific I/O supplies (VCCO) ranging from 1.5 V to 3.3 V depending on selected I/O standard. Each I/O bank must use a single VCCO voltage, and VREF must be supplied for SSTL/HSTL inputs. The device does not support 5 V-tolerant I/O except for LVTTL, LVCMOS2, and PCI 5 V modes.

Is XCV150-4FG256C still in production?

No - XCV150-4FG256C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains legacy inventory and supports obsolescence management, including cross-reference guidance and long-term supply planning for installed base systems.

How many block RAMs does XCV150-4FG256C contain?

XCV150-4FG256C contains 12 block SelectRAM units totaling 49,152 bits of memory. Each block is a fully synchronous, dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096), supporting true simultaneous read/write operations for buffer and lookup table applications.

Can XCV150-4FG256C support DDR SDRAM interfaces?

Yes - XCV150-4FG256C supports DDR SDRAM through SSTL2 Class I/II I/O standards (1.25 V VCCO, 1.25 V VREF) and precise clock management via its four DLLs. Its 260-user I/O count accommodates full 16-bit DDR data bus, address/control lines, and differential clocks, though external termination and careful PCB layout are required for signal integrity.

What configuration modes does XCV150-4FG256C support?

XCV150-4FG256C supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial, SelectMAP™ (parallel programming via CPU bus), and JTAG (boundary-scan programming and debugging). All modes use SRAM-based configuration, enabling unlimited reprogramming and dynamic partial reconfiguration in supported toolflows.