AMD XCV150-4FG456C

Overview

XCV150-4FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It integrates four delay-locked loops (DLLs), dual-ported 4k-bit block RAMs, and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV150-4FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include its -4 speed grade (200 MHz system performance), 2.5 V core voltage, FG456 package thermal and routing constraints, and compatibility with SelectIO™ standards including LVTTL, SSTL2, and HSTL Class IV.

Technical Context

The XCV150-4FG456C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain four logic cells each, with dedicated carry chains and F5/F6 multiplexers enabling up to 19-input logic functions.

Each IOB supports programmable input/output flip-flops with independent clock enable, synchronous/asynchronous set/reset, and configurable polarity. The device features eight I/O banks with bank-specific VCCO and VREF requirements, supporting mixed-voltage signaling within and across banks per Table 2 of DS003-2.

Key Specifications

Pinout & Package

The XCV150-4FG456C is housed in a 456-ball Fine-pitch Ball Grid Array (FG456) package with 260 user I/O pins distributed across eight I/O banks. Each bank supports independent VCCO and shared VREF, enforcing strict voltage domain partitioning for mixed-signaling designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV150-4FG456C, the XCV200-4FG456C offers greater logic capacity without changing PCB layout, while the XCV150-5FG456C delivers improved timing margin within identical resource constraints-both serve as direct migration paths rather than drop-in replacements.

Availability

XCV150-4FG456C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure equipment, and high-speed test instrumentation requiring stable component supply throughout extended product lifecycles.

Supply support for XCV150-4FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, adaptive SoC, and ACAP solutions for aerospace, defense, communications, and industrial markets.

The Virtex family-including XCV150-4FG456C-was engineered for high-performance, high-density system integration, targeting applications demanding advanced clock management, multi-standard I/O, and embedded memory scalability.

FAQ

What is the maximum operating frequency supported by the XCV150-4FG456C?

The XCV150-4FG456C has a -4 speed grade, guaranteeing synchronous system clock operation up to 200 MHz, including I/O timing closure under worst-case conditions. This rating is validated across temperature and voltage corners per DS003-3. Actual achievable frequency depends on design topology, placement, and routing; representative circuits like register-to-register paths achieve 5.0 ns propagation delay. The XCV150-4FG456C's four DLLs and low-skew clock networks enable reliable high-speed timing convergence.

Does the XCV150-4FG456C support hot-swap functionality?

Yes, the XCV150-4FG456C supports hot-swapping for Compact PCI applications as specified in DS003-1. Its I/O architecture includes robust electrostatic discharge (ESD) protection and over-voltage transient tolerance, with dedicated clamp diodes for 3.3 V PCI compliance. The device's configuration logic and power sequencing allow safe insertion/removal while the backplane remains powered. Implementation requires adherence to Compact PCI mechanical and electrical hot-swap specifications, including controlled power ramp rates and status signaling via the XCV150-4FG456C's DONE and INIT_B pins.

How many block RAMs does the XCV150-4FG456C contain, and what are their configurations?

The XCV150-4FG456C contains 12 block SelectRAM memory units totaling 49,152 bits, as confirmed in Table 3 of DS003-2. Each block is a fully synchronous dual-ported 4,096-bit RAM with independent address, data, and control buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible bus-width conversion and simultaneous read/write operations. These blocks are arranged in two vertical columns along the chip edges and connect directly to CLBs and other block RAMs via dedicated routing resources.

What I/O standards are supported by the XCV150-4FG456C, and how are they managed across banks?

The XCV150-4FG456C supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V, SSTL2, SSTL3, HSTL Classes I/III/IV, GTL, GTL+, and CTT. I/O standards are managed across eight physically separated I/O banks, each requiring a common VCCO voltage and optionally a shared VREF. Compatible standards per bank are defined by VCCO level: e.g., 2.5 V banks support SSTL2 and LVCMOS2, while 1.5 V banks support HSTL. Mixing incompatible standards within one bank violates voltage domain rules and risks functional failure. Pinout tables in DS003-4 specify exact bank assignments for XCV150-4FG456C.

Is the XCV150-4FG456C still in active production, and what is its obsolescence status?

The XCV150-4FG456C is listed as obsolete/under obsolescence per DS003-1 (v4.0) dated March 1, 2013, and referenced in Xilinx Notice XCN10016. While no longer manufactured, Aetrix Electronics maintains legacy inventory and supports long-term supply through traceable, tested stock. Engineering change notifications, last-time-buy windows, and cross-reference guidance for migration paths (e.g., to Spartan-6 or Artix-7 families) are available upon request. Customers should verify current status via official AMD/Xilinx product change notices before initiating new designs.