AMD XCV150-4FG456I

Overview

XCV150-4FG456I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells, and 260 user I/O pins in a 456-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block RAM and LUT-based RAM/shift register modes), and supports PCI 66 MHz, hot-swap Compact PCI, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, SSTL2/3, HSTL, and GTL/GTL+.

For engineers reviewing the XCV150-4FG456I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB structure, DLL jitter specs, DC switching characteristics, and industrial-temperature (-40°C to +100°C) operation - all critical for legacy rework, obsolescence mitigation, and high-reliability FPGA-based control systems.

Technical Context

The XCV150-4FG456I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and configurable storage elements supporting synchronous/asynchronous set/reset.

I/O functionality is organized into eight independent banks, each requiring shared VCCO and a single VREF voltage; compatible output standards per bank are strictly constrained (e.g., 3.3 V banks support LVTTL/PCI/SSTL3, but not HSTL). The device uses a 0.22 μm 5-layer metal CMOS process and supports JTAG, slave serial, SelectMAP™, and master serial configuration modes.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG456) with 456 solder balls, 1.0 mm pitch, and 260 user I/O pins distributed across eight I/O banks. Thermal pad exposed on underside for enhanced heat dissipation in industrial environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV150-4FG456I, the -5 variant improves worst-case timing margin without changing logic resources or I/O count, while the XCV200-4FG456I retains identical packaging and speed but adds gate count, RAM, and I/O - making it a scalable upgrade path rather than a drop-in replacement.

Availability

XCV150-4FG456I is available at Aetrix Electronics and suitable for industrial motion control, telecom line card development, medical imaging subsystems, and military data acquisition requiring stable component supply amid obsolescence management.

Supply support for XCV150-4FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and developed the Virtex family to deliver high-performance, high-capacity programmable logic for demanding system-level applications.

The Virtex family was designed specifically for applications requiring high-speed signal processing, multi-standard I/O interfacing, and deterministic timing - targeting industrial automation, wired/wireless infrastructure, and defense electronics where ASIC flexibility and time-to-market advantages are critical.

FAQ

Is XCV150-4FG456I still in production or considered obsolete?

XCV150-4FG456I is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with no new manufacturing. However, Aetrix Electronics maintains traceable, tested inventory from authorized legacy channels and supports lifetime buy programs for industrial and defense customers needing long-term supply continuity.

What configuration modes does XCV150-4FG456I support?

XCV150-4FG456I supports four configuration modes: master serial (reads bitstream from external PROM), slave serial (bitstream loaded via DIN/CCLK), SelectMAP™ (parallel 8-/16-bit loading), and JTAG (boundary scan programming). All modes are fully documented in DS003-4 Pinout Tables and require correct INIT/BPI/PROGRAM pin sequencing.

Can XCV150-4FG456I interface directly with 3.3 V PCI slots?

Yes - XCV150-4FG456I is 66-MHz PCI compliant and supports 3.3 V PCI signaling with proper I/O bank configuration (VCCO = 3.3 V, LVTTL or PCI I/O standard selected). It meets PCI electrical specifications including skew, drive strength, and hot-swap requirements when used with appropriate external termination.

Does XCV150-4FG456I include on-die temperature sensing?

Yes - XCV150-4FG456I integrates a calibrated die-temperature sensor diode, accessible via dedicated analog monitoring pins. This enables real-time thermal management in industrial enclosures; readings require external ADC and calibration per DS003-3 DC Characteristics module.

What is the maximum clock frequency achievable on XCV150-4FG456I's DLL outputs?

The DLLs in XCV150-4FG456I support output frequencies up to 200 MHz under worst-case industrial conditions (-40°C to +100°C, VCCINT = 2.5 V ±3%). Measured jitter is specified in DS003-3 as ≤ ±150 ps peak-to-peak for 100 MHz output; higher frequencies require careful PCB layout and power integrity design.