AMD XCV150-4FG256I

Overview

XCV150-4FG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 256-ball fine-pitch BGA (FG256) package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM), and supports 66-MHz PCI compliance for high-speed interface applications in industrial control and communications infrastructure.

For engineers reviewing the XCV150-4FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex-1 generation devices.

Technical Context

The XCV150-4FG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers, plus dedicated carry chains for arithmetic acceleration.

I/O functionality is organized into eight banks supporting 16 SelectIO™ standards-including LVTTL, HSTL Class IV, SSTL2/3, and GTL+-with per-bank VCCO and VREF requirements. Each IOB includes three storage elements (DFF/latch), programmable slew rate, drive strength up to 24 mA source / 48 mA sink, and IEEE 1149.1 boundary-scan logic.

Key Specifications

Pinout & Package

Package: FG256 - 256-ball fine-pitch ball grid array (1.0 mm pitch), 27×27 mm body size, designed for industrial temperature operation (–40°C to +100°C). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4, with eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), and JTAG boundary-scan interface (TCK, TMS, TDI, TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV150-4FG256I, the XCV150-5FG256I offers tighter timing margins without altering logic or I/O allocation, while the XCV200-4FG256I provides headroom for feature expansion within the same footprint - both preserve FG256 mechanical compatibility and industrial temperature rating.

Availability

XCV150-4FG256I is available at Aetrix Electronics and suitable for industrial motion control, PCI-compliant instrumentation, and legacy protocol emulation requiring stable component supply throughout extended product lifecycles.

Supply support for XCV150-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex family was engineered for demanding applications requiring high logic density, multi-standard I/O, and deterministic timing - targeting communications infrastructure, industrial automation, and aerospace systems where flexibility and performance are critical.

FAQ

Is XCV150-4FG256I still in production or considered obsolete?

XCV150-4FG256I is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and is no longer manufactured. However, Aetrix Electronics maintains legacy inventory with full traceability and supports continued use in maintenance, repair, and obsolescence mitigation programs for industrial and defense applications.

What are the key differences between XCV150-4FG256I and XCV150-4BG256I?

XCV150-4FG256I uses a fine-pitch BGA (FG256) package with 1.0 mm ball pitch and 27×27 mm body, while XCV150-4BG256I uses a standard ball grid array (BG256) with 1.27 mm pitch and 27×27 mm body. The FG256 variant supports higher I/O density and improved thermal performance but requires tighter PCB fabrication tolerances.

Does XCV150-4FG256I support 5 V tolerant I/O?

Yes, XCV150-4FG256I supports 5 V tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, implemented via internal Zener-like clamping structures. Output drivers are not 5 V tolerant; VCCO must be set to 3.3 V for those standards, and 5 V signaling is input-only.

Can XCV150-4FG256I be configured via JTAG in-system?

Yes, XCV150-4FG256I supports IEEE 1149.1 JTAG configuration in slave serial mode, enabling in-system programming, boundary-scan testing, and debug without requiring external PROM or configuration controllers - ideal for field updates and validation.

What is the maximum operating junction temperature for XCV150-4FG256I?

The XCV150-4FG256I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This is confirmed by the "I" suffix in the part number and validated in DS003-3 (DC and Switching Characteristics, Module 3).