AMD XCV150-4FG256I
- Part No.:
- XCV150-4FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XCV150-4FG256I.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,193
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Product details
Overview
XCV150-4FG256I from AMD is an FPGA orderable option positioned for board-level digital integration, configurable control, and subsystem interface concentration. The combination of the Virtex architecture and the Tray package used by this orderable option makes it suitable when the application must retain a proven AMD/Xilinx programmable logic footprint while still keeping the design updateable across maintenance or production revisions.
Original Virtex devices provide older high-performance FPGA integration for legacy communications, embedded digital systems, and board-level programmable logic designs that still depend on established Xilinx high-density footprints. For engineers reviewing the XCV150-4FG256I datasheet, XCV150-4FG256I pinout, XCV150-4FG256I application, or XCV150-4FG256I equivalent, this device is widely used in embedded control hardware, communications boards, industrial subsystems, programmable interface engines, and sustaining-production digital platforms.
Technical Context
In real hardware, XCV150-4FG256I is used as a programmable logic platform rather than a fixed-function controller. The selected Virtex density and speed grade 4 orderable option. matter because logic capacity, I/O concentration, and escape routing all influence whether the device can absorb the intended subsystem workload.
The exact orderable code is important here: Tray affects PCB footprint compatibility and escape routing, speed grade 4 orderable option. affects timing margin, and the industrial temperature option indicated by the suffix. defines whether the device stays aligned with the deployment environment or qualification target.
Virtex density point for sustaining-production programmable logic and high-I/O legacy board integration. In practice, this means XCV150-4FG256I is chosen when the board must preserve a known programmable logic footprint while keeping interface adaptation, digital control, and subsystem-specific logic inside one FPGA device.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Device Type | Virtex FPGA. |
| Series | Virtex |
| Package | Tray package with unspecified packing. |
| Speed Grade | Speed grade 4 orderable option. |
| Operating Range | Industrial temperature option indicated by the suffix. |
| Architecture Role | Field-programmable logic device for configurable digital control, interface adaptation, and subsystem integration. |
| Integration Focus | Used where board-specific programmable logic, timing behavior, and interface glue functions need to be consolidated. |
| Programming Model | Configuration-based FPGA platform within the referenced AMD/Xilinx family. |
Pinout & Package
The XCV150-4FG256I pinout includes configurable user I/O, supply rails, configuration resources, and package-specific escape pins within Tray package.
For PCB work, the main concerns are footprint continuity, power integrity, configuration access, and preserving routing around subsystem interfaces and timing-critical digital nets.
| Pin / Function | PCB Design and Circuit Role |
|---|---|
| User I/O Pins | Configurable pins used for subsystem interfaces, address/data paths, timing signals, and board-specific digital connectivity. |
| Clock / Timing Pins | Support synchronous logic behavior and clock distribution within the programmable fabric. |
| Configuration / JTAG Pins | Support device programming, configuration control, and board-level debug or bring-up access. |
| Power Rails | Support the core and I/O voltage domains required by the selected FPGA family. |
| Ground Pins | Provide the return paths needed for stable digital switching and noise control. |
Key Features
- Configurable FPGA fabric supports board-specific logic, control, and interface integration.
- Package options help preserve established PCB footprints and routing strategies.
- Orderable speed grades help align the device with validated board timing margins.
- Suitable for sustaining-production digital control and interface-consolidation functions.
- Supports long-life hardware programs that depend on programmable logic flexibility.
- Field-programmable behavior preserves updateability across maintenance revisions.
Applications
| Embedded Digital Control | Interface Concentration |
|---|---|
|
Use Scenario: Used where one FPGA centralizes timing, state-machine, and control behavior on the board. IC Role: Acts as the configurable digital control layer. Use Value: Keeps board-specific logic updateable without redesigning multiple fixed-function ICs. |
Use Scenario: Used to absorb multiple board-level interfaces or protocol adaptation tasks inside one programmable device. IC Role: Centralizes interface translation and digital routing. Use Value: Reduces discrete logic count and preserves a cleaner subsystem partition. |
| Industrial or Communications Boards | Programmable Subsystem Integration |
|
Use Scenario: Used in long-life boards that still rely on FPGA-based control, routing, or glue logic. IC Role: Implements board-specific digital behavior and subsystem integration. Use Value: Supports sustaining-production maintenance without a full architecture change. |
Use Scenario: Used when a design must keep logic concentrated in one FPGA while preserving a known package and timing profile. IC Role: Provides the programmable core for subsystem-specific digital functions. Use Value: Improves lifecycle continuity and board-compatibility planning. |
Equivalent & Alternatives
When evaluating a XCV150-4FG256I equivalent, engineers should compare family generation, package footprint, speed grade, operating range, and whether the replacement preserves subsystem compatibility.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV150-4BG256C | Closely related orderable option in the same or adjacent family density with a different package, speed, or qualification emphasis. | Used when the board stays in the same general FPGA family but requires a different orderable fit. | Compare package, speed grade, suffix, and validated system margins before substitution. |
| XCV100E-7FG256C | Alternative programmable logic option that can serve a similar board-level role with a different density or family emphasis. | Used in comparable embedded, industrial, or communications applications when the design tradeoff shifts. | Choose according to footprint compatibility, logic capacity, and platform continuity. |
Compared with XCV150-4BG256C, XCV150-4FG256I selection depends on exact package, speed grade, suffix, and board-compatibility fit. XCV150-4FG256I vs XCV100E-7FG256C selection depends on whether the design should remain in the same FPGA path or shift to another density with different integration tradeoffs.
Quality
XCV150-4FG256I should be sourced as original AMD/Xilinx programmable logic inventory through traceable supply channels. Quality checks may include package inspection, top-mark validation, configuration access checks, and board-level bring-up verification.
Production validation should include power-sequencing review, configuration reliability, timing-margin confirmation, and signal-integrity checks around programmable I/O paths.
Availability
XCV150-4FG256I is suitable for programmable subsystem integration, board-level digital control, and interface functions in embedded, industrial, and communications hardware.
Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.
For production builds, confirming package option, speed grade, operating-range suffix, lifecycle status, and sourcing continuity helps reduce procurement risk for programmable logic families.
Manufacturer
AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.
Original Virtex devices provide older high-performance FPGA integration for legacy communications, embedded digital systems, and board-level programmable logic designs that still depend on established Xilinx high-density footprints. Virtex density point for sustaining-production programmable logic and high-I/O legacy board integration.
FAQ
What is XCV150-4FG256I used for?
XCV150-4FG256I is used for configurable digital control, interface concentration, and board-level subsystem integration in FPGA-based hardware.
Where can I find the XCV150-4FG256I datasheet download?
The XCV150-4FG256I datasheet can be accessed from the confirmed family source used for this completion pass.
What should be considered in XCV150-4FG256I pinout design?
Designers should account for power domains, configuration access, package-driven routing, and how programmable I/O maps to board interfaces.
Is XCV150-4FG256I a modern FPGA?
It belongs to a defined AMD/Xilinx programmable logic line with board-level configurable logic resources.
What are common XCV150-4FG256I equivalent solutions?
Common candidates include XCV150-4BG256C and XCV100E-7FG256C depending on package, family architecture, logic density, and system-level compatibility needs.
XCV150-4FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 864
- Number of Logic Elements/Cells:
- 3888
- Total RAM Bits:
- 49152
- Number of I/O:
- 176
- Number of Gates:
- 164674
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XCV150-4FG256I FAQ
1.How can I place an order for XCV150-4FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV150-4FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV150-4FG256I reliable?
The price and inventory of XCV150-4FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV150-4FG256I is usually 5 days.
3.What payment methods are accepted for XCV150-4FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV150-4FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV150-4FG256I?
XCV150-4FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV150-4FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV150-4FG256I?
For technical support, including XCV150-4FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV150-4FG256I requirements.
6.How does Aetrix verify that XCV150-4FG256I is sourced from the original manufacturer or authorized distributors?
All XCV150-4FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV150-4FG256I meets industry standards.
7.What is the process for return or replacement of XCV150-4FG256I?
All XCV150-4FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCV150-4FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV150-4FG256I part is unused and in its original packaging.
Return procedure for XCV150-4FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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